Author Archives: Sandra Liu
The Smart Systems Integration Conference 2018
Paper at the conference: New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow
Author: Christine Dufour, Christof Hielscher
2nd Electron Devices Technology and Manufacturing (EDTM) Conference 2018 – March 13-16, 2018, Kobe, Japan
SEE US AT BOOTH 323/325
Keynote Address: David Fried, “Equipment Intelligence: Process Control in 3D”
IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2018) – 21-25 January, 2018, Belfast, North Ireland
By Mark Lapedus
Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies.
The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k dielectrics. In finFETs, the control of the current is accomplished by implementing a gate on each of the three sides of a fin.