Semicon West is one of the iconic conferences in the semiconductor industry and annually attracts the key movers and shakers who are involved with how we are going to keep Moore’s Law moving forward, among other things. It’s known rightfully so, as a ‘big iron’ show with the top manufacturing equipment companies showing off their newest machines for the major steps in the manufacture of semiconductors – wafer processing, assembly packaging and test.
It’s not all about the equipment of course, or even just manufacturing. The show has done a good job of expanding to include a wider ecosystem of companies, products and topics that impact chip design as well. So while the majority of attendees come from companies that produce chips – foundries and IDMs – as well as the supporting production services, Semicon visitors also include the fabless companies who really aren’t in the market for manufacturing equipment. read more…
by Paul McLellan
One of Coventor’s flagship products is SEMulator3D, and at Semicon West they announced a new version, 2014.100.
SEMulator3D is a powerful 3D semiconductor and MEMS process modeling platform. It uses highly efficient physics-driven voxel modeling technology. It models the physical effects of process steps, which is where all the current challenges are.
Combining the two-dimensional design layout with the process description gives it the capability to model the process flows and determine what will be manufactured with that combination of layout and process. The basic idea, as with all modeling, is to enable experiments to be done quickly and efficiently. Since the alternative is to actually build chips and then take measurements, which is millions of dollars of investment and months of delay, the virtual fabrication route is especially attractive. This is especially important in the early stages of process development since it can drastically shorten the whole development and ramp to volume roadmap.
By David M. Fried
Today we officially released SEMulator3D 2014.100. Typically, I wouldn’t be so excited about a “point release”, but this is clearly the biggest interim software release in recent SEMulator3D memory. We’ve added significant capability to an already industry-leading virtual fabrication platform. Many of the features of recent SEMulator3D releases have been focused on Etch enhancements. To complement these enhancements, we’ve stepped up the predictive accuracy of several other process models in SEMulator3D 2014.100, including Deposition and CMP.
The highlight of this release is a new Visibility-Limited Deposition model. This model dramatically improves the predictive accuracy for directional depositions, like Physical Vapor Deposition (PVD) and other plasma enhanced deposition processes. As with other process models in SEMulator3D, we’ve made this process simple to implement and calibrate using a reduced set of process parameters. The key features of this Visibility-Limited Deposition model are the “Source Sigma”, reflecting the directional distribution of the process, and the “Isotropic Ratio”, reflecting the non-visibility-limited component of the deposition process. This model enables a large variety of processes, with a wide range of results.
by Pawan Fangaria
Although MEMS devices in various forms are now found in most electronic devices, predominantly in mobile, automotive, aerospace and many other applications, their major revolution, I believe, is yet to happen. We are seeing rapid innovation in MEMS reflected by their improvements in precision, performance, size reduction, and the continuing evolution of new devices with increasing complexities. The micro level fabrication of MEMS will enable unprecedented use of these into newer and newer semiconductor based electronic devices that will revolutionize the so called IoT arena. MEMS will be essential to IoT products’ ability to connect every aspect of our life, things and happenings around us and provide us ultimate knowledge, control, security through a wide range of devices in many form factors and environments.
By Mike Hargrove
Most process/device simulation tools are TCAD-based. By this, I mean they share a common platform which connects the process simulator to the device simulator, usually using the same mesh structure. Most all of these TCAD tools are finite-element based, and the 3D final mesh structure is tetrahedral in nature. The mesh structure contains many nodes which define solution points for the numerous complex set of equations required to create the physical structure, in most cases a transistor, and solve for the electrical characteristics of the device. One of the drawbacks of TCAD is the computational time required to arrive at a solution – both process model solution and device electrical solution. A larger modeled area (e.g. multiple transistors and/or an SRAM cell) usually means longer simulation time.
Coventor’s virtual wafer fabrication approach addresses this challenge. Our process modeling platform combines with the statistical device TCAD suite of tools from Gold Standard Simulations, LTD. (GSS) to produce SRAM device-level simulation capability capturing real process-induced statistical variation. The ultimate objective of statistical device modeling is to capture the intrinsic variation of physically relevant process parameters. The combination of Coventor SEMulator3D process modeling capability and GSS statistical TCAD simulator GARAND fulfills this objective.
CoventorWare 2014 delivers new levels of performance, automation and accuracy to address most complex MEMS design challenges
CARY, North Carolina – June 30, 2014 – Coventor®, Inc., the leading supplier of design automation software for developing micro-electromechanical systems (MEMS), today announced immediate availability of its new CoventorWare 2014 suite, the industry’s most proven development solution for advanced modeling and simulation of MEMS devices. The latest release delivers enhanced levels of performance, automation and accuracy for designing a new generation of sophisticated MEMS devices – such as accelerometers, gyroscopes, microphones, and micro-actuators — to reduce overall development costs and time.