Previous Events

AVS 60th International Symposium & Exhibition – Oct 27 – Nov 1, 2013

Long Beach, California

Ryan Patz will deliver a paper on Advanced BEOL/Interconnect Etching, which looks at the use of virtual fabrication in the development of a 22nm process technology. His talk is on Monday October 28, 2013 at4:00 PM. It is based on his white paper which can be downloaded here.

The AVS International Symposium and Exhibition addresses cutting-edge issues associated with materials, processing, and interfaces in both the research and manufacturing communities. The weeklong Symposium fosters a multidisciplinary environment that cuts across traditional boundaries between disciplines, featuring papers from AVS technical divisions, technology groups, and focus topics on emerging technologies. The equipment exhibition is one of the largest in the world and provides an excellent opportunity to view the latest products and services offered by over 200 participating companies. More than 2,000 scientists and engineers gather from around the world to attend.

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TRANSDUCERS’ 2013, June 16-20, 2013, Barcelona. Spain

The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, June 16-20, 2013, Barcelona. Spain

On June 17th, Coventor is sponsoring a Market Briefing on MEMS Manufacturing Technologies arranged by Yole Development.

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SEMICON West 2013 – July 9-11, 2013 – San Francisco, CA


SEMICON West showcases the world’s best technology companies from across the micro-electronics supply chain and beyond. This event brings together the people, companies, technologies, and ideas that drive the electronics revolution. SEMICON West is the premier venue for microelectronics innovation.

Coventor CTO David Fried will be delivering a talk on a virtual fabrication approach to developing new process technologies.

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INTERNATIONAL MEMS FORUM 2013 – June 25-26, Electropribor, St. Petersburg, Russia


MEMS FORUM is the only industry event in Russia exclusively focused on MEMS development, production and market issues.The 2013 conference program is dedicated to exploring the most up-to-date MEMS materials and products and their applications, issues of system integration, power management, challenges of the usage of MEMS in both commercial and non-commercial fields and market issues. MEMS Forum identifies cutting-edge trends, explores them in an information-packed conference program and reflects those trends through product and process announcements.

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SISPAD 2013 – September 3-5, 2013 – Glasgow, Scotland

Coventor and IBM will jointly present a paper on the use of ‘virtual fabrication’ methodologies and technology to accelerate the development of and achieve optimal yields with IBM’s 22-nm process. The paper describes the use of Coventor’s SEMulator3D platform to dramatically decrease silicon learning cycles and lower overall development costs.

22nm Technology Yield Optimization Using Multivariate 3D Virtual Fabrication

Benjamin R. Cipriany (IBM), David M. Fried (Coventor), Basanth Jagannathan and Gregory Costrini (IBM), Ken Greiner (Coventor), Ahmed Nayaz Noemaun, Katsunori Onishi, Shreesh Narasimha, Bidan Zhang, Christopher D. Sheraw, and Jason E. Meiring (IBM), Daniel Faken (Coventor), Mahender Kumar, Karen A. Nummy, and Ning Zhan (IBM), Stephen R. Breit (Coventor), and James P. Norum, Stephen S. Furkay, Rajeev Malik, Paul D. Agnello, and Haraprasad Nanjundappa (IBM)

DTIP 2013 – Design, Test, Integration & Packaging of MEMS/MOEMS – Barcelona, Spain 16-18 April 2013

This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. 72 submissions were received from 17 countries. The symposium will be held in Barcelona, Spain, 16-18 April 2013, includes 2 conferences – CAD, design and test / Microfabrication, integration and packaging -, 2 invited talks and 2 special sessions. The symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.

Coventor will be presenting a paper called “A novel approach to RF MEMS device– and system-level simulation based on MEMS+ and Matlab-Simulink.” It will be presented by Alexandre Mehdaoui and Gerold Schroepfer of Coventor, along with colleagues from ESIEE, France. The session is scheduled for Wednesday (17.04.2013)

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