Coventor Enhances SEMulator3D Virtual Fabrication Platform To Address Advanced 3D Process Development Challenges

New pattern dependent etch modeling capability highlights improvements in speed and accuracy for FinFETs, 3D memory, BEOL interconnect and other advanced manufacturing technologies

CARY, North Carolina – March 31, 2014 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the immediate availability of the SEMulator3D® 2014 software platform. The latest version of the integrated modeling tool enhances the visibility, accuracy and performance with which engineers can analyze next-generation manufacturing technologies, and dramatically reduce the time and cost of traditional build-and-test silicon learning cycles in the 3D era. read more…

Evaluate MEMS Devices out-of-fab Before Fabrication

by Pawan Fangaria

MEMS design and fabrication is highly complex in the sense that the fabrication process heavily depends on the design, unlike IC fabrication which has a standard set of processes. A slight change in MEMS design can alter its fabrication steps to a large extent. For example, setting device parameters such as capacitance or linear displacement can affect the choice of the film thickness, etch rate, sidewall profile and so on. The design and process are so much tied together that many iterations through the fab are required (which consume costly resources and time) in order to get a perfect build. While an IDM has to keep its fab resources deployed for such a build-and-test experimentation in-house, a fabless design house has to additionally incur time for its design to take several tours through an external fab. This all has significant impact, first on cost of design and manufacturing and then turn-around-time, thus squeezing the window of opportunity which is already small in today’s competitive semiconductor market. read more…

Software Release Engineer – Waltham, MA

Software Release Engineer – Waltham, MA

Do you enjoy solving problems and learning new skills?  Do you enjoy working with people as much as with software and systems?  We are seeking a multi-talented engineer who will play a crucial role in our thriving software development organization. You will have the opportunity to work with a wide range of technologies and people, helping us deliver high-quality software products for both Windows and Linux environments. Your title, level of responsibility, creative freedom and salary will be commensurate with your education and experience.


  • Maintain and improve our automated build system consisting of shell scripts, make files, and scons scripts;
  • Set up and administer virtualized build systems in a private cloud environment;
  • Monitor daily builds and communicate with developers about build failures;
  • Create and update installers for our products for both Windows and Linux systems;
  • Work with QA and product managers to distribute releases to customers;
  • Install and maintain development tools such as compilers, source control system, issue tracking database, and test case management system;
  • Communicate with software tool vendors about updates and license renewals; and
  • Participate in or lead initiatives to improve our tools and practices, such as continuous builds, adopting agile processes, etc.

Required Qualifications

  • Bachelor of Science in Computer Science or related field;
  • Minimum 3 years professional experience in delivery aspects of software development, including developer tools, automated builds, installation, licensing, and distribution;
  • Proven aptitude for shell scripting and/or scripting languages;
  • Experience with one or more source control systems;
  • Self-motivated, persistent problem solver who enjoys learning new skills;
  • Systematic work style and excellent attention to detail; and
  • Experience working on both Windows and Linux.

Desirable Qualifications

  • Prior employment as a builds and/or release engineer;
  • Experience with InstallShield, InstallAnywhere or Windows Installer;
  • Experience with the Subversion (SVN) and/or GIT source control systems; and
  • Windows and Linux system administration.

This opening is in Waltham, MA.  Salary will be commensurate with experience.  Coventor offers comprehensive benefits and is an EEO/AA Employer. You must be a current legal resident of the U.S. or have a valid U.S. visa to apply for this position. Please e-mail your cover letter and resume to

Some Thoughts on 3D Integration and How to Better Understand its Complexity

As semiconductor technology scales into the 20nm node and beyond, the process complexity, electrical performance and circuit density tradeoff becomes extremely difficult to optimize. As the demand for increased density, lower power, and higher bandwidth accelerates, the motivation for 3D integration becomes more attractive. With the advent of 3D integration comes the promise of “beyond Moore’s law” integration by stacking chip-on-chip and connecting them with through-silicon-vias (TSVs). Numerous definitions of 3D integration exist, for example multi-die packages (also known as system-in-package, or SiP) in which multiple die are mounted on a common substrate that connects them, package-in-package (PiP) where a number of SiPs are mounted in a larger SiP, and package-on-package (PoP) where one SiP is mounted on top of another SiP. All of these approaches offer some degree of density advantage, however, the ultimate objective of 3D integration is the multiple stacking of silicon levels on top of one another, each of which contain subsequent levels of circuitry, all connected with TSVs. This approach to 3D integration has been demonstrated by CEA-Leti and reported in IEEE Spectrum (see Figure 1 below). read more…

3D printed model of FinFET attracts attention at SPIE Conference

photo 1[1]

3D printing has become all the rage in many areas, from home hobbyists to high-end industrial applications. The convenience, flexibility, functionality and decreasing price for printing things in 3D makes it an appealing tool for a wide range of purposes. So we thought we’d put it to use for demonstrating how virtual fabrication can help engineers understand the technical nuances of advanced process technologies – as well as show off a cool feature of our SEMulator3D tool. read more…

IEEE Conference Highlights the MEMS Opportunity

The recent IEEE Conference on MEMS, held in San Francisco, was one of the better gatherings of its sort, partly due to the location and its proximity to so many participants in the MEMS community, and partly because MEMS is at a real turning point and it is an industry primed for great innovation and advances that can touch all aspects of our lives.

The conference is literally a ‘who’s who’ of the MEMS industry, and not surprisingly there are excellent technical talks on the most important and popular MEMS-related topics such as gyros and accelerometers, optical MEMS, resonators and RF MEMS, energy harvesting and fluidic micro-devices, and biomedical micro-devices. There are tracks covering the complete range of MEMS development – from design, to materials and process characterization, through to fabrication. And there are some pretty advanced, even exotic, topics presented, particularly in the area of health and medical applications.
read more…