Semiconductor Process and Integration Engineer – Japan
We are seeking a BS/MS/PhD-level engineer who has experience and expertise in semiconductor process integration and fabrication. You will work with leading semiconductor companies to implement our virtual fabrication solution for their most advanced development programs, including advanced CMOS, DRAM and 3D NAND Flash technologies. You will collaborate with the Semiconductor Process & Integration team along with our highly skilled software development team, to create integration and modeling solutions for industry-critical manufacturing challenges.
This is a hands-on engineering position, requiring proficiency in full flow semiconductor process integration and script programming (python) as well as strong communication and presentation skills. Your title, level of responsibility, creative freedom and salary will be commensurate with your education and experience.
Location: Japan(Shin-Yokohama or Yokkaichi city). This position requires residency in Japan with a substantial amount of time at customer sites in Japan. Work is expected to be partly based at customer/partner sites. Travel is expected.
Education: Bachelor’s degree required, Master’s degree or Ph-D preferred, in related fields of Electrical Engineering, Chemical Engineering, Materials Science or Applied Physics.
Experience: Semiconductor Technology and Processing education and experience is required. Relevant employment experience in the semiconductor industry is required.
Skills: Semiconductor Processing and Integration, Semiconductor Device Physics (preferred), Computer-Aided Design (CAD) and Modeling, Python scripting language, Technical Writing , Fluency in English and Japanese, Communication and Presentation (spoken and written).
If you are interested in this opportunity and you are authorized to work in Japan, e-mail your cover letter and CV in English to firstname.lastname@example.org .