Press Coverage

Virtual fabrication platform provides statistical insight into process variation challenges

By Julien Happich

EDA solutions provider Coventor has released the latest version of its semiconductor virtual fabrication platform, SEMulator3D 6.1. The new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements.

Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.

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The Week In Review: Manufacturing

By Mark Lapedus

Winners, losers in Toshiba bid; GF RF; virtual fab; EUV inspection; VC funds; memory trends; chip drivers.

Coventor has announced the availability of SEMulator3D 6.1 — the latest version of its semiconductor virtual fabrication platform. According to the company, this new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements. Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.

“The real break-through here is our ability to drive technology yield ramp actions by optimizing process steps and process variation in a statistical environment. Important process parameters can be statistically analyzed to identify areas of concern with structural measurements, yield checks and electrical specifications” said David Fried, CTO of Coventor. “Now, our users can automate the large statistical design of experiments (DOEs) for virtual fabrication, to minimize critical defects and maximize device performance and yield.”

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The Race To 10/7nm

By Mark Lapedus

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies.

The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k dielectrics. In finFETs, the control of the current is accomplished by implementing a gate on each of the three sides of a fin.

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Coventor Touts Unified MEMS Platform

By R. Colin Johnson

LAKE WALES, Fla. — Micro-electro-mechanical systems (MEMS) chips cannot be virtually fabricated using conventional electronic design automation (EDA) tools because their three-dimensional structures cannot be represented well there. Computer Aided Design (CAD) tools are closer to the mark, but usually work on millimeter- instead of micron-size scales.

To bridge the gap, Coventor Inc. (Cary, North Carolina) has created its Coventor and MEMS+ tools, which have now been merged into a single unified platform perfect for Internet of Things (IoT) makers, according to Steve Breit, vice president of MEMS business for Coventor.

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Reworking Established Nodes

By Ed Sperling

New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void.

As with all electronic devices, the focus is on cost-cutting. But because these markets are likely to generate lower volumes than mobile phones or PCs, the majority of those savings will not come from shrinking features. In many cases, these are either original designs (rather than derivatives), and the technologies are still being developed. Some are custom, some are partially custom, and most are heterogeneous. Designing and manufacturing them using finFET processes would be price-prohibitive.

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The Week In Review: IoT

By Jeff Dorsch

Coventor this week introduced its CoventorMP 1.0 platform, meant to provide a simpler, unified environment for designing microelectromechanical system devices in IoT applications. The platform brings together the company’s CoventorWare and MEMS+ design software tools. With the platform, MEMS sensors and actuators can be integrated into system-in-package components for IoT devices.

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Inside Next-Gen Transistors

By Mark LaPedus

Coventor’s CTO looks at new types of transistors, the expanding number of challenges at future process nodes, and the state of semiconductor development in China.

David Fried, chief technology officer at Coventor, sat down with Semiconductor Engineering to discuss the IC industry, China, scaling, transistors and process technology. What follows are excerpts of that conversation.

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MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress

By Sensors Staff

PITTSBURGH, PA — Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products. Despite this unprecedented growth, suppliers face shared technical challenges that limit expansion, including energy and power management, security, integration, and machine learning. MEMS & Sensors Industry Group’s (MSIG’s) 2017 MEMS & Sensors Technical Congress® (MSTC), to be held on May 10-11, 2017 on the campus of Stanford University, offers attendees a collaborative approach to resolving these shared technical challenges.

From smart homes and smartphones to wearables, robotics, drones, and connected cars, MEMS and sensors represent huge growth areas for suppliers. Yole Développement forecasts that the MEMS industry will reach $20B by 2021, which represents 8.9% compound annual growth rate (CAGR) from 2016-2021 for the value of MEMS markets.[i] The market for sensors is growing slightly faster. In a soon-to-be-released report, BCC Research estimates that the global market for sensors will reach nearly $240.3B in 2022, with a five-year CAGR of 11.8% from 2017-2022.[ii]

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