Coventor Blog

SEMulator3D 5.0 – It’s ALMOST HERE!!!!

By David M. Fried

I said I’d follow up with another blog about new features and capabilities SEMulator3D 5.0… and I’m running out of time. The Gold release is less than a week away!!
In the last blog, I gave a general overview of the new release and I talked about the all new dopant-handling capabilities, so let’s just jump right into another topic…Visibility!
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Collaboration Brings Fast Analysis to Acoustic Resonator Design

By Mattan Kamon

After some lively conversations with the top researchers in MEMS acoustic resonators during the 2014 Sensors and Actuators Workshop (familiarly known to the MEMS community as “Hilton Head”) we were motivated to develop a simulation solution that would better serve these researchers as well as commercial designers. With the recent release of CoventorWare 10, we introduced a new fast analysis capability for acoustic resonators that is unique in the industry and I’m excited to blog about it here.
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Don’t miss new Cloud-Based 3D Design-Technology Checking (3D-DTC) demo at DAC!

DAC 2015 is in full swing in San Francisco this week, and Coventor is there again. But this year, we’re also doing a special joint demonstration with Silicon Cloud International. This demonstration combines the power of Coventor’s SEMulator3D Virtual Fabrication platform with broad parallel computing offered by Silicon Cloud to produce a whole new capability that we call “3D Design-Technology Checking” or 3D-DTC for short (not DRC!).
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SEMulator3D 5.0 – It’s COMING!!!

5/12/15
David M. Fried

This is my favorite part of the year at Coventor: We’re about to do another MAJOR release of SEMulator3D. Developers are sprinting to the finish line, customers are clamoring for the newest features. I’d like to start talking about the new features of SEMulator3D 5.0, but one blog certainly won’t cover it all. Let’s get started, and we’ll do this as many times as we need to get it all written down.
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MEMS System Co-Design at DTIP

By Gerold Schröpfer

The 17th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2015) took place this year in Montpellier, Southern France, on April 28-30. This conference brings together participants interested in MEMS fabrication with those interested in design tools and methods. While this annual event is always located in Southern Europe, it attracts attendees from both industry and academia from around the world. read more…

A Lego Block Approach to MEMS Design

The Smart Systems Integration conference took place in Copenhagen on March 10-12, 2015. We were invited to join a panel discussion with the title “Towards a “Lego block principle” for heterogonous systems design including MEMS and electronics –Choose and put together-fit”. The capital of Denmark felt like the natural place to discuss a “Lego block principle” and so I happily accepted to represent Coventor in the discussion. read more…

Defect Evolution in 3D NAND Flash

by Sandy Wen, Semiconductor Process and Integration

3D NAND Flash has become a hot topic in non-volatile memory these days. While planar NAND flash is still going strong, it has been increasingly difficult to scale planar technology past the sub-20nm lengths and meet upcoming memory cell density and cost targets. In a different approach, Toshiba published early work on 3D NAND in 2007 [1] in which flash cells are stacked vertically to increase cell density. Since then, all major flash memory manufacturers have jumped aboard this train with their own flash architectures, and in 2013, Samsung became the first to ship “V-NAND” in the form of a solid state drive.
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Modeling as a Foundation for TSensors Acceleration

By Steve Breit, VP Engineering
November, 2014

I gave a talk with the same title as this blog at the TSensors Summit held in La Jolla, California on November 12-13. The ‘T’ in TSensors stands for Trillion Sensors and the TSensors Summit initiative is addressing the provocative question: what will it take to get to a worldwide market of a trillion sensors a year in the not-too-distant future, say 10 to 15 years from now. The TSensors initiative is being spearheaded by serial MEMS entrepreneur Janusz Bryzek who cites the book Abundance by Peter Diamandes and Steven Kotler as inspiration for TSensors. The key premise behind the book is that technology is advancing at such a fast rate, exponentially in fact, that we have the opportunity to provide abundant food, clean water, renewable energy and health care for everyone on earth within a generation. This is heady stuff, especially compared to the doom and gloom that pervades the daily news (if only political and cultural differences were as easy to resolve). Sensors of all types will play a key role in technological solutions to these pressing worldwide challenges.
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