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October 18th 2017

Reducing BEOL Parasitic Capacitance using Air Gaps

By: Michael Hargrove, SP&I Engineer Reducing back-end-of-line (BEOL) interconnect parasitic capacitance remains a focus for advanced technology node development. Porous low-k dielectric materials have been used to achieve reduced capacitance, however, these materials remain fragile and prone to reliability concerns....

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