Previous Events

SPIE Advanced Lithography 2014 – February 23-27, 2014

San Jose Marriott and San Jose Convention Center
San Jose, California, United States
23 – 27 February 2014

Coventor will be in Booth #330

alThis is the premier conference for the lithography community. For 38 years, SPIE has brought together this community to address challenges presented in fabricating next-generation integrated circuits. Symposium participants come from an extensive array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, processes, and design and process integration.

Coventor will be in Booth #330 and showcasing our SEMulator3D 2014 virtual fabrication platform that leading IDMs, foundries and memory suppliers are using to dramatically reduce the cost and time involved in process development invoking advanced technologies such as FinFETS and 3D ICs.

learn more: https://spie.org/x10942.xml

Join Coventor for an evening of Insights from the Experts on Advanced Technology Development.

 
In the Trenches:
Insights from the Experts on Advanced Technology Development

Please join Coventor for an open discussion where experts will share their insights on advanced technology development.

Enjoy an evening of cocktails, hors d’oeuvres and stimulating conversation.


EXPERTS WILL INCLUDE:

Dr. Brian J. Greene
IBM, Senior Engineer, FEOL Architect
Mark Fischer
Micron Technology, Senior Research Engineer
Dr. Andy Wei
GLOBALFOUNDRIES, Principle Member of Technical Staff, 10nm


Jaouen Herve, Ph.D.
STMicroelectronics, Director Modeling & Simulation, Silicon Tech. Development
Sean Lian, Ph.D.
Samsung Electronics, Director/Technology Lead
Laith Altimime, Ph.D.
IMEC, Director, CMOS Technology & Design


 
Dr. David M. Fried
Coventor, Chief Technology Officer, Semiconductor
 




Location: Churchill Embassy Row Hotel
Kalorama Ballroom
1914 Connecticut Ave NW, Washington, D.C.
ACROSS THE STREET from the IEDM Conference location

Date: Tuesday, December 10th, 2013

Time: 5:30PM-8:30PM
Discussion to begin at 6:30pm

Cocktails and hors d’oeuvres to be served

RSVP: RSVP-to-COVENTOR@coventor.com.

 

Space is limited for this Complimentary Reception so please RSVP early.


IEEE IEDM – December 7 – 10, 2013

Washington, DC
http://www.his.com/~iedm/


The IEEE International Electron Devices Meeting (IEDM) is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.

IEEE MEMS 2014 – January 26-30, 2014

San Francisco
http://www.mems2014.org/

Coventor will be in booth #26

The 27th IEEE International Conference on
Micro Electro Mechanical Systems
(MEMS 2014)
read more…

MEMS Executive Congress® US 2013 – November 7-8, 2013

MEMS Executive Congress® US 2013 – November 7-8, 2013
Meritage Resort and Spa, Napa, CA.

This year, there were many unique changes brought to this already distinct professional forum that make it a “Can’t Miss” event. We have added new features, like the MEMS Technology Pitch Session, and will offer Media Training by the esteemed best-selling author TJ Walker. We have also reduced the number of panel discussions, but have included more speakers, simply to deliver more industry news and hot topics. Sure to be one of the best in recent memory, don’t miss the opportunity to be a part of MEMS Executive Congress® US 2013!

Coventor will sponsor the popular post-dinner networking event on Friday November 8. It’s a great chance to review the day’s events with your colleagues, discuss trends in the industry, and catch up with old friends from around the MEMS world. Coventor executives will be on hand to chat about the latest developments from the leader in MEMS design automation solutions.

read more…

AVS 60th International Symposium & Exhibition – Oct 27 – Nov 1, 2013

Long Beach, California

Ryan Patz will deliver a paper on Advanced BEOL/Interconnect Etching, which looks at the use of virtual fabrication in the development of a 22nm process technology. His talk is on Monday October 28, 2013 at4:00 PM. It is based on his white paper which can be downloaded here.

The AVS International Symposium and Exhibition addresses cutting-edge issues associated with materials, processing, and interfaces in both the research and manufacturing communities. The weeklong Symposium fosters a multidisciplinary environment that cuts across traditional boundaries between disciplines, featuring papers from AVS technical divisions, technology groups, and focus topics on emerging technologies. The equipment exhibition is one of the largest in the world and provides an excellent opportunity to view the latest products and services offered by over 200 participating companies. More than 2,000 scientists and engineers gather from around the world to attend.

Learn more: http://www2.avs.org/symposium/AVS60/pages/info.html