Press Coverage

Are We There Yet? The Road to 7nm is Paved with Predictive Modeling

 By Amelia Dalton

Sometimes the road less traveled is less traveled for a reason. (Jerry Seinfeld)

We know what roads will lead us to the 7nm semiconductor node and frankly, they’re not all that scenic. In this week’s Fry Fry, we tackle the trials and tribulations of this tiny titan with David Freid from Coventor. David and I discuss the biggest challenges we will face at this smallest of the small process geometry, how virtual fabrication and predictive modeling can help solve some of our problems, and why the most important question surrounding this new node isn’t being asked: “Should we even go to 7nm?”

Listen to the podcast here.

Brainstorm: Wearables

ProductDesignDevelopment By PD&D Staff, Product Design and Development

In the Product Design & Development Brainstorm, we talk with industry leaders to get their perspective on issues critical to the design engineering marketplace.

In this issue, we ask: What are some of the key technology trends that will shape the evolution of the wearables market?

read the full article here

RC extraction from ‘virtual fab’ models may speed PDK availability

Tech Design Forum Logo By Luke Collins, Tech Design Forum

Coventor has updated its SEMulator3D virtual fabrication tool so it can extract predicted resistance and capacitance values from its models. The analysis tool could be used to speed up the availability of early PDKs for rapidly evolving processes.

SEMulator3D abstracts IC manufacturing steps into behavioural models, so that it can simulate a a whole process in a ‘virtual fab’. Because the process steps are modeled using behavioural abstractions, rather than full physics, it becomes practical to run multiple options to explore how variations in each step will affect overall outcomes.

read the full article here

DAC: Coventor Adds Electrical Analytics to SEMulator3D Version 6.0

ee-timesBy R. Colin Johnson, EE Times

LAKE WALES, Fla.—What began as a microelectromechanical systems (MEMS) 3-D design tool has transformed into a 3-D semiconductor design tool which has accordingly added Electrical Analytics to the latest version six of Coventor’s SEMulator3D. See Coventor’s SEMulator3D at the Design Automation Conference (DAC 2016, Austin, Texas, June 5-9), booth 321.

Besides chip designers—now its biggest user segment—are systems designers who, the company claims, make up its fastest growing customer segment. System designers are most interested in how process variations impact their product’s yield robustness, according to David Fried, chief technology officer (CTO) of semiconductors for Coventor.

read the full article here

Inside Process Technology

se_logo

By Mark Lapedus

Semiconductor Engineering sat down to discuss the foundry business, memory, process technology, lithography and other topics with David Fried, chief technology officer at Coventor, a supplier of predictive modeling tools. What follows are excerpts of that conversation.

SE: Chipmakers are ramping up 16nm/14nm finFETs today, with 10nm and 7nm finFETs just around the corner. What do you see happening at these advanced nodes, particularly at 7nm?

Fried: Most people are predicting evolutionary scaling from 14nm to 10nm to 7nm. It’s doubtful that we will see anything really earth-shattering in these technologies. And so, a lot of the challenges come down to patterning. We are going to see multi-patterning schemes really take hold at more levels. For example, the fins are now based on self-aligned double patterning. People will move into self-aligned quad patterning. The gates are maybe self-aligned double. Now, they will move into self-aligned quad. So, that’s going to be a big expense, because each level is going to have multiple passes and multiple cuts.

read the full article here

Tagged , , , , , , , , , , , , , , , , , , , , ,

Multi-Beam Market Heats Up

se_logoBy Mark Lapedus

The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market.

In one surprising move, Intel is in the process of acquiring IMS Nanofabrication, a multi-beam e-beam equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer technology.

As a result of the moves, the Intel/IMS duo and NuFlare will now race each other to bring multi-beam mask writers into the market. Still in the R&D stage, these newfangled tools promise to speed up the write times for next-generation photomasks, although there are still challenges to bring this technology into production.

read the full article here

Tagged , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,

MEMS Grand Challenge Debuts

ee-timesBy R. Colin Johnson, EE Times

LAKE WALES Fla.—Simplfying and popularizing microelectromechanical system (MEMS) design is the goal of the MEMS Design Contest announced yesterday (March 16) at the conference titled Data Automation and Test in Europe (DATE 2016, March 15 to 17, Dresden, Germany). More specifically, the contest encourages chip designers to add MEMS blocks to a chip design, using tools designed for the purpose.

Sponsored by Cadence Design Systems, Coventor, X-FAB and Reutlingen University, the contest will feature a special process design kit (PDK) that the winners will use to fabricate their MEMS chip at X-Fab. If interested attend the DATE session Launch of the Worldwide MEMS Design Contest.

read the full article here

Tagged , ,

7nm Lithography Choices

se_logoBy Mark Lapedus

Chipmakers are ramping up their 16nm/14nm logic processes, with 10nm expected to move into early production later this year. Barring a major breakthrough in lithography, chipmakers are using today’s 193nm immersion and multiple patterning for both 16/14nm and 10nm.

Now, chipmakers are focusing on the lithography options for 7nm. For this, they hope to use a combination of two technologies at 7nm—extreme ultraviolet (EUV) lithography, and 193nm immersion with multi-patterning.

read the full article here

Tagged , , , , , , , , , , , , , , , , , , , , , , , , , , , , , ,