MEMS design software gets 64-bit upgrade Version 4.0 of the MEMS+ design software from Coventor Inc. (Cary, North Carolina) is a full 64-bit implementation that adds the ability to export Verilog-A models.
The 64-bit resolution allows more accurate modeling of MEMS sensors and actuators and the software is designed to operate in parallel with Matlab and Virtuoso design software from Mathworks and Cadence Design Systems Inc., respectively.
The extension to 64-bits has been accompanied by an option to tune the software between accuracy and speed. Reduced-order models can be exported in Verilog-A format, for use by IC designers. These exported models simulate 100X faster than fully non-linear MEMS+ models and are compatible with all commercial analog/mixed-signal circuit simulators that support the industry-standard Verilog-A hardware description language.
by George Leopold on December 16, 2013
WASHINGTON, D.C. — The job of making advanced chips and finding ways to collaborate on the work is getting tougher, according to a panel of veteran semiconductor researchers who gathered just outside the International Electron Devices Meeting in Washington last week.
Moderator David Fried, chief technologist of Coventor, a supplier of 3D modeling and simulation software, asked panelists to describe the biggest technical challenges they face as well as the key challenges to keeping their projects on schedule. The latter question is critical, given the growing industry perception that the pace of chip scaling is slowing. That is making it harder for IC makers to push designs based on ever-shrinking geometries out the door.
By Richard Goering on December 11, 2013
Micro-electrical mechanical systems (MEMS) have been a niche technology for many years, but a new generation of MEMS ICs is emerging, according to Mike Jamiolkowski, CEO of Cadence partner and MEMS tool provider Coventor. Barriers to the use of MEMS technology, such as the need for PhD-level experts and non-reusable foundry processes, are starting to ease.
In this interview Jamiolkowski talks about new trends in the MEMS market, discusses his company’s MEMS+ tools and how they work with the Cadence Virtuoso platform, and notes a new MEMS+ capability to output reduced order models in the Verilog-A language.
By David Fried
Tech Design Forum
Will we be able to engineer another technology node that brings the usual cost and area savings without EUV lithography? I have serious doubts.
EUV lithography was supposed to be ready for the 45nm process node, and was then delayed until 32nm and later, 22nm. Today, major semiconductor companies are continuing to develop their offerings. Some will use the upcoming IEDM to detail their 1xnm processes, developed despite the lack of EUV’s patterning capabilities.
Why the delay with EUV? The story has been told many times: a combination of complex electro-optics, problems with the power of the illumination source, resist sensitivity and defectivity. The list of EUV challenges is long, but the summary is short: it’s not ready yet!
By Paul Werbaneth
A journey of a trillion sensors begins with a single step.
The TSensors Summit, held at Stanford University on 23 – 25 October 2013, was a showcase for the ideas and strategies that will lead the electronics industry to produce very high volumes of Microelectromechanical Systems (MEMS)-based sensors for use in new applications likely to enter the market in the coming decade.
There are currently several mega platform markets for MEMS sensors (and for the application-specific integrated circuits (ASIC), used to interface with them); most notable of these mega platform markets are smartphones, tablets, automobiles, and handheld consumer electronics products. Together, along with all other markets for MEMS sensors, the unit volume of MEMS devices shipped in 2013 will be on the order of billions, or the low tens of billions. (Nowhere close, yet, to 1 trillion.)
by Pawan Fangaria
The growing process integration complexity at each technology node has increased development time and cost, and this trend looks to continue. There is a looming risk of delivering unrepeatable critical unit processes (or process modules) that would require revisiting development and manufacturing requalification or in severe cases a design re-spin. Below the 22nm process node, tremendous effort is necessary to meet process integration specifications with a yielding process that is robust in the face of unavoidable manufacturing variation. read more…