DTIP 2015 – Montpellier – France, 27 – 30 April 2015
DTIP is a symposium including two main Conferences: the CAD, Design and Test Conference devoted to the development of Computer-Aided Design (CAD) tools and design methodologies for MEMS and MOEMS, and the Microfabrication, Integration and Packaging Conference dedicated to the development of integration technologies and packaging for MEMS and MOEMS. Both conferences share common plenary talks including invited talks, panels and special sessions to allow close interaction between both communities.
Among others, the program features presentations from Zeiss, ST, imec, ESIEE, Politechnico di Torino and Thales. A special session on « Co-design for MEMS based Smart Systems » is organized by Gerold Schröpfer from Coventor, France.
by Paul McLellan
The last paradigm shift in DRC was around 0.35um when designs got too large to handle as flat data, and hierarchical approaches were required. Back then the design rules themselves were not that complex, the explosion of data volume came from the complexity of the design itself. But each process node added more design rules intricacies and many new types of rules that needed to be checked.
SPIE Advanced Lithography, February 22-26, 2015, in San Jose, CA.
Coventor will attend SPIE 2015, visit us at booth #205
San Jose Marriott and San Jose Convention Center
San Jose, California, United States
22 – 26 February 2015
SPIE is a highly regarded exhibition for the industry’s top semiconductor suppliers, integrators, and manufacturers. 61 exhibiting companies in 2014.
The 28th IEEE International Conference on Micro Electro Mechanical Systems
Coventor will attend MEMS 2015, visit us at booth #16.
by Tom Simon
Recently I attended a panel discussion on variability in semiconductor fabrication hosted by Coventor in conjunction with the IEEE IEDM conference in San Francisco. The IEEE bills the conference as “the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling.” It’s easy to see how this discussion was relevant to the conference focus. SemiWiki’s own Dan Nenni was the panel moderator.
by Paul McLellan
IEDM (technically the International Electron Devices Meeting although I’ve never heard anyone use the full name) is in a couple of weeks time, in San Francisco. It is December 15-17th at the Hilton Union Square (which is not actually at Union Square but nearby at 333 O’Farrell Street).
For the last few years on the Tuesday evening Coventor have sponsored an event (with appetizers and drinks). Last year it was all about collaboration. This year the topic is variation, Survivor, Variation in the 3D Era. It is at the Hotel Nikko from 5.30pm to 8.30pm on Tuesday December 16th in the Carmel Room. Hotel Nikko is 222 Mason Street just around the corner from the Hilton.
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Location: “Carmel Room” at Hotel Nikko, San Francisco
Date: Tuesday, December 16, 2014
Time: 5:30pm -8:30pm (Cocktails and hors d’oeuvres)
6:00pm (Panel Begins)
RSVP by 12/10/14 RSVP-to-COVENTOR@coventor.com
2014 IEEE International Electron Devices Meeting
Hilton San Francisco Union Square
333 O’Farrell Street
San Francisco, CA USA
December 15-17, 2014
The Annual Technical Meeting of the Electron Devices Society