The Week In Review: Manufacturing

By Mark Lapedus

Winners, losers in Toshiba bid; GF RF; virtual fab; EUV inspection; VC funds; memory trends; chip drivers.

Coventor has announced the availability of SEMulator3D 6.1 — the latest version of its semiconductor virtual fabrication platform. According to the company, this new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements. Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.

“The real break-through here is our ability to drive technology yield ramp actions by optimizing process steps and process variation in a statistical environment. Important process parameters can be statistically analyzed to identify areas of concern with structural measurements, yield checks and electrical specifications” said David Fried, CTO of Coventor. “Now, our users can automate the large statistical design of experiments (DOEs) for virtual fabrication, to minimize critical defects and maximize device performance and yield.”

read the full article here.

Special Events at Semicon West 2017

Listen to a presentation on smart manufacturing and process modeling, and discover how they will revolutionize the development of semiconductor devices. Learn about the latest techniques in semiconductor process modeling, and how this new “virtual fabrication” technology can accelerate time to market for advanced semiconductor technologies. See real-life examples of virtual fabrication in action, during daily product demonstrations by Coventor at Booth #7847.

Mark your calendar to take advantage of these great opportunities to see and hear more about the future of semiconductor process development at SEMICON West 2017:

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2018 Hilton Head – June 3-7, 2018, Hilton Head Island, SC

2018 Hilton Head

CMOS Image Sensors (CIS): Past, Present & Future

By: Sofiane Guissi, Semiconductor Process & Integration Engineer, Coventor

Over the last decade, CMOS Image Sensor (CIS) technology has made impressive progress. Image sensor performance has dramatically improved over the years, and CIS technology has enjoyed great commercial success since the introduction of mobile phones using on-board cameras. Many people, including scientists and marketing specialists, predicted 15 years earlier that CMOS image sensors were going to completely displace CCD imaging devices, in the same way that CCD devices displaced video capture tubes during the mid-1980’s. Although CMOS has a strong position in imaging today, it has not totally displaced CCD devices. On the other hand, the drive into CMOS technology has drastically increased the overall imaging market. CMOS image sensors have not only created new product applications, but have also boosted the performance of CCD imaging devices as well. In this paper, we describe the state-of-the-art in CMOS image sensor technology and discuss future perspectives.

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CDNLive 2018 – May 7-9, Munich, Germany

CDNLive 2018

MEMS Engineer Forum (MEF) 2018 – April 25-26, 2018, Tokyo, Japan


MEF 2018

The Smart Systems Integration Conference 2018 – April 11- 12, 2018, Dresden, Germany


The Smart Systems Integration Conference 2018

Paper at the conference: New Advancements in Using Statistical Models as Part of a Standard MEMS Design Flow

Author: Christine Dufour, Christof Hielscher

IEEE INERTIAL SENSORS & SYSTEMS 2018 – March 26-29, 2018, Italy