I’ve been doing a lot of interviewing as we grow our engineering team. I often say that hiring is the most important part of my job and also the hardest part. Like any sensible technology company, Coventor wants to hire the best engineers we can find. Good engineers love engineering. They love to build, to create, to innovate, to solve problems. Good engineers are methodical and persistent, but also bring engineering judgment and intuition that helps them arrive at solutions efficiently. Good engineers can’t help doing engineering – it’s who they are. Over the years, I’ve observed that good engineers are way more productive than mediocre engineers. The difference in productivity can be astounding, in excess of 2 or 3X for the best engineers. The trick, at least during the hiring process, is to discern which candidates are the good engineers. You can’t just look at academic degrees, skills claimed, or work experience to tell the difference. read more…
Chipmakers are readying their next-generation technologies based on 10nm and/or 7nm finFETs, but it’s still not clear how long the finFET will last, how long the 10nm and 7nm nodes for high-end devices will be extended, and what comes next.
The industry faces a multitude of uncertainties and challenges at 5nm, 3nm and beyond. Even today, traditional chip scaling continues to slow as process complexities and costs escalate at each node. As a result, fewer customers can afford to design chips around advanced nodes.
Posted in: Press Coverage by Sandra Liu | Comments Off on “Problems and Solutions at 7nm” – David Fried Video Interview with Semiconductor EngineeringMonday, July 24, 2017
David Fried, Chief Technology Officer of Coventor, has a discussion with Ed Sperling of Semiconductor Engineering about what’s going on at 7nm, and some of the problems that we’re starting to experience at both 7nm and 5nm.
Posted in: Coventor Blog by Sandra Liu | Comments Off on The Future of MEMS Design: Making MEMS Design More Like CMOS DesignTuesday, July 18, 2017
By: Christine Dufour, MEMS PDK Program Manager
MEMS-based component suppliers want to rapidly ramp their designs into high-volume production. This demand is driving MEMS suppliers to focus on ways to more efficiently re-use established process steps, stacks or technology platforms. To meet this need, we see the emergence of standard MEMS technology and design platforms similar to those used in CMOS design.
The semiconductor industry and EDA vendors have established integrated design environments based on PDKs (Process Design Kits), standard cell libraries, memory architectures, and IP, to give easy access to the technology for IC designers and increase chances of first-pass successful silicon. Coventor’s vision is that the MEMS eco system and MEMS EDA software vendors should play a similar role in accelerating MEMS product development. read more…
Posted in: Press Coverage by Sandra Liu | Comments Off on Scaling the Analytic Mountains – How Big Data is Changing the Course of the Semiconductor IndustryFriday, July 14, 2017
By Amelia Dalton
It’s coming. He knows it is. It’s only a matter of time before it buries him. His story is not unique. It’s been played out in our industry over and over again. He’s suffering from BUAMODS – or – Buried Under A Mountain Of Data Syndrome. But what’s the cure for this ailment? How do we dig ourselves out from underneath this mountain of analytics? In this week’s episode of Fish Fry, we strike at the very heart of this issue. Dr David Fried (CTO – Coventor) joins us to discuss how big analytics are changing the course of the semiconductor industry. We talk about the value of process variant experiments and how process modeling will affect the future of advanced 3-D technologies. Also this week, we check out a new 3-D prototype chip from MIT and Stanford University that combines data storage and computing in a single chip with a little help from multiple nanotechnologies.
While chipmakers are keen to move to the 7nm node, the use of ‘tricks’ to extend the life of optical lithography, amidst a continuing wait for EUV, is piling up the design challenges.
“In the last five to six years, we have gone through six to seven nodes, starting with variants of 28nm,” said Balaji Velikandanathan, quality engineer at Qualcomm, in a panel session at June’s Design Automation Conference. “We are talking about [moving from] inception to tapeout in nine months and [introducing] a new process node every year.”
Qualcomm wants to move to 7nm to push frequency to 3GHz and reduce power by 30%, compared to the 10nm Snapdragon 835 used in phones such as the HTC U11.