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DTIP 2015 – April 27–30, 2015 – Montpellier, France

DTIP A special session on « Co-design for MEMS based Smart Systems » is organized by Gerold Schröpfer from Coventor, France.

DTIP is a symposium including two main Conferences: the CAD, Design and Test Conference devoted to the development of Computer-Aided Design (CAD) tools and design methodologies for MEMS and MOEMS, and the Microfabrication, Integration and Packaging Conference dedicated to the development of integration technologies and packaging for MEMS and MOEMS. Both conferences share common plenary talks including invited talks, panels and special sessions to allow close interaction between both communities. http://www.dtip-mems.org

Coventor strengthens presence in Taiwan with innovative predictive modeling platform for semiconductor development

SEMulator3D’s virtual fabrication capabilities ideally positioned to help region’s IC ecosystem streamline technology development schedules and manufacturing costs

CARY, North Carolina – April 22, 2015 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced that it has opened an office near Hsinchu Science Park in Taiwan to better serve its growing Taiwan customer base. The move underscores the importance of the company’s SEMulator3D platform for predictive modeling, an approach that changes the way advanced semiconductor technologies are developed by foundries, IDM’s and memory manufacturers. With Taiwan being home to many leading companies in the semiconductor industry, Coventor sees the region as a key area of growth and expansion for the company and its virtual fabrication solution. Coventor is staffing the office with local business and technical experts to work closely with its existing customer base and leverage new opportunities for SEMulator3D, its virtual fabrication platform.
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A Lego Block Approach to MEMS Design

The Smart Systems Integration conference took place in Copenhagen on March 10-12, 2015. We were invited to join a panel discussion with the title “Towards a “Lego block principle” for heterogonous systems design including MEMS and electronics –Choose and put together-fit”. The capital of Denmark felt like the natural place to discuss a “Lego block principle” and so I happily accepted to represent Coventor in the discussion. read more…

Engineering Software Quality Assurance Team Lead – Waltham, MA

Engineering Software Quality Assurance Team Lead – Waltham, MA

We are seeking a BS- or MS-level engineer with a strong interest in 3D modeling and simulation to lead a quality assurance team responsible for testing our advanced semiconductor virtual fabrication software. You will be responsible for coordinating the daily activities of our quality assurance team, which is embedded in a collaborative software development team that is following the Scrum development process. Through continuous engagement with developers, organizing test plans for new features and maintaining regression test suites, you will play a critical role in helping us deliver quality software for both the Windows and Linux platforms. This is an engineering position, not a managerial role, where your strong engineering knowledge will enable you to directly test the software in order to provide effective supervision of your team and valuable input to our software development team. Your compensation will be commensurate with your education and experience.

This regular, full-time position is located in our office in Waltham, MA. Coventor offers comprehensive benefits and is an EEO/AA Employer. You must be a current legal resident of the U.S. or have a valid U.S. visa to apply for this position. Please e-mail a cover letter and resume to job1838@coventor.com

Responsibilities

  • Supervise the daily activities of a team of software quality assurance engineers
  • Digest software specifications and organize plans for systematically testing new engineering functionality
  • Develop, execute and maintain verification test cases for both automatic and manual regression test suites
  • Understand the functionality of our semiconductor virtual fabrication environment
  • Actively participate in our Scrum-based agile development process
  • Submit defect reports and enhancement requests
  • Collaborate with software developers to isolate defects
  • Interact with the applications support team to define realistic test cases
  • Create examples and draft documentation for use in product documentation and marketing collateral

Required Qualifications

  • BS or MS in Electrical Engineering, Mechanical Engineering or a related discipline
  • At least 5 years of work experience as a quality assurance engineer of 3D engineering software such as CAD, CAE or TCAD tools
  • Detail oriented individual who enjoys systematically exploring software
  • Team oriented personality with excellent interpersonal skills
  • Excellent English communication skills (verbal and written)
  • Proficiency with Windows and/or Linux operating systems
  • Scripting skills in Python, MATLAB, or similar scripting language

Desirable Qualifications

  • Semiconductor technology and processing education and experience
  • Basic understanding of numerical modeling algorithms
  • Working knowledge of Agile methodology

Smart Systems Integration – March 11-12, 2015

Smart Systems Integration – March 11-12, 2015 – Copenhagen
International Conference and Exhibition

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Coventor will participate in a panel discussion on March 11, 2015 at 2:45pm, titled: “Towards a ‘Lego Brick Principle’ for Heterogeneous System Design Including MEMS and Electronic – Choose and Put Together – Fit?”

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Defect Evolution in 3D NAND Flash

by Sandy Wen, Semiconductor Process and Integration

3D NAND Flash has become a hot topic in non-volatile memory these days. While planar NAND flash is still going strong, it has been increasingly difficult to scale planar technology past the sub-20nm lengths and meet upcoming memory cell density and cost targets. In a different approach, Toshiba published early work on 3D NAND in 2007 [1] in which flash cells are stacked vertically to increase cell density. Since then, all major flash memory manufacturers have jumped aboard this train with their own flash architectures, and in 2013, Samsung became the first to ship “V-NAND” in the form of a solid state drive.
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2015 IEEE Workshop on Microelectronics and Electron Devices – March 20 2015 – Idaho, USA

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The Thirteenth Annual Workshop on Microelectronics and Electron Devices (WMED 2015). WMED 2015 will provide a forum for reviewing and discussing all aspects of microelectronics including processing, electrical characterization, design, and new device technologies.

Friday, March 20, 2015
Jordan and Simplot Ballrooms
Student Union Building
Boise State University
1910 University Drive
Boise, Idaho 83725

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IEEE ISISS 2015 – March 23-26, 2015 – Hawaii

2nd Annual IEEE International Symposium on Inertial Sensors and Systems

Hupuna Beach Prince Hotel, Hawaii, USA

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IEEE ISISS 2015 will be a 4 day event with tutorials on Monday, March 23, and the symposium’s technical sessions on March 24-26.

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