Tech Design Forum Blog
By Luke Collins
Semiconductor process development lacks tools that offer the same kind of support for hierarchy and abstraction that have enabled chip designers to handle the vast increase in capacity of modern processes, according to David Fried, CTO of Coventor, which provides the Semulator 3D software used to produce our finFET tipsheet.
Speaking at a reception at IEDM in San Francisco this week, Fried argued that there is a mismatch between the cost of building a fab and establishing a new process in it and the sophistication of the tools used to help develop the processes.
Tech Design Forum Blog
December 4, 2012
At the upcoming IEDM, we’re likely to see a great deal of discussion about finFETs (Guide). Many groups are pursuing the goal of fully integrated finFET CMOS technology using a variety of approaches that have some similarities, but many key differences. Let’s examine a few of these differences, and explain the implications of the choices that device architects and process engineers are making.
December 3, 2012
By Barbara C. Tuck
With MEMS having become central to consumer products such as smart phones and tablets, the exploding demand for them makes it imperative for designers to focus on product, not process technology. Toward that goal, the MEMS industry is coming to terms with a huge shift in manufacturing methodology, one that is moving the MEMS market toward accessible and cost-effective process technology. Traditionally, IDMs have been the only ones with resources needed to develop the specialized, proprietary processes that have characterized MEMS manufacture. But the long R&D cycles and build-and-test design required for such an approach are no longer viable now that MEMS technology lies at the heart of consumer products with short product life-cycles. The high-volume, cost-driven consumer market calls for more standardized processes, packaging and testing.
Chip Design Magazine
By Cheryl Coupé
Micro-electromechanical systems (MEMS) are well known for enabling innovative capabilities for devices that range from vehicles and gaming to smartphones and tablets—and increasingly in personal health and fitness, security, and environmental applications. As stacked die become more popular, they also will become part of the integration challenge that chipmakers will wrestle with as they seek to build customized chips for very specific market slices.
News Release from: Electronic Specifier
07 November 2012
The term ‘smart system’ is well used, but what exactly does it mean? There are many definitions but the one that fits best for the purposes of this discussion is that provided by the European Commission’s CORDIS programme: “Smart systems typically are sensors and/or actuators with an ability to process data, diagnose complex situations, communicate with each other and be autonomous in energy use.”
Vanessa Knivett investigates smart tools for smart systemsNo single technology plays the key role in a smart system’s functionality; it is, indeed, systemic — a ‘system’ in its purest form, with sensing, computation, communication and power all realised in a single tiny package. A smart system also represents a mixture of mechanical and electronic functions, making the job of the designer trying to predict its behaviour a complex one.
by Bryon Moyer
A number of years ago, Coventor created a program called SEMulator 3D. Its target usage was for developing MEMS processes and devices, MEMS devices traditionally having the unfortunate characteristic that a specific device typically required a specific process. Coventor refers to it as “virtual fabrication” since it can abstract and model the steps used to fabricate a MEMS wafer. read more…