Previous Events

INTERNATIONAL MEMS FORUM 2013 – June 25-26, Electropribor, St. Petersburg, Russia


MEMS FORUM is the only industry event in Russia exclusively focused on MEMS development, production and market issues.The 2013 conference program is dedicated to exploring the most up-to-date MEMS materials and products and their applications, issues of system integration, power management, challenges of the usage of MEMS in both commercial and non-commercial fields and market issues. MEMS Forum identifies cutting-edge trends, explores them in an information-packed conference program and reflects those trends through product and process announcements.

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SISPAD 2013 – September 3-5, 2013 – Glasgow, Scotland

Coventor and IBM will jointly present a paper on the use of ‘virtual fabrication’ methodologies and technology to accelerate the development of and achieve optimal yields with IBM’s 22-nm process. The paper describes the use of Coventor’s SEMulator3D platform to dramatically decrease silicon learning cycles and lower overall development costs.

22nm Technology Yield Optimization Using Multivariate 3D Virtual Fabrication

Benjamin R. Cipriany (IBM), David M. Fried (Coventor), Basanth Jagannathan and Gregory Costrini (IBM), Ken Greiner (Coventor), Ahmed Nayaz Noemaun, Katsunori Onishi, Shreesh Narasimha, Bidan Zhang, Christopher D. Sheraw, and Jason E. Meiring (IBM), Daniel Faken (Coventor), Mahender Kumar, Karen A. Nummy, and Ning Zhan (IBM), Stephen R. Breit (Coventor), and James P. Norum, Stephen S. Furkay, Rajeev Malik, Paul D. Agnello, and Haraprasad Nanjundappa (IBM)

DTIP 2013 – Design, Test, Integration & Packaging of MEMS/MOEMS – Barcelona, Spain 16-18 April 2013

This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. 72 submissions were received from 17 countries. The symposium will be held in Barcelona, Spain, 16-18 April 2013, includes 2 conferences – CAD, design and test / Microfabrication, integration and packaging -, 2 invited talks and 2 special sessions. The symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.

Coventor will be presenting a paper called “A novel approach to RF MEMS device– and system-level simulation based on MEMS+ and Matlab-Simulink.” It will be presented by Alexandre Mehdaoui and Gerold Schroepfer of Coventor, along with colleagues from ESIEE, France. The session is scheduled for Wednesday (17.04.2013)

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NMC 2013 – The 10th International Workshop on Nanomechanical Sensing – Stanford, California May 1-3, 2013

The 10th International Workshop on Nanomechanical Sensing (NMC 2013) is focused on interdisciplinary research on and with nanoscale sensors.
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EDA Workshop 13 and CATRENE DTC – May 14-16, 2013

EDAWorkshop13 and CATRENE Design Technology Conference (DTC)
from May 14 – 16, 2013 in Dresden, Germany.

The event features keynotes by Maurizio Zuffada (ST Microelectronics), Gerold Schröpfer (Coventor), Hans-Jürgen Brand (GLOBALFOUNDRIES), Ulrich Abelein (Audi), Alex Ramirez (BSC) and Raul Camposano (Nimbic). With a mix of representatives from industry and academic research it creates ideal opportunities for a professional exchange of ideas and results on a scientific basis.

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DAC 2013 Austin: Celebrating 50 years of Innovation AUSTIN, TX | JUNE 2-6

DAC is the premier conference devoted to the design and automation of electronic systems (EDA), embedded systems and software (ESS), and intellectual property (IP). Coventor will once again be participating and demonstrating how our MEMS design solution integrates with traditional IC design environments from companies like Cadence and The MathWorks.

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