Previous Events

MOS-AK ESSDERC/ESSCIRC Workshop- September 26 – Venice

MOS-AK Meetings are organized with aims to strengthen a network and discussion forum among experts in the field, enhance open platform for information exchange related to compact/Spice modeling and Verilog-A standardization, bring people in the compact modeling field together, as well as obtain feedback from technology developers, circuit designers, and CAD tool vendors. The topics cover all important aspects of compact model development, implementation, deployment and standardization within the main theme – frontiers of the compact modeling for nm-scale MEMS designs and CMOS/SOI circuit simulation.

Coventor will present details of its virtual fabrication modeling solution, SEMulator3D, an innovative platform for significantly reducing the time and cost involved in developing next generation semiconductor and MEMS manufacturing processes.

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SEMICON Europa 2014 – October 7-9, 2014

SEMICON Europa 2014, October 7-9, 2014, in Grenoble France


EMICON Europa to rotate between Dresden and Grenoble
Co-located with Plastic Electronics 2014

Date: 7-9 Oct 2014
Location: Grenoble, France
Venue: Alpexpo

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MEMS Executive Congress 2014 – Nov 5-7, 2014 – Scottsdale AZ

MEMS Executive Congress 2014 – Nov 5-7, 2014 – Scottsdale AZ

“The single best conference in the world of MEMS.”


The compelling reasons why thousands of OEMs have successfully chosen MEMS devices to create competitive advantages for themselves in both sustaining innovation and disruptive innovation business models include these: MEMS-based solutions yield product cost advantages for a given functionality; employing MEMS devices usually results in a reduced BOM for a given product, and the lower parts count for MEMS-based products enables a more efficient supply chain; the inherent compatibility of MEMS devices with CMOS electronics simplifies design cycles and speeds time-to-market; MEMS components typically demonstrate less power consumed per a given function than do other, macro-based solutions; and the fact that MEMS device and product reliability is as good as any reliability can be – MEMS devices can deliver military / automotive / medical device-class reliability in rugged, real-world applications.
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DAC 2014 – June 1-5, 2014

Moscone Center, San Francisco, CA

Coventor will be in booth #718

The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, electronic design automation (EDA) and embedded systems and software (ESS).
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Hilton Head 2014 Workshop – June 8-12, 2014

Hilton Head Workshop 2014: A Solid-State Sensors, Actuators and Microsystems Workshop

hiltonheadJune 8 – 12, 2014
Sonesta Resort
130 Shipyard Drive
Hilton Head Island, SC 29928
Phone: 1-843-842-2400
Fax 1-843-842-6503
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Micronano System Workshop – May 15-16 2014 – Uppsala, Sweden

Meet up with Coventor at the Micronano System Workshop May 15-16 in Uppsala, Sweden


MSW is a forum where industry, researchers and national organizations can have stimulating meetings on research, development and industrial use of MEMS/MST in Scandinavia. A key factor has been the informal atmosphere which has stimulated many interesting contacts and projects at the previous workshops. Some participants know much about microsystems, others have a strong application know-how, while still others have ideas or a general curiosity.

SPIE Advanced Lithography 2014 – February 23-27, 2014

San Jose Marriott and San Jose Convention Center
San Jose, California, United States
23 – 27 February 2014

Coventor will be in Booth #330

alThis is the premier conference for the lithography community. For 38 years, SPIE has brought together this community to address challenges presented in fabricating next-generation integrated circuits. Symposium participants come from an extensive array of backgrounds to share and learn about state-of-the-art lithographic tools, resists, metrology, processes, and design and process integration.

Coventor will be in Booth #330 and showcasing our SEMulator3D 2014 virtual fabrication platform that leading IDMs, foundries and memory suppliers are using to dramatically reduce the cost and time involved in process development invoking advanced technologies such as FinFETS and 3D ICs.

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Join Coventor for an evening of Insights from the Experts on Advanced Technology Development.

In the Trenches:
Insights from the Experts on Advanced Technology Development

Please join Coventor for an open discussion where experts will share their insights on advanced technology development.

Enjoy an evening of cocktails, hors d’oeuvres and stimulating conversation.


Dr. Brian J. Greene
IBM, Senior Engineer, FEOL Architect
Mark Fischer
Micron Technology, Senior Research Engineer
Dr. Andy Wei
GLOBALFOUNDRIES, Principle Member of Technical Staff, 10nm

Jaouen Herve, Ph.D.
STMicroelectronics, Director Modeling & Simulation, Silicon Tech. Development
Sean Lian, Ph.D.
Samsung Electronics, Director/Technology Lead
Laith Altimime, Ph.D.
IMEC, Director, CMOS Technology & Design

Dr. David M. Fried
Coventor, Chief Technology Officer, Semiconductor

Location: Churchill Embassy Row Hotel
Kalorama Ballroom
1914 Connecticut Ave NW, Washington, D.C.
ACROSS THE STREET from the IEDM Conference location

Date: Tuesday, December 10th, 2013

Time: 5:30PM-8:30PM
Discussion to begin at 6:30pm

Cocktails and hors d’oeuvres to be served



Space is limited for this Complimentary Reception so please RSVP early.