Previous Events

SEMICON Europa 2015 – October 6-8, 2015 – Dresden, Germany


SEMICON Europa features highly technical content specific to the manufacture of microelectronics (Semiconductors, Photovoltaic, MEMS, flat panel displays, and much more).

SISPAD – September 9 – 11, 2014 – Yokohama, Japan

2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9 – 11, 2014

Co-sponsored by The Japan Society of Applied Physics
Technical co-sponsored by The IEEE Electron Devices Society

This conference provides an opportunity for the presentation and discussion of the latest advances in modeling and simulation of semiconductor devices, processes, and equipment for integrated circuits.

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Teledyne DALSA MIDIS – June 16 to 17 – Montreal, Canada

Teledyne DALSA MIDIS™ and Coventorware/MEMS+ Training
– A Train-the-Trainer Event
June 16 to 17, 2014 at Montreal, QC

This training event will provide information to become a better trainer and support person at your institution.

This two-day training course comprises of lectures by Teledyne DALSA and Coventor Engineers plus hands-on practical sessions:

Day 1 covers TDSI MIDIS™ process flow, design and simulation of MEMS devices using CoventorWare
Day 2 is devoted to the advanced tools and features of MEMS+

In this training course, you will:
Receive training materials you can share with your colleagues at your institution, and
learn how to explain what is available from CMC and in the NDN, and how it is accessed.
Note: Lunch and snacks are included with each course.

MEMSWAVE 2014 – June 30 – July 2 – La Rochelle, France

MEMSWAVE 2014 is the 15th edition of an international symposium to be held in La Rochelle, France (June 30th-July 2nd, 2014). The series of MEMSWAVE started in 2000 in Sinaia ROMANIA, and consists of two events:

• The RF-MST Cluster Meeting (June 30th, 2014) co-organized with the European Commission, where the achievements of MEMS-related EU projects will be illustrated and discussed.

• The MEMSWAVE Conference (July 1st-2nd, 2014) where invited and peer reviewed papers will be presented to provide an international forum for scientists and industrialists for exchanging information on the most recent advances and best achievements in the area of RF-MEMS, MSTs and RF-NEMS with emphasis on European achievements.

Alexandre Medhaoui will present “RF MEMS System Level Simulation and 3D Structural Verification Via Virtual Metrology”.
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SEMICON WEST 2014 – July 8-10, 2014

Moscone Center, San Francisco, CA

Coventor will be in booth# 2443

SEMICON West is the annual tradeshow for the micro- and nano-electronics manufacturing industries. Since 1971 the show has been the standard-bearer for the technological revolution spawning a worldwide group of tradeshows organized by SEMI.
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MOS-AK ESSDERC/ESSCIRC Workshop- September 26 – Venice

MOS-AK Meetings are organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/Spice modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development, implementation, deployment and standardization within the main theme – frontiers of the compact modeling for nm-scale MEMS designs and CMOS/SOI circuit simulation.

Coventor will present details of its virtual fabrication modeling solution, SEMulator3D, an innovative platform for significantly reducing the time and cost involved in developing next generation semiconductor and MEMS manufacturing processes.

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SEMICON Europa 2014 – October 7-9, 2014

SEMICON Europa 2014, October 7-9, 2014, in Grenoble France


EMICON Europa to rotate between Dresden and Grenoble
Co-located with Plastic Electronics 2014

Date: 7-9 Oct 2014
Location: Grenoble, France
Venue: Alpexpo

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MEMS Executive Congress 2014 – Nov 5-7, 2014 – Scottsdale AZ

MEMS Executive Congress 2014 – Nov 5-7, 2014 – Scottsdale AZ

“The single best conference in the world of MEMS.”


The compelling reasons why thousands of OEMs have successfully chosen MEMS devices to create competitive advantages for themselves in both sustaining innovation and disruptive innovation business models include these: MEMS-based solutions yield product cost advantages for a given functionality; employing MEMS devices usually results in a reduced BOM for a given product, and the lower parts count for MEMS-based products enables a more efficient supply chain; the inherent compatibility of MEMS devices with CMOS electronics simplifies design cycles and speeds time-to-market; MEMS components typically demonstrate less power consumed per a given function than do other, macro-based solutions; and the fact that MEMS device and product reliability is as good as any reliability can be – MEMS devices can deliver military / automotive / medical device-class reliability in rugged, real-world applications.
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