Previous Events

Smart Systems Integration – March 11-12, 2015

Smart Systems Integration – March 11-12, 2015 – Copenhagen
International Conference and Exhibition

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Coventor will participate in a panel discussion on March 11, 2015 at 2:45pm, titled: “Towards a ‘Lego Brick Principle’ for Heterogeneous System Design Including MEMS and Electronic – Choose and Put Together – Fit?”

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SPIE Advanced Lithography – February 22-26, 2015

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SPIE Advanced Lithography, February 22-26, 2015, in San Jose, CA.

Coventor will attend SPIE 2015, visit us at booth #205

San Jose Marriott and San Jose Convention Center
San Jose, California, United States
22 – 26 February 2015

SPIE is a highly regarded exhibition for the industry’s top semiconductor suppliers, integrators, and manufacturers. 61 exhibiting companies in 2014.

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MEMS 2015 – January 18-22, 2015 – Estoril, Portugal

The 28th IEEE International Conference on Micro Electro Mechanical Systems

Coventor will attend MEMS 2015, visit us at booth #16.

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http://www.mems2015.org/

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Survivor: Variation in the 3D Era – December 16, 2014 – San Francisco, CA

Location: “Carmel Room” at Hotel Nikko, San Francisco
Date: Tuesday, December 16, 2014
Time: 5:30pm -8:30pm (Cocktails and hors d’oeuvres)
6:00pm (Panel Begins)
RSVP by 12/10/14 RSVP-to-COVENTOR@coventor.com

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2014 IEEE International Electron Devices Meeting – December 15-17, 2014 – San Francisco, CA

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2014 IEEE International Electron Devices Meeting
Hilton San Francisco Union Square
333 O’Farrell Street
San Francisco, CA USA
December 15-17, 2014

The Annual Technical Meeting of the Electron Devices Society

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SISPAD – September 9 – 11, 2014 – Yokohama, Japan

SISPAD
2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9 – 11, 2014

SISPAD
Co-sponsored by The Japan Society of Applied Physics
Technical co-sponsored by The IEEE Electron Devices Society

This conference provides an opportunity for the presentation and discussion of the latest advances in modeling and simulation of semiconductor devices, processes, and equipment for integrated circuits.

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Teledyne DALSA MIDIS – June 16 to 17 – Montreal, Canada

Teledyne DALSA MIDIS™ and Coventorware/MEMS+ Training
– A Train-the-Trainer Event
June 16 to 17, 2014 at Montreal, QC

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This training event will provide information to become a better trainer and support person at your institution.

This two-day training course comprises of lectures by Teledyne DALSA and Coventor Engineers plus hands-on practical sessions:

Day 1 covers TDSI MIDIS™ process flow, design and simulation of MEMS devices using CoventorWare
Day 2 is devoted to the advanced tools and features of MEMS+

In this training course, you will:
Receive training materials you can share with your colleagues at your institution, and
learn how to explain what is available from CMC and in the NDN, and how it is accessed.
Note: Lunch and snacks are included with each course.

MEMSWAVE 2014 – June 30 – July 2 – La Rochelle, France

MEMSWAVE 2014 is the 15th edition of an international symposium to be held in La Rochelle, France (June 30th-July 2nd, 2014). The series of MEMSWAVE started in 2000 in Sinaia ROMANIA, and consists of two events:

• The RF-MST Cluster Meeting (June 30th, 2014) co-organized with the European Commission, where the achievements of MEMS-related EU projects will be illustrated and discussed.

• The MEMSWAVE Conference (July 1st-2nd, 2014) where invited and peer reviewed papers will be presented to provide an international forum for scientists and industrialists for exchanging information on the most recent advances and best achievements in the area of RF-MEMS, MSTs and RF-NEMS with emphasis on European achievements.

Alexandre Medhaoui will present “RF MEMS System Level Simulation and 3D Structural Verification Via Virtual Metrology”.
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