Coventor recently sponsored an expert panel discussion at IEDM 2017 to discuss how we might advance the semiconductor industry into the next generation of technology. The panel discussed alternative methods to solve fundamental problems of technology scaling, using advances in semiconductor architectures, patterning, metrology, advanced process control, variation reduction, co-optimization and new integration schemes. Our panel included Rick Gottscho, CTO of Lam Research; Mark Dougherty, vice president of advanced module engineering at GlobalFoundries; David Shortt, technical fellow at KLA-Tencor; Gary Zhang, vice president of computational lithography products at ASML; and Shay Wolfling, CTO of Nova Measuring Instruments.
By Bryon Moyer
Companies come; companies go. I don’t focus a lot on who buys whom – there are plenty of folks breathlessly watching that stuff, so I mostly leave the drama to them. After all, it’s an age of consolidation and accumulation of immense corporate power. So your typical low- to mid-level merger may not be particularly noteworthy.
But lately, there have been a couple of mergers/acquisitions that have had some unusual features to them. Add to that the fact that they’re companies we’ve looked at before, and it seems worth spending some time on them.
New, advanced semiconductor processing and architectural technologies take years to perfect and put into production. In the meantime, semiconductor customers continue to demand faster, smaller and higher functioning devices. Semiconductor manufacturers need to decide whether (and when) to jump to the next generation of devices and production technologies, weighing the risk and benefit of bringing the next processing and architecture technologies to market. read more…
For Immediate Release
For more information, contact:
SEMulator3D Honored as UBM ACE Award Finalist
Coventor’s Virtual Fabrication Platform Recognized for Significantly Improving Electronics Manufacturing
CARY, NC– November 17, 2017 – Coventor®, Inc. a Lam Research Company and leading supplier of virtual fabrication solutions for semiconductor and micro-electromechanical systems (MEMS) devices, today announced its 3D virtual fabrication platform, SEMulator3D®, has been named a finalist in UBM’s annual ACE Awards competition.
The ACE (Annual Creativity in Electronics) Awards, in partnership with EE Times and EDN, showcase the best of the best in today’s electronics industry, including the hottest new products, start-up companies, design teams, executives, and more. ACE finalists and winners are hand selected by a panel of EE Times and EDN editors as well as independent judges from the across the industry. read more…
By MARK LAPEDUS
The overlay metrology equipment market is heating up at advanced nodes as the number of masking layers grows and the size of the features that need to be aligned continue to shrink.
Both ASML and KLA-Tencor recently introduced new overlay metrology systems, seeking to address the increasing precision required for lines, cuts and other features on each layer. At 10/7nm, there may be 80 or more masking layers, versus 40 at 28nm. And if those layers are not precisely measured, the features being patterned, deposited and etched may not line up from one layer to the next.
By Francoise von Trapp
It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to find out what’s new.
By R. Colin Johnson
SAN JOSE, Calif.—Why did Lam Research, a semiconductor fab equipment supplier, acquire Coventor, a software house hawking software to design microelectromechanical system (MEMS) chips and sub-10 nanometer semiconductors such as 3D finFETs?
Analysts fully expected for Coventor to be absorbed by Lam Research, only to surface as a Lam software offering. But at SEMI’s MEMS & Sensor Executive Congress 2017 (MSEC) here the companies reported that they are staying in separate headquarters, depending more the synergy of co-designing hardware for software and visa versa to give them a competitive edge over the competition.
By Ed Sperling
The MEMS sector is beginning to look more promising, bolstered by new end-market demand and different packaging options that require more advanced engineering, processes and new materials. All of this points to higher selling prices, which are long overdue in this space.
For years, the market for microelectromechanical systems was populated by too many companies vying for too few opportunities. Some devices became commoditized to the point where costs failed to keep up with selling price reductions. Even in the more specialized and higher-margin fringes of this segment, such as MEMS-based microphones and speakers, market sizes were too small to support more than a handful of smaller companies.