About 11 months ago, I wrote a piece titled “Money for data and your MEMS for free.” In that, I took on the thinking that TSMC is just going to ride into town, fab trillions of IoT sensors, and they all will be 2.6 cents ten years from now. Good headline, but the technology and economics are not that simple. This may be the semiconductor version of putting a man on the moon by 1970, but instead of one big rocket, we are building little things.
– Don Dingee, Read the full article at SemiWiki
In thinking about the architecture and functioning of the IoT, I came to represent it as a nervous system. Commands and data flow through the architecture of IoT while computations are performed at the appropriate location in the system. The end terminal points of IoT, just like in the human nervous system function as the interface with the outside world. MEMS are indispensable to the proper functioning of the interface, yet, as focused as we are on electronics, we seldom give prominence to MEMS when the IoT is discussed in EDA circles.
– by Gabe Moretti, Read the full article at Chip Design
Microsensors can help enable designers to create smaller and more versatile Internet of Things-enabled devices and nodes. On Oct. 5, Coventor Inc. announced MEMS+6.0, the newest version of its MEMS design platform. It represents a step toward a MEMS design automation flow that works seamlessly with the well-established CMOS (complementary metal-oxide semiconductor) design flow, letting designers integrate MEMS into electronics and packaging faster.
– by Megan Crouse, Read the full article at Product Design and Development
The latest version of the company’s MEMS design tool accelerates development of customised, highly integrated sensors for the Internet of Things: it also adds links to MathWorks Simulink for faster, accurate simulation.
Coventor, MEMS design automation specialist, has announced MEMS+ 6.0, describing it as a significant advance toward a MEMS design automation flow that complements the well-established CMOS design flow, enabling faster integration of MEMS with electronics and packaging. MEMS+ 6.0 features enable the use of process design kits (PDKs) for MEMS, and include second-generation model reduction capabilities.
– by Graham Prophet, Read the full article at EE Times Europe
By Dr. Stephen Breit | Vice President of Engineering, Coventor
ChipScale Review September – October 2015
The trend of integrating heterogeneous technologies at the package level is now well underway, and includes MEMS sensors. Heterogeneous package-level integration arguably reached a new level with the release of the Apple Watch. A Chipworks teardown shows more than 30 die in Apple’s S1 package. Curiously, among the few components that are not included in the S1 package are a MEMS inertial measurement unit (IMU) by ST Microelectronics and MEMS microphones by Knowles. Surely Apple and other IoT device makers will strive to achieve higher-density, package-level integration of MEMS sensors in the future, but will need to overcome specific packaging challenges associated with MEMS.
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The latest version of this semiconductor-process modeling software boosts speed, accuracy, and capabilities all in a simpler, easier-to-use package.
Jack Browne | Microwaves and RF
Use of three-dimensional (3D) semiconductor structures has become commonplace within many markets, and in turn, semiconductor-process technologies continue to advance in support of higher-speed, more-dense active devices. For example, Coventor stays at the forefront with new and updated tools that predict the performance of different 3D semiconductor designs.
Case in point is the company’s fifth generation of its process simulation software, SEMulator3D 5.0. The software not only adds features for new process capabilities, but also simplifies the learning process for using the software. It’s a powerful simulation platform for predicting the effects of different process parameters on semiconductor and microelectomechanical-systems (MEMS) devices.
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by Pawan Fangaria
Shanghai Industrial µTechnology Research Institute
When it comes to wearable technology and the rapidly emerging world of IoT, sensors and MEMS are on the frontlines. They collect and transfer raw data such as pressure, temperature and motion and process it with algorithms critical to making sure the right information gets to humans and/or machines so the right reaction is enabled. In less than a decade, there is expected to be approximately 1 trillion sensors deployed worldwide – yet the MEMS market is fragmented and there is as yet no standard process in place for MEMS development. Change is needed; a standard approach for MEMS design and manufacturing needs to evolve in order to sustain the massive growth prospects ahead.
The significance of MEMS has not gone unnoticed, especially by Chinese companies who are eager to jump into this rapidly growing market. At the intersection of MEMS and China sits a company called SITRI, who is announcing a partnership with MEMS tool leader, Coventor.
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by Paul McLellan
The last paradigm shift in DRC was around 0.35um when designs got too large to handle as flat data, and hierarchical approaches were required. Back then the design rules themselves were not that complex, the explosion of data volume came from the complexity of the design itself. But each process node added more design rules intricacies and many new types of rules that needed to be checked.