Press Coverage

EDA in the year 2017 – Part 1

By Gabe Moretti

The EDA industry performance is dependent on two other major economies: one technological and one financial.  EDA provides the tools and methods that leverage the growth of the semiconductor industry and begins to receive its financial rewards generally a couple of year after the introduction of the new product on the market.  It takes that long for the product to prove itself on the market and achieve general distribution.

David Fried from Coventor addressed the most important topics that may impact the foundry business in 2017.  He made two points.

read the full article here.

MEMS and ASIC Design: How the Gap Can Narrow

By Anne Fisher

As the MEMS ecosystem matures, what role will foundries play in its success?

The occasion of the 2016 MEMS Executive Congress made for a good opportunity to meet with Dr. Stephen R. Breit, VP Engineering at Coventor, a MEMS design automation firm. Breit prefaced our interview by noting his company’s concern with, and work toward, overcoming the ASIC design/MEMS design divide. “We were ahead of the industry in that we have been focused for years on bridging that gap,” Breit told EECatalog, “but the industry is now catching up with us and realizing that gap exists.” Breit also spoke about foundries’ motivations vis-à-vis MEMS, the elements found in a successful design kit, and which decisions support More than Moore—among other topics. Edited excerpts of the interview follow.


read the full article here.

BEOL Issues At 10nm And 7nm

By Ed Sperling

Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for GlobalFoundries’ advanced technology development integration unit; Paul Besser, senior technology director at Lam Research; David Fried, CTO at Coventor; Chih Chien Liu, deputy division director for UMC’s advanced technology development Module Division; and Anton deVilliers, director of patterning technology and senior member of the technical staff at Tokyo Electron. What follows are excerpts of that conversation.

Experts at the table, part 1: Lines blur with middle of line as RC delay increases, reliability and yield become more difficult to achieve, and costs skyrocket.

Experts at the table, part 2: The impact and cost of air gap; reducing RC delay with liner-less approaches and cobalt; where EUV will make a dent…maybe.

Experts at the table, part 3: EUV, metallization, self-alignment, ALD, and the limits of copper.

IEDM: Coventor Panel on BEOL Challenges

By Paul McLellan

At the recent IEDM in San Francisco, Coventor organized a panel titled BEOL Barricades: Navigating Future Semiconductor Yield, Reliability, and Cost Challenges. The BEOL, back end of line, is the metal, although where it begins and ends, as you will see, is debatable.

The panel was moderated by Ed Sperling and the panelists were:

  • Paul Besser of LAM Research
  • Chih-Chien Liu of UMC
  • Craig Child of GLOBALFOUNDRIES
  • Anton deVilliers of Tokyo Electron
  • David Fried of Coventor


read the full article here.

Uncertainty Grows For 5nm, 3nm

By Mark Lapedus

As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena.

TSMC recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion. The proposed fab is targeted to manufacture TSMC’s 5nm and 3nm processes, which are due out in 2020 and 2022, respectively. Other chipmakers, including GlobalFoundries, Intel and Samsung, also are looking at technologies for 5nm and beyond.

read the full article here.

IEDM 2016 Next Week – Siliconica

By Dick James, Senior Technology Analyst, Chipworks

On December 3rd – 7th , the good and the great of the electron device world will make their usual pilgrimage to San Francisco for the 2016 IEEE International Electron Devices Meeting. To quote the conference website front page, IEDM is “is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.”

That’s a pretty broad range of topics, but from my perspective at Chipworks, focused on the analysis of chips that have made it to production, it’s the conference where companies strut their technology, and post some of the research that may make it into real product in the next few years. Though these days process papers actually tend to be after the launch of the relevant product, such is the preoccupation with trade secrecy.

read the full article here.

Driverless Vehicle Makers, Carriers, Drone-Defense Creators Look to MEMS & Sensors Industry for Advanced Sensing and Actuation

By Chip Design

MEMS & Sensors Industry Group (MSIG)’s MEMS & Sensors Executive Congress™ — held November 9-11 in Scottsdale, AZ — gave innovative developers of driverless vehicles and drone-defense makers — as well as one of the world’s top carriers — a ready audience of industry execs as they shared their wants for new MicroElectroMechanical Systems (MEMS)/sensors for future products.

Phillip M. Rayer II, general manager, Local Motors, described how his company uses “co-creation” — involving as many as 50,000 developers — to design driverless electric vehicles for target communities. Local Motors uses 3D printing to manufacture the vehicles in months rather than years.

read the full article here.

Audio and Sensor Integration Extracting Themes from the MEMS Executive Congress

By Bryon Moyer

If it’s November, that means it’s time for the C-level folks in the MEMS and sensor industries to assemble and assess the state of the industry at the MEMS Executive Congress. Because of the higher average title of these attendees, it has a very different feel from other conferences. And it mostly happens in lockstep (without five different tracks and an exhibit floor as distractions). Which makes it a bit easier to get a read on things.

It wasn’t so long ago when the theme of the year would typically focus on individual new MEMS structures – especially for motion. Then came the wave of sensor fusion – again, largely motion-oriented, but with promise beyond that, at least as a concept. Most of the more visible independent sensor fusion companies then were acquired, and the last few editions of the Congress have had less of the, “OMG, we’ve arrived!” feel and more of the, “Takin’ care of business” feel.

read the full article here.