By Dr. Stephen Breit | Vice President of Engineering, Coventor
ChipScale Review September – October 2015
The trend of integrating heterogeneous technologies at the package level is now well underway, and includes MEMS sensors. Heterogeneous package-level integration arguably reached a new level with the release of the Apple Watch. A Chipworks teardown shows more than 30 die in Apple’s S1 package. Curiously, among the few components that are not included in the S1 package are a MEMS inertial measurement unit (IMU) by ST Microelectronics and MEMS microphones by Knowles. Surely Apple and other IoT device makers will strive to achieve higher-density, package-level integration of MEMS sensors in the future, but will need to overcome specific packaging challenges associated with MEMS.
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The latest version of this semiconductor-process modeling software boosts speed, accuracy, and capabilities all in a simpler, easier-to-use package.
Jack Browne | Microwaves and RF
Use of three-dimensional (3D) semiconductor structures has become commonplace within many markets, and in turn, semiconductor-process technologies continue to advance in support of higher-speed, more-dense active devices. For example, Coventor stays at the forefront with new and updated tools that predict the performance of different 3D semiconductor designs.
Case in point is the company’s fifth generation of its process simulation software, SEMulator3D 5.0. The software not only adds features for new process capabilities, but also simplifies the learning process for using the software. It’s a powerful simulation platform for predicting the effects of different process parameters on semiconductor and microelectomechanical-systems (MEMS) devices.
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by Pawan Fangaria
Shanghai Industrial µTechnology Research Institute
When it comes to wearable technology and the rapidly emerging world of IoT, sensors and MEMS are on the frontlines. They collect and transfer raw data such as pressure, temperature and motion and process it with algorithms critical to making sure the right information gets to humans and/or machines so the right reaction is enabled. In less than a decade, there is expected to be approximately 1 trillion sensors deployed worldwide – yet the MEMS market is fragmented and there is as yet no standard process in place for MEMS development. Change is needed; a standard approach for MEMS design and manufacturing needs to evolve in order to sustain the massive growth prospects ahead.
The significance of MEMS has not gone unnoticed, especially by Chinese companies who are eager to jump into this rapidly growing market. At the intersection of MEMS and China sits a company called SITRI, who is announcing a partnership with MEMS tool leader, Coventor.
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by Paul McLellan
The last paradigm shift in DRC was around 0.35um when designs got too large to handle as flat data, and hierarchical approaches were required. Back then the design rules themselves were not that complex, the explosion of data volume came from the complexity of the design itself. But each process node added more design rules intricacies and many new types of rules that needed to be checked.
by Tom Simon
Recently I attended a panel discussion on variability in semiconductor fabrication hosted by Coventor in conjunction with the IEEE IEDM conference in San Francisco. The IEEE bills the conference as “the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling.” It’s easy to see how this discussion was relevant to the conference focus. SemiWiki’s own Dan Nenni was the panel moderator.
by Paul McLellan
IEDM (technically the International Electron Devices Meeting although I’ve never heard anyone use the full name) is in a couple of weeks time, in San Francisco. It is December 15-17th at the Hilton Union Square (which is not actually at Union Square but nearby at 333 O’Farrell Street).
For the last few years on the Tuesday evening Coventor have sponsored an event (with appetizers and drinks). Last year it was all about collaboration. This year the topic is variation, Survivor, Variation in the 3D Era. It is at the Hotel Nikko from 5.30pm to 8.30pm on Tuesday December 16th in the Carmel Room. Hotel Nikko is 222 Mason Street just around the corner from the Hilton.
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Korea IT Times
Imec researchers using Coventor’s SEMulator3D platform to model and optimize 7nm manufacturing technology
LEUVEN, BELGIUM – Belgian nanoelectronics research center imec has announced a joint development project with Coventor, a leading supplier of semiconductor process development tools. The collaboration will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to imec’s 10- and 7-nanometer (nm) processes.
By David Manners, Electronics Weekly
Coventor SEMulator3DImec and Coventor, the process development tool vendor, are to co-develop 10nm and 7nm 3D CMOS processes. To adopt the 7nm node, the industry needs to select the optimal layout, as well as optimise process step performance and control methodology. Using Coventor’s SEMulator3D platform, engineers from Imec and Coventor are working together to reduce silicon learning cycles and development costs by down selecting the options for development of next-generation manufacturing technologies.