Press Coverage

Coventor Announces SEMulator3D 6.1 and New Analytics Capabilities

Coventor Announces SEMulator3D 6.1 and New Analytics Capabilities

Coventor’s Virtual Fabrication Platform Provides Statistical Insight into Process Variation Challenges

CARY, NC– June 22, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.1 – the latest version of its semiconductor virtual fabrication platform.   This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements.  Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.

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DAC 2017: MEMS are key to IoT applications

By Martha DeGrasse

Coventor is changing the way MEMS are made

The value of the internet of things lies in the data generated by billions of connected devices, and those devices need sensors to generate that data. Sensors measure temperature, light, speed, position, moisture, flow rate, activity level … almost anything you can measure with your five senses and some things you can’t even perceive.

Sensors are often paired with actuators, miniature machines that perform a function based on digital instructions. For example, a sensor could measure how quickly liquid flows through a pipe, and an actuator could trigger a valve to stop the flow.

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Virtual fabrication platform provides statistical insight into process variation challenges

By Julien Happich

EDA solutions provider Coventor has released the latest version of its semiconductor virtual fabrication platform, SEMulator3D 6.1. The new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements.

Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.

read the full article here.

The Week In Review: Manufacturing

By Mark Lapedus

Winners, losers in Toshiba bid; GF RF; virtual fab; EUV inspection; VC funds; memory trends; chip drivers.

Coventor has announced the availability of SEMulator3D 6.1 — the latest version of its semiconductor virtual fabrication platform. According to the company, this new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features and usability enhancements. Along with SEMulator3D Version 6.1, Coventor is releasing an all-new SEMulator3D Analytics add-on component that automates statistical analysis of process variation directly from within the SEMulator3D process-predictive platform.

“The real break-through here is our ability to drive technology yield ramp actions by optimizing process steps and process variation in a statistical environment. Important process parameters can be statistically analyzed to identify areas of concern with structural measurements, yield checks and electrical specifications” said David Fried, CTO of Coventor. “Now, our users can automate the large statistical design of experiments (DOEs) for virtual fabrication, to minimize critical defects and maximize device performance and yield.”

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The Race To 10/7nm

By Mark Lapedus

Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies.

The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k dielectrics. In finFETs, the control of the current is accomplished by implementing a gate on each of the three sides of a fin.

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Coventor Touts Unified MEMS Platform

By R. Colin Johnson

LAKE WALES, Fla. — Micro-electro-mechanical systems (MEMS) chips cannot be virtually fabricated using conventional electronic design automation (EDA) tools because their three-dimensional structures cannot be represented well there. Computer Aided Design (CAD) tools are closer to the mark, but usually work on millimeter- instead of micron-size scales.

To bridge the gap, Coventor Inc. (Cary, North Carolina) has created its Coventor and MEMS+ tools, which have now been merged into a single unified platform perfect for Internet of Things (IoT) makers, according to Steve Breit, vice president of MEMS business for Coventor.

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Reworking Established Nodes

By Ed Sperling

New technology markets and a flattening in smartphone growth has sparked a resurgence in older technology processes. For many of these up-and-coming applications, there is no compelling reason to migrate to the latest process node, and equipment companies and fabs are rushing to fill the void.

As with all electronic devices, the focus is on cost-cutting. But because these markets are likely to generate lower volumes than mobile phones or PCs, the majority of those savings will not come from shrinking features. In many cases, these are either original designs (rather than derivatives), and the technologies are still being developed. Some are custom, some are partially custom, and most are heterogeneous. Designing and manufacturing them using finFET processes would be price-prohibitive.

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The Week In Review: IoT

By Jeff Dorsch

Coventor this week introduced its CoventorMP 1.0 platform, meant to provide a simpler, unified environment for designing microelectromechanical system devices in IoT applications. The platform brings together the company’s CoventorWare and MEMS+ design software tools. With the platform, MEMS sensors and actuators can be integrated into system-in-package components for IoT devices.

read the full article here.