Coventor Blog

MEMS Microphones – A Bright Spot among Commoditized Consumer Sensors

By: Jun Yan, Ph.D., MEMS Technical Director

MEMS Microphone picture

Source: InfineonTechnologies, AG, “The Infineon Silicon MEMS Microphone”, DOI:10.5162/sensor2013/A4.3

MEMS microphones have emerged as a bright spot among consumer sensors, which in general are going through a rapid commoditization and profit-squeezing trend.

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Semiconductor Process Development: Finding a Faster Way to Profitability

By: Katherine Gambino, Strategic Accounts Manager

Intel Fab

Building a chip fabrication facility requires billions of dollars in investment for land, buildings, processing equipment, chemical and hazardous material safety, not to mention the deployment of hundreds of highly experienced process engineering and manufacturing personnel. Bringing up an advanced semiconductor process in any fab, new or established, is a several-hundred-million dollar effort, typically requiring two or more years of experimentation with process equipment and process recipes, led by engineers with years of process integration and chip manufacturing expertise.

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The Value of Integrating Process Models with TCAD Simulation (and some tips on how to do it)

By: Shi Hao (Jacky) Huang, PhD, Semiconductor Process & Integration Engineer

Coventor January 2017 Blog Graphic

Coventor January 2017 Blog Graphic 2

 

 

 

 

Nowadays, novel semiconductor technologies have brought complex process flows to the fab.   These process flows are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, and their effect on a novel device, prior to physical fabrication.

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BEOL Barricades: Navigating Future Yield, Reliability and Cost Challenges

By: David Fried, Ph.D., Chief Technology Officer, Semiconductor

Figure 1. M2-V1 process flow after (a) M2-L1 lithography, (b) M2-L2 litho, (c) V1 partial etch, (d) BLok open and (e) CuBS.

Coventor recently assembled an expert panel at IEDM 2016, to discuss changes to BEOL process technology that would be needed to continue dimensional scaling to 7 nm and lower. We asked our panelists questions such as: read more…

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Bringing Advanced Semiconductor Manufacturing Technologies to Higher Education

By: Jimmy Gu, Ph.D., Semiconductor Process & Integration Engineer, Coventor

Campus image for November 2016 blog

Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of scientists and engineers must learn about the practical methods used to design and manufacture the latest generation of semiconductor products. read more…

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Achieving the Vision of Silicon Photonics Processing

By: Sandy Wen, MSEE, Semiconductor Process and Integration Engineer, Coventor

Silicon Photonics Test Die

Silicon Photonics Test Die

With the increasing need for faster data transfer rates, the transition from electrical to optical signaling in data processing is inevitable.   Copper cabling cannot keep up with the upcoming data center bandwidth requirements, for applications such as multimedia streaming and high performance computing.  One technology that could enable true optical communication is silicon photonics. read more…

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Design Process Technology Co-Optimization for Manufacturability

By:   Dalong Zhao – Semiconductor Process & Integration Engineering

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products.   Meeting yield and product cost targets is a continuous challenge, due to new device structures and increasingly complex process innovations introduced to achieve improved product performance at each new technology node.  Design for manufacturability (DFM) and design process technology co-optimization (DTCO) are widely used techniques that can ensure the successful delivery of both new processes and products in semiconductor manufacturing.   In this article, we will discuss how 3D (3 dimensional) DTCO can be used to improve product yield and accelerate product delivery dates in semiconductor manufacturing. read more…

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Pattern Dependence Process Modeling

By:   Joseph Ervin, Director – Semiconductor Process & Integration Engineering

First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, by visualizing process variation problems “virtually” prior to actual fabrication.  In some instances, a deeper level of complexity needs to be added to the process model to capture the effects of variation in the process.  read more…