Coventor and IBM will jointly present a paper on the use of ‘virtual fabrication’ methodologies and technology to accelerate the development of and achieve optimal yields with IBM’s 22-nm process. The paper describes the use of Coventor’s SEMulator3D platform to dramatically decrease silicon learning cycles and lower overall development costs.
22nm Technology Yield Optimization Using Multivariate 3D Virtual Fabrication
Benjamin R. Cipriany (IBM), David M. Fried (Coventor), Basanth Jagannathan and Gregory Costrini (IBM), Ken Greiner (Coventor), Ahmed Nayaz Noemaun, Katsunori Onishi, Shreesh Narasimha, Bidan Zhang, Christopher D. Sheraw, and Jason E. Meiring (IBM), Daniel Faken (Coventor), Mahender Kumar, Karen A. Nummy, and Ning Zhan (IBM), Stephen R. Breit (Coventor), and James P. Norum, Stephen S. Furkay, Rajeev Malik, Paul D. Agnello, and Haraprasad Nanjundappa (IBM)
This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. 72 submissions were received from 17 countries. The symposium will be held in Barcelona, Spain, 16-18 April 2013, includes 2 conferences – CAD, design and test / Microfabrication, integration and packaging -, 2 invited talks and 2 special sessions. The symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Coventor will be presenting a paper called “A novel approach to RF MEMS device– and system-level simulation based on MEMS+ and Matlab-Simulink.” It will be presented by Alexandre Mehdaoui and Gerold Schroepfer of Coventor, along with colleagues from ESIEE, France. The session is scheduled for Wednesday (17.04.2013)
Learn more at: http://cmp.imag.fr/conferences/dtip/dtip2013/
The 10th International Workshop on Nanomechanical Sensing (NMC 2013) is focused on interdisciplinary research on and with nanoscale sensors.
EDAWorkshop13 and CATRENE Design Technology Conference (DTC)
from May 14 – 16, 2013 in Dresden, Germany.
The event features keynotes by Maurizio Zuffada (ST Microelectronics), Gerold Schröpfer (Coventor), Hans-Jürgen Brand (GLOBALFOUNDRIES), Ulrich Abelein (Audi), Alex Ramirez (BSC) and Raul Camposano (Nimbic). With a mix of representatives from industry and academic research it creates ideal opportunities for a professional exchange of ideas and results on a scientific basis.
DAC is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP). Coventor will once again be participating and demonstrating how our MEMS design solution integrates with traditional IC design environments from companies like Cadence and The MathWorks.
Coventor will be in booth # E-07
Taipei International Convention Center
The 26th IEEE International Conference on Micro Electro Mechanical Systems (IEEE MEMS 2013) will be held in Taipei, Taiwan on January 20 – 24, 2013 at the Taipei International Convention Center (TICC). IEEE MEMS is one of the premier annual events reporting research results on every aspect of microsystems technology. This conference reflects the rapid proliferation of the commitment and success of the microsystems research community. Recently, the IEEE MEMS Conference has attracted more than 700 participants, 950+ abstract submissions and has created a forum to present over 300 peer-reviewed, top-quality papers in podium and poster/oral sessions.
MEMS Executive Congress® Europe 2013!
12 March 2013 | Steigenberger Airport Hotel | Amsterdam, The Netherlands
MEMS Executive Congress is for senior-level executives in the the MEMS supply chain, companies that integrate MEMS into products, investors, and companies interested in learning more about MEMS.
International Conference & Exhibition on Integration Issues of Miniaturized Systems – MEMS, NEMS, ICs and Electronic Components
Smart Systems Integration is the international communication platform for research institutes and manufacturers to exchange know-how on smart systems integration and to create the basis for successful research cooperations with focus on Europe.