Moscone Center, San Francisco, CA
Coventor will be in booth# 2443
SEMICON West is the annual tradeshow for the micro- and nano-electronics manufacturing industries. Since 1971 the show has been the standard-bearer for the technological revolution spawning a worldwide group of tradeshows organized by SEMI.
MOS-AK Meetings are organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/Spice modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development, implementation, deployment and standardization within the main theme – frontiers of the compact modeling for nm-scale MEMS designs and CMOS/SOI circuit simulation.
Coventor will present details of its virtual fabrication modeling solution, SEMulator3D, an innovative platform for significantly reducing the time and cost involved in developing next generation semiconductor and MEMS manufacturing processes.
SEMICON Europa 2014, October 7-9, 2014, in Grenoble France
EMICON Europa to rotate between Dresden and Grenoble
Co-located with Plastic Electronics 2014
Date: 7-9 Oct 2014
Location: Grenoble, France
MEMS Executive Congress 2014 – Nov 5-7, 2014 – Scottsdale AZ
“The single best conference in the world of MEMS.”
The compelling reasons why thousands of OEMs have successfully chosen MEMS devices to create competitive advantages for themselves in both sustaining innovation and disruptive innovation business models include these: MEMS-based solutions yield product cost advantages for a given functionality; employing MEMS devices usually results in a reduced BOM for a given product, and the lower parts count for MEMS-based products enables a more efficient supply chain; the inherent compatibility of MEMS devices with CMOS electronics simplifies design cycles and speeds time-to-market; MEMS components typically demonstrate less power consumed per a given function than do other, macro-based solutions; and the fact that MEMS device and product reliability is as good as any reliability can be – MEMS devices can deliver military / automotive / medical device-class reliability in rugged, real-world applications.
Moscone Center, San Francisco, CA
Coventor will be in booth #718
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, electronic design automation (EDA) and embedded systems and software (ESS).
Hilton Head Workshop 2014: A Solid-State Sensors, Actuators and Microsystems Workshop
June 8 – 12, 2014
130 Shipyard Drive
Hilton Head Island, SC 29928
Meet up with Coventor at the Micronano System Workshop May 15-16 in Uppsala, Sweden
MSW is a forum where industry, researchers and national organizations can have stimulating meetings on research, development and industrial use of MEMS/MST in Scandinavia. A key factor has been the informal atmosphere which has stimulated many interesting contacts and projects at the previous workshops. Some participants know much about microsystems, others have a strong application know-how, while still others have ideas or a general curiosity.
San Jose Marriott and San Jose Convention Center
San Jose, California, United States
23 – 27 February 2014
Coventor will be in Booth #330
This is the premier conference for the lithography community. For 38 years, SPIE has brought together this community to address challenges presented in fabricating next-generation integrated circuits. Symposium participants come from an extensive array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, processes, and design and process integration.
Coventor will be in Booth #330 and showcasing our SEMulator3D 2014 virtual fabrication platform that leading IDMs, foundries and memory suppliers are using to dramatically reduce the cost and time involved in process development invoking advanced technologies such as FinFETS and 3D ICs.
learn more: https://spie.org/x10942.xml