DAC 2015 – June 7-11, 2015 – San Francisco, CA

Visit Coventor at booth #3310

The Design Automation Conference (DAC) is recognized as the premier conference for design and automation of electronic systems. DAC offers outstanding training, education, exhibits and superb networking opportunities for designers, researchers, tool developers and vendors.

Don’t miss new Cloud-Based 3D Design-Technology Checking (3D-DTC) demo at DAC!

DAC 2015 is in full swing in San Francisco this week, and Coventor is there again. But this year, we’re also doing a special joint demonstration with Silicon Cloud International. This demonstration combines the power of Coventor’s SEMulator3D Virtual Fabrication platform with broad parallel computing offered by Silicon Cloud to produce a whole new capability that we call “3D Design-Technology Checking” or 3D-DTC for short (not DRC!).
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Coventor Adds Dinesh Bettadapur to its Executive Team to Lead Business Development Efforts

Former Intel & ASML Executive with Chip Design, EDA, DFM and Lithography Experience will Help Coventor Grow its Existing Customer Base and Reach New Markets

Coventor appoints Mr. Dinesh Bettadapur as vice president of business development

Coventor appoints Mr. Dinesh Bettadapur as vice president of business development

CARY, North Carolina – June 8, 2015 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the appointment of Mr. Dinesh Bettadapur as vice president of business development. Bettadapur joins the Coventor executive team and will help expand the company’s leadership across the semiconductor value chain with a special focus on the capital equipment market.
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SITRI and Coventor Partner to Scale Up MEMS in China

by Pawan Fangaria

Shanghai Industrial µTechnology Research Institute

Shanghai Industrial µTechnology Research Institute

When it comes to wearable technology and the rapidly emerging world of IoT, sensors and MEMS are on the frontlines. They collect and transfer raw data such as pressure, temperature and motion and process it with algorithms critical to making sure the right information gets to humans and/or machines so the right reaction is enabled. In less than a decade, there is expected to be approximately 1 trillion sensors deployed worldwide – yet the MEMS market is fragmented and there is as yet no standard process in place for MEMS development. Change is needed; a standard approach for MEMS design and manufacturing needs to evolve in order to sustain the massive growth prospects ahead.

The significance of MEMS has not gone unnoticed, especially by Chinese companies who are eager to jump into this rapidly growing market. At the intersection of MEMS and China sits a company called SITRI, who is announcing a partnership with MEMS tool leader, Coventor.

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SITRI and Coventor partner to offer “more then moore” design and process tools to speed development of MEMS-based devices

  • SITRI to represent Coventor in China and provide training and support for all Coventor MEMS products
  • Expands SITRI’s global ecosystem to accelerate the commercialization of IoT products

Cary, North Carolina and Shanghai, China –– May 18, 2015 — SITRI, the innovation center for accelerating the development and commercialization of “More than Moore” solutions to power the Internet of Things, and Coventor Inc., a leader in automated solutions for developing semiconductor process technology and advanced MEMS devices, announced today they have signed an agreement making SITRI the first organization to provide representation, training and support for Coventor MEMS products within China.
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SEMulator3D 5.0 – It’s COMING!!!

David M. Fried

This is my favorite part of the year at Coventor: We’re about to do another MAJOR release of SEMulator3D. Developers are sprinting to the finish line, customers are clamoring for the newest features. I’d like to start talking about the new features of SEMulator3D 5.0, but one blog certainly won’t cover it all. Let’s get started, and we’ll do this as many times as we need to get it all written down.
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MEMS Technical Congress – May 6–7, 2015 – Boston, MA

techhead1Coventor will moderate a panel session titled: “2020 Vision: An Ap Store for MEMS IP”

MEMS Technical Congress is focused on discussing critical MEMS and sensors supply chain challenges. It brings together foundries, equipment vendors, research groups, large companies, start-ups, buyers, suppliers, and other stakeholders for solutions knowledge, networking and resources to support imminent MEMS and sensors commercialization needs.

MEMS System Co-Design at DTIP

By Gerold Schröpfer

The 17th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2015) took place this year in Montpellier, Southern France, on April 28-30. This conference brings together participants interested in MEMS fabrication with those interested in design tools and methods. While this annual event is always located in Southern Europe, it attracts attendees from both industry and academia from around the world.

It was my pleasure to chair a session titled Co-design for MEMS-based Smart Systems. In recent years, Coventor has made several crucial advancements, now embodied in MEMS+®, to bridge the gap between MEMS device design and system-level simulation. A number of MEMS+ users presented co-simulation results for systems that included inertial sensors, resonators, varactors and micromirrors. It was impressive and gratifying to see their achievements and hear their enthusiasm.

  • Guilherme Brondani Torri of imec presented the co-design of a MEMS-CMOS autonomous switched oscillator. He investigated how the dynamic response is affected by the operating point and environmental parameters. The co-simulation of MEMS and circuitry made it possible to identify important issues related to the stability of the proposed oscillator. [1]
  • Gaelle Lissorgues of ESSIE talked about a complete system design for an RF tunable agile filter. The parametric MEMS+ models for MEMS varactors and switches allowed optimizing the design with respect to manufacturing variations. Automated transfer of the MEMS+ model into Verilog-A allows for system-level simulation in ADS including RF performance estimation.[2]
  • Alessandro Sanginario of IIT Torino presented a MEMS+ based methodology for MEMS-IC-package co-design. The methodology takes into account the effects of thermally-induced stress on the package on inertial sensor transient behavior. He stated that, being an electronic designer, “it’s fantastic” to have a MEMS-package model in your familiar simulation language. [3, 4]
  • Fabio Cenni of ST Micro discussed a new extension to SystemC for MEMS system analysis, named SystemC-AMS/MDVP (Analog/Mixed Signal/Multi-Domain Virtual Prototyping) . This allows co-simulating not only MEMS with electronic hardware, but also with control software. The approach supports different levels of abstraction which allows balancing accuracy and simulation time. Fabio’s presentation was accompanied by a poster, written by Benoit Vernay of Coventor, demonstrating a prototype for automated extraction of a SystemC-AMS reduced-order models from MEMS+. [5, 6, 7]

Finally, my personal favorite was an invited presentation by Johannes Eisenmenger of Carl Zeiss. From a system-integrator point of view, he discussed the opportunities and challenges for EDA tools in developing optical systems. Optimizing such systems with suitable behavioral models is an essential step toward developing products for which new MEMS and other components need to be developed in parallel and their individual specifications depend on mutual interactions and environmental influences. One prominent example is the MEMS mirror matrix, FlexRay, employed in ASML’s 193nm UV lithography equipment for advanced CMOS. [8]

I want to warmly thank our customers for sharing their work with the MEMS system community.

MEMS-CMOS Autonomous Switched Oscillator presented by Guilherme Brondani Torr (© imec) [1]

MEMS-CMOS Autonomous Switched Oscillator presented by Guilherme Brondani Torr (© imec) [1]

Agile Filter assembly using MEMS switches and varactors presented by Gaelle Lissorgues [2]

Agile Filter assembly using MEMS switches and varactors presented by Gaelle Lissorgues [2]

MEMS-Package Co-Design presented by Alessandro Sanginario (© IIT, ST, Coventor) [3]

MEMS-Package Co-Design presented by Alessandro Sanginario (© IIT, ST, Coventor) [3]

Proceedings of International Conference on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP), Montpellier, France, 27-30 April 2015
[1] Guilherme BRONDANI TORRI (imec / KU Leuven – Belgium), Jan BIENSTMAN, Xavier ROTTENBERG, Harrie TILMANS (imec) ea, Co-Design of a MEMS-CMOS Autonomous Switched Oscillator
[2] Gaelle LISSORGUES (ESIEE Paris – France), Pierre NICOLE (THALES Systèmes Aéroportés – France), Julien PAGAZANI (ESIEE – France) ea, A RF tunable Agile Filter: from component to system design
[3] Alessandro SANGINARIO (Istituto Italiano di Tecnologia – Italy), Sarah ZERBINI (STMicroelectronics – Italy), ea, New design methodology for MEMS-electronic-package co-design and validation for inertial sensor systems
[4] Michelangelo GROSSO (ST-POLITO – Italy), Giuliana GANGEMI, Salvatore RINAUDO (STMicroelectronics – Italy) ea, Enabling Smart System Design with the SMAC Platform
[5] Olivier GUILLAUME, Fabio CENNI (STMicroelectronics – France) ea.,SystemC-AMS/MDVP-based modeling for the virtual prototyping of MEMS applications
[6] Fabio CENNI STMicroelectronics – France) ea, Generation of user-defined input stimuli for virtual prototyping of MEMS sensors applications
[7] Benoit VERNAY, Arnaud KRUST (Coventor – France), ea, SystemC-AMS Simulation of a Biaxial Accelerometer based on MEMS Model Order Reduction
[8] Johannes Eisenmenger, Opportunities and challenges of Electronic Design Automation of MEMS-ASIC Systems – A system integrator’s perspective (INVITED)