Press Releases

Coventor Announces SEMulator3D 6.1 and New Analytics Capabilities

Coventor’s Virtual Fabrication Platform Provides Statistical Insight into Process Variation Challenges

For Immediate Release:  June 22, 2017
For more information, contact:  Toni Sottak, (408) 876-4418, toni@wiredislandpr.com

Image: New in SEMulator3D 6.1, the Analytics module provides statistical insight into semiconductor process variation

CARY, NC– June 22, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.1 – the latest version of its semiconductor virtual fabrication platform.   This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements.  Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform. read more…

Special Offers and Events at Semicon West 2017

Listen to a presentation on smart manufacturing and process modeling, and discover how they will revolutionize the development of semiconductor devices. Learn about the latest techniques in semiconductor process modeling, and how this new “virtual fabrication” technology can accelerate time to market for advanced semiconductor technologies. See real-life examples of virtual fabrication in action, during daily product demonstrations by Coventor at Booth #7847.

Mark your calendar to take advantage of these great opportunities to see and hear more about the future of semiconductor process development at SEMICON West 2017:

 

Talk:  “3D Model-Based Process Control for the Future of Smart Manufacturing”

What:
Talk at SMART Journey: “3D Model-Based Process Control for the Future of Smart Manufacturing” at SEMICON West 2017

When:
Wednesday, July 12 from 2:00-2:30 p.m. (Add to calendar)

Where:
SMART Journey: Meet The Experts – Smart Manufacturing
(SMART Journey Theater, Booth 7237, Moscone West, Level 1)

Abstract:
Advanced CMOS and memory technologies are becoming more structurally complex at an amazing rate.  In Logic CMOS, just since 65nm, we have introduced embedded stressor source/drains, replacement high-k/metal-gates, FinFETs, complex multi-patterning schemes and many more structural innovations.  NAND Flash has moved from conventional planar bit-lines to amazing 3D vertical bit-lines.  DRAM continues (against all odds) to scale the bit-cell area, by burying the word-line, using amazingly high-aspect ratio capacitors and employing even more complex multi-patterning schemes.  In all of these innovations, the semiconductor industry has taken effectively “top-down processing capabilities” from the planar era, and applied them to 3D structures, using surfaces (ie, sidewalls) that were not previously employed in devices.  The next set of logic and memory innovations will certainly continue this trend, even employing the processes to use surfaces not-visible from top-down observation. Gate-All-Around (GAA) or Nanowire devices, for example, will have critical structural requirements underneath the device, representing a whole new paradigm of challenges both for metrology and process.  Process enhancements, such as Atomic Layer Deposition (ALD) and Atomic Layer Etching (ALE) will be required. Metrology improvements from Optical Critical Dimension (OCD) and X-Ray measurement techniques (XRD, XRR,etc.) will be required.  But the integrated complexity of these processes and patterning schemes will also drive a new era in advanced model-based process control that links the most advanced metrology and inspection results with the most advanced processes and equipment-level controls through feed-forward and feed-back control schemes.

Improved process yield in these advanced technologies will rely on the reduction of total process variation: tool-to-tool, lot-to-lot, wafer-to-wafer and across-wafer.  Traditional process yield-ramp activity has been aimed at reducing the variation of all individual steps of the process.  However, each of these individual processes and their associated control parameters have developed quite differently, resulting in unique opportunities to use some processes to compensate for uncorrectable variations arising from other processes.  This improvement will not rely on static process adjustments, but on active control of many processes in real time.  In order to deliver the control information for state-of-the-art processes on advanced device structures at the pace of manufacturing, high speed 3D process modeling is required. This 3D model will aggregate all of the measured variation from prior processing into a silicon-accurate prediction of the current state of the critical device structures on each wafer.  Using computational methods to form this prediction on multiple critical design features at multiple locations on every wafer will enable a new level of feed-forward process control using the newest controls being deployed on process equipment today. This type of 3D model-based process control will be especially critical to the processes and structures where metrology is able to provide only partial information on the nature of variations, which is often the case in these advanced device structures of the next generation. Attendees at this discussion will gain an understanding of high-speed 3D process modeling and how model-based process control can be used to improve process yield of advanced semiconductor technologies.

Who:
Dr. David M. Fried, is Chief Technology Officer (CTO) of Coventor, where he is responsible for the company’s strategic direction and implementation of its SEMulator3D virtual fabrication 3D process modeling solution. He leads the execution of technology strategy for technology platforms, partnerships, and external relationships. His expertise touches upon such areas as Silicon-on-Insulator (SOI), FinFETs, memory scaling, strained silicon, and process variability. Fried is a well-respected technologist in the semiconductor industry, with 56 patents to his credit and a notable 14-year career with IBM, where he was involved in successive process generations from 65-nanometer and lower. His most recent position was 22nm Chief Technologist for IBM’s Systems and Technology Group. He has Masters and Doctoral degrees in Electrical Engineering from Cornell University.

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Presentation:  “Virtual Fabrication – Changing the Trajectory of Chip Manufacturing”

What:
Presentation: “Virtual Fabrication – Changing the Trajectory of Chip Manufacturing” in conjunction with SEMICON West 2017

When:
Wednesday, July 12 from 8:00 a.m. – 12:00 noon (Add to calendar)

Where:
New York State Nanotech Summit
(PARC 55 Hotel, 55 Cyril Magnin Street, San Francisco, CA)
Pre-registration is required at no cost: https://sunypoly.edu/new-york-nanotech-summit/

Who:
Sandy Wen is a semiconductor and process integration engineer at Coventor. Previously, she worked at Applied Materials in the etch business group in various engineering functions, including chamber engineering and yield enhancement solutions.  Sandy received her MS in EE from UCLA, and BS in EECS from UC Berkeley.

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Product Demonstrations during SEMICON West 2017

What:
Coventor will be showcasing its novel techniques and methodologies to enable rapid acceleration from semiconductor concepts to manufacturing-ready products at SEMICON West 2017. Stop by our booth (#7847) to meet our technology experts, and sit in on a real-life product demonstration using the latest version of SEMulator3D.

The SEMulator3D platform provides a complete virtual fabrication environment
that parallels the capabilities of actual fabs. Use SEMulator3D to develop and
optimize manufacturing process flows, reducing time consuming and costly
experimental fabrication cycles.

When:
Daily at 11 am (Add to calendar) and 3pm (Add to calendar)

Where:
Coventor Booth #7847

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Raffle at SEMICON West 2017

Coventor will be giving away a $300 Amazon Gift Card during the conference. Register here to be entered for a chance to win the prize. Scan your badge at our booth (#7847) during SEMICON West 2017, and you will be entered a second time into the raffle to increase your odds of winning the $300 Amazon Gift Card!  The winner will be notified via email at the end of the conference.

*Only one(1) contest entry per person. All raffle entries must be submitted on or before 4:00 p.m. PDT on Thursday, July 13, 2017. Odds of winning the prize are dependent upon the number of entries received. We will not sell your address or personal information as part of this promotion. A valid email address is required from all contestants, to allow the contest winner to be contacted at the conclusion of the promotion. Your registration for this conference confirms your acceptance of all Terms and Conditions described herein.

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Coventor Launches CoventorMP 1.0, a New Unified Environment for Designing MEMS for IoT Devices

Coventor’s advanced design platform provides seamless MEMS/IoT design and integration

CARY, NC– May 10, 2017 – Coventor®, Inc., the global market leader in design automation solutions for microelectromechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices, today announced the immediate availability of CoventorMP® 1.0, a new unified MEMS design platform. CoventorMP 1.0 combines the complementary strengths of Coventor’s industry-leading software tools for MEMS design, CoventorWare® and MEMS+®, into a single powerful environment for MEMS design automation. The new platform provides a cohesive environment where designs can be entered once and used to create conventional finite element models (CoventorWare) and compact finite element models (MEMS+). CoventorMP 1.0, which includes enhanced versions of CoventorWare (Version 10.2) and MEMS+ (Version 6.2), provides a seamless path for integrating MEMS sensors and actuators into System-in-Package (SiP) components targeted at Internet of Things (IoT) devices. read more…

AIM Photonics Welcomes Coventor as Newest Member

 

 

 

 

For Immediate Release: March 16, 2017

Contact:
Laura Magee (ESD) | laura.magee@esd.ny.gov | (716) 846-8239 | (800) 260-7313
ESD Press Office | PressOffice@esd.ny.gov | (800) 260-7313
Steve Ference (AIM) | sference@sunypoly.edu | 518-956-7319

CUS-Backed Initiative Taps Process Modeling Specialist to Enable Manufacturing of High-Yield, High-Performance Integrated Photonic Designs

Today’s Announcement Builds On Progress Of Finger Lakes Forward, The Region’s Award-Winning Strategic Plan To Generate Robust Economic Growth And Community Development

ROCHESTER, NY and CARY, NCThe American Institute for Manufacturing Integrated Photonics (AIM Photonics), a public-private partnership advancing the nation’s photonics manufacturing capabilities, and Coventor®, Inc., a semiconductor process modeling software company, today announced Coventor as the newest member of AIM Photonics. Coventor will provide access to its unique, physics-driven 3D modeling technology to improve the performance and manufacturability of complex, integrated photonic designs. read more…

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And They’re Off…. Worldwide MEMS Design Contest Officially Starts

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Cadence, X-FAB, Coventor and Reutlingen University Select 10 Design Teams as Semi-Finalists

Cary, NC, March 15, 2017Cadence Design Systems, Coventor, X-FAB and Reutlingen University – joint sponsors of the worldwide MEMS Design Contest – today announced the commencement of the design phase of the contest with the selection of ten semi-finalist teams who will compete for the top prize. The contest was created to highlight and encourage the development of innovative MEMS and mixed-signal designs projects. Contest organizers carefully evaluated submissions from all over the world and selected the ten most innovative ideas to be further explored and developed during the design stage of the contest. Submissions ranged from teams of two to nine, addressing areas such as surgical robots, energy harvesting and automotive Heads Up Display (HUD) applications. read more…

Coventor Unveils New Scientific Findings on Lithography Processing For Improved Semiconductor Scalability and Performance

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At SPIE Advanced Lithography 2017, Coventor Will Present Results of Studies to Increase Density and Yield of Next-Generation Semiconductor Devices

CARY, NC– February 13, 2017 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), will present findings from its research on advanced semiconductor fabrication processes at SPIE Advanced Lithography 2017. The results of these studies provide insight into techniques for advancing the state-of-the-art in semiconductor technology through use of new and emerging photomask, lithography and process technologies. read more…

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Coventor in the News – Silicon Photonics

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Coventor in the News

Photonics in Silicon R&D Toward Tb/s

By Ed Korczynski, Sr. Technical Editor, Semiconductor Manufacturing & Design

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The client:server computing paradigm colloquially referred to as the “Cloud” results in a need for extremely efficient Cloud server hardware, and from first principles the world can save a lot of energy resources if servers run on photonics instead of electronics. Though the potential for cost-savings is well known, the challenge of developing cost-effective integrated photonics solutions remains. Today, discrete compound-semiconductor chips function as transmitters, multiplexers (MUX), and receivers of photons, while many global organizations pursue the vision of lower-cost integrated silicon (Si) photonics circuits. read more…

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SEMulator3D from Coventor Wins “Best of the West” Product Award

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Coventor’s Virtual Fabrication Platform Recognized for Its Significant Impact on Improving Electronics Manufacturing

CARY, NC– July 27, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced its SEMulator3D® 6.0 won the 2016 “Best of the West” award sponsored by Solid State Technology and SEMI at SEMICON West.  This prestigious industry award recognizes the product and technology developments that contributed the most significant improvements to the electronics manufacturing supply chain.  Coventor’s SEMulator3D was selected for the significant financial, scientific and social impact it has had on the industry.     read more…