by Paul McLellan
IEDM (technically the International Electron Devices Meeting although I’ve never heard anyone use the full name) is in a couple of weeks time, in San Francisco. It is December 15-17th at the Hilton Union Square (which is not actually at Union Square but nearby at 333 O’Farrell Street).
For the last few years on the Tuesday evening Coventor have sponsored an event (with appetizers and drinks). Last year it was all about collaboration. This year the topic is variation, Survivor, Variation in the 3D Era. It is at the Hotel Nikko from 5.30pm to 8.30pm on Tuesday December 16th in the Carmel Room. Hotel Nikko is 222 Mason Street just around the corner from the Hilton.
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Korea IT Times
Imec researchers using Coventor’s SEMulator3D platform to model and optimize 7nm manufacturing technology
LEUVEN, BELGIUM – Belgian nanoelectronics research center imec has announced a joint development project with Coventor, a leading supplier of semiconductor process development tools. The collaboration will enable faster and more optimized development of advanced manufacturing technology in the 3D device architecture era, extending down to imec’s 10- and 7-nanometer (nm) processes.
By David Manners, Electronics Weekly
Coventor SEMulator3DImec and Coventor, the process development tool vendor, are to co-develop 10nm and 7nm 3D CMOS processes. To adopt the 7nm node, the industry needs to select the optimal layout, as well as optimise process step performance and control methodology. Using Coventor’s SEMulator3D platform, engineers from Imec and Coventor are working together to reduce silicon learning cycles and development costs by down selecting the options for development of next-generation manufacturing technologies.
by Paul McLellan SemiWiki
Today imec and Coventor announced a joint development project for 10nm and 7nm process development. Imec, which is in Leuven Belgium, is a partner with pretty much all the semiconductor companies that are planning work at these advanced nodes. It mostly does pre-competitive research and development. This type of research is very expensive for any one semiconductor company to carry out so it makes sense to share the investment across the entire industry. It will be interesting to see whether the GlobalFoundries acquisition of IBM’s semiconductor business changes the landscape since historically IBM has done a lot of research themselves, and those researchers now work for GF. Imec is a big operation with a staff of over 2000 people, including 670 industrial residents and guest researchers.
IMEC, Coventor model 10nm, 7nm processesEuropean research institute IMEC (Leuven, Belgium) has announced a joint development project with EDA tools vendor Coventor Inc. (Cary, North Carolina) to work on the modeling of next-generation manufacturing processes using Coventor’s SEMulator 3D software.
by Paul McLellan, SemiWiki
One of the things about MEMS devices is that they almost always live on a chip that also contains the electronics necessary to process the output from the sensor. For example, an on-chip accelerometer for a car airbag deployment will contain the electronics necessary to process the signal from the sensor and end up with something much closer to “we’re crashing, deploy the airbags” versus “we’re OK, don’t fire off the airbags.”
The design of the MEMS devices themselves are typically done with some form of finite-element analysis (FEA), a very general approach to designing mechanical structures. However, these models of the device are very complex and slow to evaluate due to the huge number of degrees of freedom. This is fine for designing the device itself but for working with the electronics a simpler model of the device is required that is accurate enough for the purpose but is also fast to evaluate.
By Francoise von Trapp
3D In-Depth, EDA Tools
I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s a good way to learn about the synergies and to cross-pollinate information. Today was one of those days. I interviewed Steve Breit, PhD, VP of Engineering, Coventor, supplier of design automation software for MEMS and semiconductor applications. Breit reminded me that through silicon via technology (TSV), which is critical for 3D IC, owes a debt to MEMS. He’s right about that. So I figure a nod to MEMS now and again on 3D InCites isn’t out of place.
Breit briefed me on the company’s latest version of its MEMS+ modeling environment for accelerated development of advanced MEMS devices and systems, and what the improvements mean for ASIC designers who need to integrate MEMS devices into their system design.
by Paul McLellan
At SEMICON last month, Rohit Pal of GlobalFoundries gave a presentation on their methodology for reducing process variation. It was titled Cpk Based Variation Reduction: 14nm FinFET Technology.
Capability indices such as Cpk is a commonly used technique to assess the variation maturity of a technology. It looks at a given parameter’s variability and compares it to 6 sigma. The higher the number the better, 1.33 should have the process yielding close to 100% (for that parameter) and 2 is the full 6 sigma. Using Cpk makes it easy to track metrics to assess variation improvement for a technology. They can also be used as a gating item for technology milestone achievement. However, it is not truly an absolute value, it is a function of the specification limits.