INVENSENSE INTRODUCES THE WORLD’S SMALLEST DUAL-AXIS GYROSCOPES FOR OPTICAL IMAGE STABILIZATION IN SMARTPHONES
InvenSense, Inc., the leading provider of MotionProcessing™Solutions for consumer electronics, today announced the introduction of a family of dual-axis gyroscopes, IDG-2020 and IXZ-2020, that address the market needs for optical image stabilization (OIS) in smartphones. Smartphones are rapidly replacing digital still cameras (DSC) as the devices of choice for capturing images; however, their image quality has generally been worse than DSCs due to blurry images, especially those taken in low-light conditions. By incorporating OIS technology, the same method adopted by many digital still camera manufacturers, smartphone image quality can be dramatically enhanced.
One of the major challenges of incorporating OIS technology into smartphones has been the availability of high performance, small size, and low cost MEMS gyroscopes. InvenSense is the first company to deliver both x-y (roll and pitch) and x-z (roll and yaw) dual-axis MEMS gyroscopes in a very small 3x3x0.75 mm form factor that meets the market demand. The new gyroscopes also incorporate a range of high performance features, including16-bit Analog to Digital Converters, less than 6mW of power consumption, and 27kHz drive frequency.
“Consumer demand for better image quality in smartphones has already resulted in the integration of 8+ megapixel image sensors, built-in auto-focus, and improved lens quality. The next obstacle to overcome is the elimination of blurred pictures due to hand jitter,” said Steve Nasiri, CEO and founder of InvenSense. “DSC manufacturers have successfully incorporated OIS technology to eliminate blurry pictures, and now with the availability of InvenSense’s new family of high performance gyroscopes, camera module makers for smartphones can provide the same capabilities in smartphones.”
IDG-2020 (x-y axis) and IXZ-2020 (x-z axis) leverages the company’s patented Nasiri-Fabrication process, the key technology which enables direct integration of MEMS mechanical structures with CMOS electronics at the wafer level, resulting in simple yet high performance solutions. The new gyroscopes offer features specifically tailored to meet OIS requirements, including the ability to have a factory full-scale output of ±32dps for highest sensitivity to detect slightest hand jitter, high-performance 32kHz ADC sampling, a nominal drive frequency of 27kHz, making the gyroscopes immune to interference from audible frequencies such as music or ambient noise, on-chip16-bit ADCs, low phase delay digital filters, and a high speed 20MHz SPI serial interface.