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IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2018) – 21-25 January, 2018, Belfast, North Ireland

 

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Semiconductor Modeling Engineer for TCAD Diffusion – Paris, France

Semiconductor Modeling Engineer for TCAD Diffusion – Paris, France

At Coventor Inc., we build innovative software products to solve semiconductor technology challenges.  Our 3D modeling software is revolutionizing the way that semiconductor chips are fabricated around the world.  Enabled by our core intellectual property – an accelerated 3D voxel modeling and visualization engine – our software is evolving fast as our business and customer base expands rapidly.

Coventor is seeking an expert in modeling the implantation and diffusion of dopants in contemporary semiconductor devices.  The ideal candidate will have a strong understanding of the physical theory governing implant and diffusion phenomena, knowledge of the appropriate physical models, as well as experience in implementing numerical solutions to these models.  This is a hands-on position with significant C++ coding responsibilities.

Responsibilities:

  • Participate in research, prototyping and characterization of physical models for simulation of implant and diffusion phenomena in nano-scale semiconductor devices
  • Participate in implementing new implant and diffusion modeling algorithms in C++, using and extending existing modeling infrastructure and APIs
  • Participate in general software engineering tasks, including verification, testing, bug fixing and maintenance of existing code

Required Qualifications:

  • PhD in Electrical Engineering or equivalent, with focus on numerical physics
  • Understanding of the physical theory governing implant and diffusion of dopants in semiconductor devices
  • Direct experience in implementation of numerical physics simulation algorithms in three dimensions (FVM, FEM, FDM, etc.)
  • Strong  C++ coding skills, including use of the standard template library
  • Excellent written and verbal communication skills
  • Desire to collaborate, contribute to, and learn from a team

Desirable Qualifications:

  • Any professional experience as a software engineer
  • Experience in implementation or application of three-stream and/or five-stream diffusion models
  • Basic working knowledge of Matlab
  • General knowledge of semiconductor processing technology
  • Experience with Monte Carlo implant and/or diffusion models
  • Experience with cross-platform development, on Windows and Linux
  • Experience with one or more of: Boost, STL, C++11 or later, Python

This opening is the Paris area. Salary will commensurate with experience. If you are interested in this opportunity and you are authorized to work in France, e-mail your resume in English to job1858@coventor.com.

About Coventor:

Coventor® is the market leader in software solutions for the development of semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Our SEMulator3D modeling and analysis platform provides fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Our MEMS design solutions are used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Our software and expertise helps customers predict the structures and behavior of their designs before they commit to time-consuming and costly fabrication.  For more information please visit www.coventor.com.

Semiconductor Modeling Lead Engineer for Implant and Diffusion – Paris, France

Semiconductor Modeling Lead Engineer for Implant and Diffusion – Paris, France

At Coventor Inc., we build innovative software products to solve semiconductor technology challenges.  Our 3D modeling software is revolutionizing the way that semiconductor chips are fabricated around the world.  Enabled by our core intellectual property – an accelerated 3D voxel modeling and visualization engine – our software is evolving fast as our business and customer base expands rapidly.

Coventor is seeking an expert in modeling the implantation and diffusion of dopants in contemporary semiconductor devices.  The ideal candidate will have a deep understanding of the physical theory governing implant and diffusion phenomena, direct experience with appropriate physical models, as well as experience in implementing numerical solutions to these models.  As lead engineer, you will collaborate with our applications team in defining product priorities for dopant modeling and will lead implementation of new dopant modeling capabilities in our software.  This is a hands-on position with significant C++ coding responsibilities and is a great opportunity for a motivated engineer to have a significant impact on our software.

Responsibilities:

  • Research, prototype and characterize physical models for simulation of implant and diffusion phenomena in nano-scale semiconductor devices
  • Implement new implant and diffusion modeling algorithms in C++, using and extending existing modeling infrastructure and APIs
  • Collaborate with applications engineers and product owners to define technical priorities and roadmap
  • Act as technical lead for the dopant modeling team, supervising the work one or more software engineers
  • Participate in general software engineering tasks, including verification, testing, bug fixing and maintenance of existing code

Required Qualifications:

  • PhD in Electrical Engineering or equivalent, with focus on numerical physics
  • Minimum 5 years of professional experience as a software engineer or modeling engineer
  • Deep knowledge of the physical theory governing implant and diffusion and its application to nano-scale semiconductor devices
  • Knowledge of three-stream (Mulvaney-Richardson) and/or five-stream (Dunham) diffusion models
  • Direct experience in implementation of numerical physics simulation algorithms in three dimensions (FVM, FEM, FDM, etc.)
  • Strong  C++ coding skills, including use of the standard template library
  • Excellent written and verbal communication skills
  • Desire to collaborate, contribute to, and learn from a team

Desirable Qualifications:

  • Basic working knowledge of Matlab
  • General knowledge of semiconductor processing technology
  • Experience with Monte Carlo implant and/or diffusion models
  • Experience with cross-platform development, on Windows and Linux
  • Experience with one or more of: Boost, STL, C++11 or later, Python

This opening is in Villebon sur Yvette (91), Paris area. Salary and responsibilities will commensurate with experience. If you are interested in this opportunity and you are authorized to work in France, e-mail your resume in English to job1857@coventor.com.

About Coventor:

Coventor® is the market leader in software solutions for the development of semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Our SEMulator3D modeling and analysis platform provides fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Our MEMS design solutions are used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Our software and expertise helps customers predict the structures and behavior of their designs before they commit to time-consuming and costly fabrication.  For more information please visit www.coventor.com.

Semiconductor Process and Integration Engineer – South Korea

Semiconductor Process and Integration Engineer – South Korea

We are seeking a BS/MS/PhD-level engineer who has experience and expertise in semiconductor process integration and fabrication. You will work with leading semiconductor companies to implement our virtual fabrication solution for their most advanced development programs, including 10nm CMOS technology and beyond! You will collaborate with the Semiconductor Process & Integration team in the Office of the CTO, along with our highly skilled software development team, to create integration and modeling solutions for industry-critical manufacturing challenges. Our tight-knit team of creative engineers is critical in leading customers into the methodology of virtual fabrication.

This is a hands-on engineering position, requiring proficiency in full flow semiconductor process integration, as well as strong communication and presentation skills. Your title, level of responsibility, creative freedom and salary will be commensurate with your education and experience.

Location: South Korea. This position requires residency in South Korea with a substantial amount of time at customer sites in South Korea. Work is expected to be partly based at customer/partner sites. Travel is expected.

Required Qualifications:

Education: Bachelor’s degree required, Master’s degree preferred, in related fields of Electrical Engineering, Chemical Engineering, Materials Science or Applied Physics.

Experience: Semiconductor Technology and Processing education and experience is required. Relevant employment experience in the semiconductor industry is required.

Skills: Semiconductor Processing and Integration, Semiconductor Device Physics (preferred), Computer-Aided Design (CAD) and Modeling, Python scripting language, Technical Writing , Communication and Presentation.

If you are interested in this opportunity and you are authorized to work in South Korea, e-mail your cover letter and CV in English to job1826@coventor.com.

About Coventor:

Coventor, Inc. (www.coventor.com) is the global market leader in virtual fabrication solutions for semiconductor technologies and design automation solutions for microelectromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, independent foundries, equipment makers, and R&D organizations that develop semiconductor and MEMS technologies for consumer, automotive, aerospace, industrial, and defense uses. Coventor’s predictive modeling tools and expertise enable its customers to dramatically reduce silicon learning cycles, giving them a time-to-market advantage and reducing technology development costs. The company is headquartered in Cary, NC and has offices in Waltham, MA; Silicon Valley, CA; Tokyo, Japan; Hsinchu, Taiwan; and Paris, France.

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Semiconductor Process and Integration Engineer – Taiwan

Semiconductor Process and Integration Engineer – Taiwan

We are seeking a BS/MS/PhD-level engineer who has experience and expertise in semiconductor process integration and fabrication. You will work with leading semiconductor companies to implement our virtual fabrication solution for their most advanced development programs, including 10nm CMOS technology and beyond! You will collaborate with the Semiconductor Process & Integration team in the Office of the CTO, along with our highly skilled software development team, to create integration and modeling solutions for industry-critical manufacturing challenges. Our tight-knit team of creative engineers is critical in leading customers into the methodology of virtual fabrication.

This is a hands-on engineering position, requiring proficiency in full flow semiconductor process integration, as well as strong communication and presentation skills. Your title, level of responsibility, creative freedom and salary will be commensurate with your education and experience.

Location: Taiwan. This position requires residency in Taiwan with a substantial amount of time at customer sites in Taiwan. Work is expected to be partly based at customer/partner sites. Travel is expected.

Required Qualifications:

Education: Bachelor’s degree required, Master’s degree preferred, in related fields of Electrical Engineering, Chemical Engineering, Materials Science or Applied Physics.

Experience: Semiconductor Technology and Processing education and experience is required. Relevant employment experience in the semiconductor industry is required.

Skills: Semiconductor Processing and Integration, Semiconductor Device Physics (preferred), Computer-Aided Design (CAD) and Modeling, Python scripting language, Technical Writing , Communication and Presentation.

If you are interested in this opportunity and you are authorized to work in Taiwan, e-mail your cover letter and CV in English to job1825@coventor.com.

About Coventor:

Coventor, Inc. (www.coventor.com) is the global market leader in virtual fabrication solutions for semiconductor technologies and design automation solutions for microelectromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, independent foundries, equipment makers, and R&D organizations that develop semiconductor and MEMS technologies for consumer, automotive, aerospace, industrial, and defense uses. Coventor’s predictive modeling tools and expertise enable its customers to dramatically reduce silicon learning cycles, giving them a time-to-market advantage and reducing technology development costs. The company is headquartered in Cary, NC and has offices in Waltham, MA; Silicon Valley, CA; Tokyo, Japan; Hsinchu, Taiwan; and Paris, France.

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What drives SADP BEOL variability?

By: Michael Hargrove, Semiconductor Process & Integration Engineer

Until EUV lithography becomes a reality, multiple patterning technologies such as triple litho-etch (LELELE), self-aligned double patterning (SADP), and self-aligned quadruple patterning (SAQP) are being used to meet the stringent patterning demands of advanced back-end-of-line (BEOL) technologies.  For the 7nm technology node, patterning requirements include a metal pitch of 40nm or less. This narrow pitch requirement forces the use of spacer based pitch multiplication techniques. Unfortunately, these techniques have high process/lithography variability, which can severely impact RC and overall device performance.

read more…

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Coventor Touts Unified MEMS Platform

By R. Colin Johnson

LAKE WALES, Fla. — Micro-electro-mechanical systems (MEMS) chips cannot be virtually fabricated using conventional electronic design automation (EDA) tools because their three-dimensional structures cannot be represented well there. Computer Aided Design (CAD) tools are closer to the mark, but usually work on millimeter- instead of micron-size scales.

To bridge the gap, Coventor Inc. (Cary, North Carolina) has created its Coventor and MEMS+ tools, which have now been merged into a single unified platform perfect for Internet of Things (IoT) makers, according to Steve Breit, vice president of MEMS business for Coventor.

read the full article here.

Coventor Launches CoventorMP 1.0, a New Unified Environment for Designing MEMS for IoT Devices

Coventor’s advanced design platform provides seamless MEMS/IoT design and integration

CARY, NC– May 10, 2017 – Coventor®, Inc., the global market leader in design automation solutions for microelectromechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices, today announced the immediate availability of CoventorMP® 1.0, a new unified MEMS design platform. CoventorMP 1.0 combines the complementary strengths of Coventor’s industry-leading software tools for MEMS design, CoventorWare® and MEMS+®, into a single powerful environment for MEMS design automation. The new platform provides a cohesive environment where designs can be entered once and used to create conventional finite element models (CoventorWare) and compact finite element models (MEMS+). CoventorMP 1.0, which includes enhanced versions of CoventorWare (Version 10.2) and MEMS+ (Version 6.2), provides a seamless path for integrating MEMS sensors and actuators into System-in-Package (SiP) components targeted at Internet of Things (IoT) devices. read more…