Author Archives: Marketing

Transducers 2017, June 18-22, 2017, Kaohsiung, Taiwan

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SEE US AT BOOTH #31

DAC 2017 Conference – June 18-22, 2017, Austin, Texas

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SEE US AT BOOTH 239

MEF (MEMS Engineer Forum) 2017 – April 26-27, 2017, Tokyo

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MEF (MEMS Engineer Forum) 2017

Coventor in the News – Silicon Photonics

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Coventor in the News

Photonics in Silicon R&D Toward Tb/s

By Ed Korczynski, Sr. Technical Editor, Semiconductor Manufacturing & Design

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The client:server computing paradigm colloquially referred to as the “Cloud” results in a need for extremely efficient Cloud server hardware, and from first principles the world can save a lot of energy resources if servers run on photonics instead of electronics. Though the potential for cost-savings is well known, the challenge of developing cost-effective integrated photonics solutions remains. Today, discrete compound-semiconductor chips function as transmitters, multiplexers (MUX), and receivers of photons, while many global organizations pursue the vision of lower-cost integrated silicon (Si) photonics circuits. read more…

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BEOL Barricades: Navigating Future Yield, Reliability and Cost Challenges

By: David Fried, Ph.D., Chief Technology Officer, Semiconductor

Figure 1. M2-V1 process flow after (a) M2-L1 lithography, (b) M2-L2 litho, (c) V1 partial etch, (d) BLok open and (e) CuBS.

Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. We asked our panelists questions such as: read more…

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Coventor’s Technology Roundtable at IEDM 2016

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Coventor Spearheads Discussion on Navigating Future Semiconductor Yield, Reliability and Cost Challenges

CARY, NC– December 6, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), is sponsoring an advanced semiconductor technology panel on Tuesday, December 6 in San Francisco, California at the 2016 IEDM Conference. The panel is entitled “BEOL Barricades: Navigating Future Semiconductor Yield, Reliability and Cost Challenges”.

The panel discussion will explore major questions in advanced semiconductor development, including: read more…

Coventor to Collaborate with MIT for Photonics Process Modeling

Coventor will offer expertise and tools to support MIT’s role in AIM Photonics

CARY, NC– November 15, 2016 – Coventor, a leading supplier of semiconductor process development tools, today announced that it will collaborate with the Massachusetts Institute of Technology (“MIT”) on silicon photonics process modeling. MIT is a key player in the AIM Photonics program, a federally funded, public-private partnership established to advance domestic capabilities in integrated photonic technology and strengthen high-tech U.S.-based manufacturing. Coventor will provide its SEMulator3D® process modeling platform to model the effect of process variation in the development of photonic integrated components. Integration of photonics with conventional CMOS technology is needed for next-generation scientific, industrial and consumer applications ranging from data communications to metrology to aerospace applications. read more…

Bringing Advanced Semiconductor Manufacturing Technologies to Higher Education

By: Jimmy Gu, Ph.D., Semiconductor Process & Integration Engineer, Coventor

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Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of scientists and engineers must learn about the practical methods used to design and manufacture the latest generation of semiconductor products. read more…

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