Press Coverage

New Release of Semulator3D at #semiconwest

SemiWiki,
by Paul McLellan

One of Coventor’s flagship products is SEMulator3D, and at Semicon West they announced a new version, 2014.100.

SEMulator3D is a powerful 3D semiconductor and MEMS process modeling platform. It uses highly efficient physics-driven voxel modeling technology. It models the physical effects of process steps, which is where all the current challenges are.

Combining the two-dimensional design layout with the process description gives it the capability to model the process flows and determine what will be manufactured with that combination of layout and process. The basic idea, as with all modeling, is to enable experiments to be done quickly and efficiently. Since the alternative is to actually build chips and then take measurements, which is millions of dollars of investment and months of delay, the virtual fabrication route is especially attractive. This is especially important in the early stages of process development since it can drastically shorten the whole development and ramp to volume roadmap.
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Coventor Brings More Accuracy & Performance into Design of MEMS Devices

by Pawan Fangaria
SemiWiki

Although MEMS devices in various forms are now found in most electronic devices, predominantly in mobile, automotive, aerospace and many other applications, their major revolution, I believe, is yet to happen. We are seeing rapid innovation in MEMS reflected by their improvements in precision, performance, size reduction, and the continuing evolution of new devices with increasing complexities. The micro level fabrication of MEMS will enable unprecedented use of these into newer and newer semiconductor based electronic devices that will revolutionize the so called IoT arena. MEMS will be essential to IoT products’ ability to connect every aspect of our life, things and happenings around us and provide us ultimate knowledge, control, security through a wide range of devices in many form factors and environments.
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Virtual Fabrication: Not just for fabs. Fabless companies can benefit from more visibility into process technology

by Pawan Fangaria
Published in SemiWiki

Ever since I started talking about Virtual Fabrication I have mostly looked at it from the manufacturers’ perspective, where it has obvious benefits to develop and model new process technology. But what about the fabless design concept and indeed even the semiconductor IP world that has spawned from it as well? It seems that Virtual Fabrication could be very effective to gain confidence in the fabrication of design by a fabless company, before it sees the actual foundry. Just think about this and in the meanwhile let’s briefly reflect on the evolution of fabless design concept.

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New SEMulator 3D Announced

EE JOURNAL
by Bryon Moyer
April 16, 2014 at 11:08 AM

Coventor recently released a new version of SEMulator 3D. We’ve looked at this tool before; it’s what they call a virtual fabrication platform – helpful for simulating semiconductor processes.

Featured in this upgrade is an improvement in the modeling of so-called pattern-dependent etch effects. In other words, how an etch proceeds at one spot depends on what’s around it. And looking farther out apparently makes for a more accurate simulation result, so, with this release, they’ve increased the radius that defines the region or neighborhood to be evaluated when assessing what the local layout looks like.

They’ve also sped up their etch simulation in general.

Meanwhile, they’ve more fully productized a couple of existing features. One is a structure search capability. This allows the user to find a specific structure in all of the various models. This can be particularly useful, for example, when you learn about some particular yield-impacting configuration and want to figure out which models it affects.
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Evaluate MEMS Devices out-of-fab Before Fabrication

by Pawan Fangaria
SemiWiki

MEMS design and fabrication is highly complex in the sense that the fabrication process heavily depends on the design, unlike IC fabrication which has a standard set of processes. A slight change in MEMS design can alter its fabrication steps to a large extent. For example, setting device parameters such as capacitance or linear displacement can affect the choice of the film thickness, etch rate, sidewall profile and so on. The design and process are so much tied together that many iterations through the fab are required (which consume costly resources and time) in order to get a perfect build. While an IDM has to keep its fab resources deployed for such a build-and-test experimentation in-house, a fabless design house has to additionally incur time for its design to take several tours through an external fab. This all has significant impact, first on cost of design and manufacturing and then turn-around-time, thus squeezing the window of opportunity which is already small in today’s competitive semiconductor market. read more…

The Road Ahead for 2014: Semiconductors

Semiconductor Engineering
Not everyone is sticking on the Moore’s Law path. Experts across the industry are expecting big changes, starting this year.

Last week, Semiconductor Engineering examined the 2014 predictions from several thought leaders in the industry and published those predictions that related to general market trends. Many of those predictions require some advances in semiconductor technologies and fabrications capabilities. It is those predictions that will be examined in this part, followed next week by the predictions related to design, verification and implementation tools.

There is a large amount of agreement in the industry about the macro trends for semiconductors this year. They fall into three main categories:

  • Migration to new processing nodes.
  • Adoption of FinFETs.
  • Increasing utilization of 2.5D and 3D integration.

When we couple these with the general market trends, there could be significant changes ahead for the industry. read more…