The IEEE International Electron Devices Meeting (IEDM) is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for power and energy harvesting, high-speed devices, as well as process technology and device modeling and simulation.
Coventor will be in booth #26
The 27th IEEE International Conference on
Micro Electro Mechanical Systems
MEMS Executive Congress® US 2013 – November 7-8, 2013
Meritage Resort and Spa, Napa, CA.
This year, there were many unique changes brought to this already distinct professional forum that make it a “Can’t Miss” event. We have added new features, like the MEMS Technology Pitch Session, and will offer Media Training by the esteemed best-selling author TJ Walker. We have also reduced the number of panel discussions, but have included more speakers, simply to deliver more industry news and hot topics. Sure to be one of the best in recent memory, don’t miss the opportunity to be a part of MEMS Executive Congress® US 2013!
Coventor will sponsor the popular post-dinner networking event on Friday November 8. It’s a great chance to review the day’s events with your colleagues, discuss trends in the industry, and catch up with old friends from around the MEMS world. Coventor executives will be on hand to chat about the latest developments from the leader in MEMS design automation solutions.
Long Beach, California
Ryan Patz will deliver a paper on Advanced BEOL/Interconnect Etching, which looks at the use of virtual fabrication in the development of a 22nm process technology. His talk is on Monday October 28, 2013 at4:00 PM. It is based on his white paper which can be downloaded here.
The AVS International Symposium and Exhibition addresses cutting-edge issues associated with materials, processing, and interfaces in both the research and manufacturing communities. The weeklong Symposium fosters a multidisciplinary environment that cuts across traditional boundaries between disciplines, featuring papers from AVS technical divisions, technology groups, and focus topics on emerging technologies. The equipment exhibition is one of the largest in the world and provides an excellent opportunity to view the latest products and services offered by over 200 participating companies. More than 2,000 scientists and engineers gather from around the world to attend.
The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, June 16-20, 2013, Barcelona. Spain
VISIT US AT BOOTH #2
On June 17th, Coventor is sponsoring a Market Briefing on MEMS Manufacturing Technologies arranged by Yole Development.
VISIT US AT BOOTH #2111
SEMICON West showcases the world’s best technology companies from across the micro-electronics supply chain and beyond. This event brings together the people, companies, technologies, and ideas that drive the electronics revolution. SEMICON West is the premier venue for microelectronics innovation.
Coventor CTO David Fried will be delivering a talk on a virtual fabrication approach to developing new process technologies.
APPLICATIONS OF MEMS SENSORS AND SYSTEMS
MEMS FORUM is the only industry event in Russia exclusively focused on MEMS development, production and market issues.The 2013 conference program is dedicated to exploring the most up-to-date MEMS materials and products and their applications, issues of system integration, power management, challenges of the usage of MEMS in both commercial and non-commercial fields and market issues. MEMS Forum identifies cutting-edge trends, explores them in an information-packed conference program and reflects those trends through product and process announcements.
Coventor and IBM will jointly present a paper on the use of ‘virtual fabrication’ methodologies and technology to accelerate the development of and achieve optimal yields with IBM’s 22-nm process. The paper describes the use of Coventor’s SEMulator3D platform to dramatically decrease silicon learning cycles and lower overall development costs.
22nm Technology Yield Optimization Using Multivariate 3D Virtual Fabrication
Benjamin R. Cipriany (IBM), David M. Fried (Coventor), Basanth Jagannathan and Gregory Costrini (IBM), Ken Greiner (Coventor), Ahmed Nayaz Noemaun, Katsunori Onishi, Shreesh Narasimha, Bidan Zhang, Christopher D. Sheraw, and Jason E. Meiring (IBM), Daniel Faken (Coventor), Mahender Kumar, Karen A. Nummy, and Ning Zhan (IBM), Stephen R. Breit (Coventor), and James P. Norum, Stephen S. Furkay, Rajeev Malik, Paul D. Agnello, and Haraprasad Nanjundappa (IBM)