Upcoming Events

SISPAD – September 9 – 11, 2014 – Yokohama, Japan

SISPAD
2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9 – 11, 2014

SISPAD
Co-sponsored by The Japan Society of Applied Physics
Technical co-sponsored by The IEEE Electron Devices Society

This conference provides an opportunity for the presentation and discussion of the latest advances in modeling and simulation of semiconductor devices, processes, and equipment for integrated circuits.

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MOS-AK ESSDERC/ESSCIRC Workshop- September 26 – Venice

MOS-AK Meetings are organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/Spice modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development, implementation, deployment and standardization within the main theme – frontiers of the compact modeling for nm-scale MEMS designs and CMOS/SOI circuit simulation.

Coventor will present details of its virtual fabrication modeling solution, SEMulator3D, an innovative platform for significantly reducing the time and cost involved in developing next generation semiconductor and MEMS manufacturing processes.

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SEMICON Europa 2014 – October 7-9, 2014

SEMICON Europa 2014, October 7-9, 2014, in Grenoble France

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EMICON Europa to rotate between Dresden and Grenoble
Co-located with Plastic Electronics 2014

Date: 7-9 Oct 2014
Location: Grenoble, France
Venue: Alpexpo

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MEMS Executive Congress 2014 – Nov 5-7, 2014 – Scottsdale AZ

MEMS Executive Congress 2014 – Nov 5-7, 2014 – Scottsdale AZ

“The single best conference in the world of MEMS.”

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The compelling reasons why thousands of OEMs have successfully chosen MEMS devices to create competitive advantages for themselves in both sustaining innovation and disruptive innovation business models include these: MEMS-based solutions yield product cost advantages for a given functionality; employing MEMS devices usually results in a reduced BOM for a given product, and the lower parts count for MEMS-based products enables a more efficient supply chain; the inherent compatibility of MEMS devices with CMOS electronics simplifies design cycles and speeds time-to-market; MEMS components typically demonstrate less power consumed per a given function than do other, macro-based solutions; and the fact that MEMS device and product reliability is as good as any reliability can be – MEMS devices can deliver military / automotive / medical device-class reliability in rugged, real-world applications.
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2014 IEEE International Electron Devices Meeting – December 15-17, 2014 – San Francisco, CA

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2014 IEEE International Electron Devices Meeting
Hilton San Francisco Union Square
333 O’Farrell Street
San Francisco, CA USA
December 15-17, 2014

The Annual Technical Meeting of the Electron Devices Society

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SPIE Advanced Lithography – February 22-26, 2015

SPIE Advanced Lithography, February 22-26, 2015, in San Jose, CA.

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San Jose Marriott and San Jose Convention Center
San Jose, California, United States
22 – 26 February 2015

SPIE is a highly regarded exhibition for the industry’s top semiconductor suppliers, integrators, and manufacturers. 61 exhibiting companies in 2014.

http://spie.org/advanced-lithography.xml