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IBM, Coventor use virtual fabrication at 22nm

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December 15th 2016

BEOL Barricades: Navigating Future Yield, Reliability and Cost Challenges

By: David Fried, Ph.D., Chief Technology Officer, Semiconductor Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. We asked our...

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