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MEMS System Co-Design at DTIP

By Gerold Schröpfer

The 17th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2015) took place this year in Montpellier, Southern France, on April 28-30. This conference brings together participants interested in MEMS fabrication with those interested in design tools and methods. While this annual event is always located in Southern Europe, it attracts attendees from both industry and academia from around the world.

It was my pleasure to chair a session titled Co-design for MEMS-based Smart Systems. In recent years, Coventor has made several crucial advancements, now embodied in MEMS+®, to bridge the gap between MEMS device design and system-level simulation. A number of MEMS+ users presented co-simulation results for systems that included inertial sensors, resonators, varactors and micromirrors. It was impressive and gratifying to see their achievements and hear their enthusiasm.

  • Guilherme Brondani Torri of imec presented the co-design of a MEMS-CMOS autonomous switched oscillator. He investigated how the dynamic response is affected by the operating point and environmental parameters. The co-simulation of MEMS and circuitry made it possible to identify important issues related to the stability of the proposed oscillator. [1]
  • Gaelle Lissorgues of ESSIE talked about a complete system design for an RF tunable agile filter. The parametric MEMS+ models for MEMS varactors and switches allowed optimizing the design with respect to manufacturing variations. Automated transfer of the MEMS+ model into Verilog-A allows for system-level simulation in ADS including RF performance estimation.[2]
  • Alessandro Sanginario of IIT Torino presented a MEMS+ based methodology for MEMS-IC-package co-design. The methodology takes into account the effects of thermally-induced stress on the package on inertial sensor transient behavior. He stated that, being an electronic designer, “it’s fantastic” to have a MEMS-package model in your familiar simulation language. [3, 4]
  • Fabio Cenni of ST Micro discussed a new extension to SystemC for MEMS system analysis, named SystemC-AMS/MDVP (Analog/Mixed Signal/Multi-Domain Virtual Prototyping) . This allows co-simulating not only MEMS with electronic hardware, but also with control software. The approach supports different levels of abstraction which allows balancing accuracy and simulation time. Fabio’s presentation was accompanied by a poster, written by Benoit Vernay of Coventor, demonstrating a prototype for automated extraction of a SystemC-AMS reduced-order models from MEMS+. [5, 6, 7]

Finally, my personal favorite was an invited presentation by Johannes Eisenmenger of Carl Zeiss. From a system-integrator point of view, he discussed the opportunities and challenges for EDA tools in developing optical systems. Optimizing such systems with suitable behavioral models is an essential step toward developing products for which new MEMS and other components need to be developed in parallel and their individual specifications depend on mutual interactions and environmental influences. One prominent example is the MEMS mirror matrix, FlexRay, employed in ASML’s 193nm UV lithography equipment for advanced CMOS. [8]

I want to warmly thank our customers for sharing their work with the MEMS system community.

MEMS-CMOS Autonomous Switched Oscillator presented by Guilherme Brondani Torr (© imec) [1]

MEMS-CMOS Autonomous Switched Oscillator presented by Guilherme Brondani Torr (© imec) [1]

Agile Filter assembly using MEMS switches and varactors presented by Gaelle Lissorgues [2]

Agile Filter assembly using MEMS switches and varactors presented by Gaelle Lissorgues [2]

MEMS-Package Co-Design presented by Alessandro Sanginario (© IIT, ST, Coventor) [3]

MEMS-Package Co-Design presented by Alessandro Sanginario (© IIT, ST, Coventor) [3]

References:
Proceedings of International Conference on Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP), Montpellier, France, 27-30 April 2015
[1] Guilherme BRONDANI TORRI (imec / KU Leuven – Belgium), Jan BIENSTMAN, Xavier ROTTENBERG, Harrie TILMANS (imec) ea, Co-Design of a MEMS-CMOS Autonomous Switched Oscillator
[2] Gaelle LISSORGUES (ESIEE Paris – France), Pierre NICOLE (THALES Systèmes Aéroportés – France), Julien PAGAZANI (ESIEE – France) ea, A RF tunable Agile Filter: from component to system design
[3] Alessandro SANGINARIO (Istituto Italiano di Tecnologia – Italy), Sarah ZERBINI (STMicroelectronics – Italy), ea, New design methodology for MEMS-electronic-package co-design and validation for inertial sensor systems
[4] Michelangelo GROSSO (ST-POLITO – Italy), Giuliana GANGEMI, Salvatore RINAUDO (STMicroelectronics – Italy) ea, Enabling Smart System Design with the SMAC Platform
[5] Olivier GUILLAUME, Fabio CENNI (STMicroelectronics – France) ea.,SystemC-AMS/MDVP-based modeling for the virtual prototyping of MEMS applications
[6] Fabio CENNI STMicroelectronics – France) ea, Generation of user-defined input stimuli for virtual prototyping of MEMS sensors applications
[7] Benoit VERNAY, Arnaud KRUST (Coventor – France), ea, SystemC-AMS Simulation of a Biaxial Accelerometer based on MEMS Model Order Reduction
[8] Johannes Eisenmenger, Opportunities and challenges of Electronic Design Automation of MEMS-ASIC Systems – A system integrator’s perspective (INVITED)

DTIP 2015 – April 27–30, 2015 – Montpellier, France

DTIP A special session on « Co-design for MEMS based Smart Systems » is organized by Gerold Schröpfer from Coventor, France.

DTIP is a symposium including two main Conferences: the CAD, Design and Test Conference devoted to the development of Computer-Aided Design (CAD) tools and design methodologies for MEMS and MOEMS, and the Microfabrication, Integration and Packaging Conference dedicated to the development of integration technologies and packaging for MEMS and MOEMS. Both conferences share common plenary talks including invited talks, panels and special sessions to allow close interaction between both communities. http://www.dtip-mems.org

Coventor strengthens presence in Taiwan with innovative predictive modeling platform for semiconductor development

SEMulator3D’s virtual fabrication capabilities ideally positioned to help region’s IC ecosystem streamline technology development schedules and manufacturing costs

CARY, North Carolina – April 22, 2015 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced that it has opened an office near Hsinchu Science Park in Taiwan to better serve its growing Taiwan customer base. The move underscores the importance of the company’s SEMulator3D platform for predictive modeling, an approach that changes the way advanced semiconductor technologies are developed by foundries, IDM’s and memory manufacturers. With Taiwan being home to many leading companies in the semiconductor industry, Coventor sees the region as a key area of growth and expansion for the company and its virtual fabrication solution. Coventor is staffing the office with local business and technical experts to work closely with its existing customer base and leverage new opportunities for SEMulator3D, its virtual fabrication platform.
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A Lego Block Approach to MEMS Design

The Smart Systems Integration conference took place in Copenhagen on March 10-12, 2015. We were invited to join a panel discussion with the title “Towards a “Lego block principle” for heterogonous systems design including MEMS and electronics –Choose and put together-fit”. The capital of Denmark felt like the natural place to discuss a “Lego block principle” and so I happily accepted to represent Coventor in the discussion. read more…

Engineering Software Quality Assurance Team Lead – Waltham, MA

Engineering Software Quality Assurance Team Lead – Waltham, MA

We are seeking a BS- or MS-level engineer with a strong interest in 3D modeling and simulation to lead a quality assurance team responsible for testing our advanced semiconductor virtual fabrication software. You will be responsible for coordinating the daily activities of our quality assurance team, which is embedded in a collaborative software development team that is following the Scrum development process. Through continuous engagement with developers, organizing test plans for new features and maintaining regression test suites, you will play a critical role in helping us deliver quality software for both the Windows and Linux platforms. This is an engineering position, not a managerial role, where your strong engineering knowledge will enable you to directly test the software in order to provide effective supervision of your team and valuable input to our software development team. Your compensation will be commensurate with your education and experience.

This regular, full-time position is located in our office in Waltham, MA. Coventor offers comprehensive benefits and is an EEO/AA Employer. You must be a current legal resident of the U.S. or have a valid U.S. visa to apply for this position. Please e-mail a cover letter and resume to job1838@coventor.com

Responsibilities

  • Supervise the daily activities of a team of software quality assurance engineers
  • Digest software specifications and organize plans for systematically testing new engineering functionality
  • Develop, execute and maintain verification test cases for both automatic and manual regression test suites
  • Understand the functionality of our semiconductor virtual fabrication environment
  • Actively participate in our Scrum-based agile development process
  • Submit defect reports and enhancement requests
  • Collaborate with software developers to isolate defects
  • Interact with the applications support team to define realistic test cases
  • Create examples and draft documentation for use in product documentation and marketing collateral

Required Qualifications

  • BS or MS in Electrical Engineering, Mechanical Engineering or a related discipline
  • At least 5 years of work experience as a quality assurance engineer of 3D engineering software such as CAD, CAE or TCAD tools
  • Detail oriented individual who enjoys systematically exploring software
  • Team oriented personality with excellent interpersonal skills
  • Excellent English communication skills (verbal and written)
  • Proficiency with Windows and/or Linux operating systems
  • Scripting skills in Python, MATLAB, or similar scripting language

Desirable Qualifications

  • Semiconductor technology and processing education and experience
  • Basic understanding of numerical modeling algorithms
  • Working knowledge of Agile methodology

Smart Systems Integration – March 11-12, 2015

Smart Systems Integration – March 11-12, 2015 – Copenhagen
International Conference and Exhibition

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Coventor will participate in a panel discussion on March 11, 2015 at 2:45pm, titled: “Towards a ‘Lego Brick Principle’ for Heterogeneous System Design Including MEMS and Electronic – Choose and Put Together – Fit?”

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Defect Evolution in 3D NAND Flash

by Sandy Wen, Semiconductor Process and Integration

3D NAND Flash has become a hot topic in non-volatile memory these days. While planar NAND flash is still going strong, it has been increasingly difficult to scale planar technology past the sub-20nm lengths and meet upcoming memory cell density and cost targets. In a different approach, Toshiba published early work on 3D NAND in 2007 [1] in which flash cells are stacked vertically to increase cell density. Since then, all major flash memory manufacturers have jumped aboard this train with their own flash architectures, and in 2013, Samsung became the first to ship “V-NAND” in the form of a solid state drive.
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2015 IEEE Workshop on Microelectronics and Electron Devices – March 20 2015 – Idaho, USA

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The Thirteenth Annual Workshop on Microelectronics and Electron Devices (WMED 2015). WMED 2015 will provide a forum for reviewing and discussing all aspects of microelectronics including processing, electrical characterization, design, and new device technologies.

Friday, March 20, 2015
Jordan and Simplot Ballrooms
Student Union Building
Boise State University
1910 University Drive
Boise, Idaho 83725

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