What’s New in MEMS+ 6.1

MEMS+® 6.1 was released in June 2016. This full release has multiple new features and enhancements:

  • New options that make it easier to import designs:
    • New Layout component makes it much easier to convert an existing layout to a MEMS+ model
    • New Rigid Geometry component allows users to create rigid components of arbitrary shape by importing solid geometry in ACIS SAT or SAB format
    • The Rigid Plate component can be designated as fixed which is useful for modeling mechanical anchors
  • Multiple improvements for modeling devices that use electrostatic combs:
    • Effects of small side-wall angle on capacitance and electrostatic force
    • New add-on component for squeezed-film damping
    • Enclosure options for Curved Comb Stator models
    • Faster simulations when combs disengage out-of-plane
  • Multiple improvements for modeling capacitive microphones:
    • Back-plate perforations of different shapes (triangles, diamonds, hexagons,…) are allowed and users can override the capacitance to account for the perforation shape
    • Noise produced by back-plate perforations and edges is properly calculated in Cadence simulations
    • Back-plate flexibility can be modeled using Movable Gap components
  • New capability for Reduced-Order Models (ROMs):
    • ROMS exported in MROM format can be simulated with the built-in Simulator and MATLAB® scripts as well as in Simulink®
  • General usability improvements:
    • Easier-to-use Measure function reports distance and snap-point coordinates on the canvas
    • Faster 3D rendering: up to 3X faster in Innovator and 6X faster in Scene3D
    • Internal mechanical connections are preserved when portions of a design are replicated, copied or mirrored
Webpage 6.1 graphic

Quarter microphone with flexible back plate modeled in with the new Movable Gap capabilities in MEMS+ 6.1. Process-induced stress in electrodes patterned on the diaphragm and backplace causes deformation.

 

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