A System-Model-Based Design Environment for 3D Simulation and Animation of Micro-Electro-Mechanical Systems (MEMS), Gunar Lorenz and Mattan Kamon, Coventor
ABSTRACT:
We will describe recent advances in CoventorWare ARCHITECTTM, a comprehensive MEMS design and simulation environment. In ARCHITECT, MEMS designers work in a schematic driven environment using symbols that represent individual components or elements of components. These symbols are connected and parameterized in the schematic to represent a three dimensional MEMS device. The schematic symbols and the mathematical models that they represent enable exploration of the parametric design space in seconds or minutes with accuracy that rivals finite element analysis. Previously, schematic-driven MEMS design environments, while extremely fast, had a fundamental obstacle to widespread acceptance: they lacked a three-dimensional view. The three-dimensional geometry was represented abstractly with symbols and parameters, and the simulation results were two-dimensional plots of individual degrees of freedom of the structure. In this article we describe a new companion 3D visualization tool, Scene3D that, when combined with fast simulation speed of ARCHITECT, provides unprecedented insight into the complex dynamic behavior of MEMS devices. Scene3D is useful both during schematic creation and for quickly interpreting simulation results. From a user perspective, “one button click” creates 3D views of any ARCHITECT schematic and enables designers to visualize simulation results in colorful three-dimensional animations that make it much easier to understand the dynamic behavior of a MEMS device.

Designing MEMS for Reliability, Mark da Silva, Coventor
ABSTRACT:
In recent years, the topic of reliability of MEMS has become an increasingly important priority for an industry focused on delivering low-cost products to the market in the shortest possible time. This paper will focus on the Design for Reliability (DfR) of MEMS by discussing CAD Methodologies and how they impact DfR, feature based design and system level architectural improvements, and functional yield modeling. As with any other manufacturing technology process development and material property characterization, and an understanding of the physics of failure (POF), impact design strategies for improving yield, design for reliability (DFR), packaging and test.

Design Automation for MEMS/MST, J. van Kuijk, G. Schropfer, Mark daSilva. Coventor BV. The Netherlands. Coventor Sarl. France. Coventor inc. Cambridge (USA). Design, Automation, and Test in Europe, 2005. Munich, Germany..

ABSTRACT:
In this paper we only summarized some of the design automation topics in the MEMS field that are still of the main concern of MEMS design groups. The MEMS designers will be confronted with large variations in process steps, unknown material property data and even the lack of design kits for existing foundries. In addition the MEMS device will have to be packaged in some way. We encourage to include package design considerations as early as possible in the MEMS device design process. We believe that this can be structured by using software tools for this as well, we have shown this by marketing the Kyocera Standard packaging library with software. Understanding different modelling levels gives a clearer picture of where design automation tools can be used, how the different results are communicated between different modelling levels and how all this is captured in existing tools.

MEMS Manufacturing Technology for Actuated Cantilever and Pressure Sensor, Greg Thompson. TVI Community College, Alburquerque, NM. MEMS Scholarship 2004 Winner.

High Angular Rate and High g Effects in the MEMS Gyro, Chris Kennedy, Coventor Mark Bellrichard, Honeywell Mark Weber, Honeywell. Coventor & Honeywell.

ABSTRACT:
Abstract - The effects of high rate (up to 50 revolutions per second) and high operating accelerations (up to 500 G's) are analyzed and presented. The analysis was done using CoventorWare ARCHITECT™ that models the mechanical and electrical effects of these rough environments on a MEMS gyro. A sample MEMS gyro structure is analyzed and shows that the MEMS gyros are capable of simultaneous high rates and high G's.

An Actuated Microneedle for Automated Blood Sampling, Giorgio Gattiker. University of Calgary MEMS Scholarship 2004 Winner.

Standard Open Tooled Packages for MEMS Enabled Products, Mark daSilva. Coventor.

ABSTRACT:
A well recognized commercialization barrier for MEMS enabled products has been and continues to be packaging. This is a significant technological problem in the MEMS industry, and has resulted in custom packaging for each application, leading to higher overall package cost, which may be as high as 80% of the product cost. Packaging of MEMS components differs significantly from the packaging of microlectronics, which is well established, primarily because unlike microelectronics, the functional specification of the MEMS chip is critical to the design of the package. Industry experts also recognize that a “lack of attention” may be a contributing factor to the overall problem both within organizations, as well as externally by industry vendors and suppliers. Today there are new options for reducing MEMS packaging costs and ultimately bring MEMS devices to market faster.

MEMS Move Toward Standardization, Siebe Bouwstra, Mark da Silva, & Gerold Schröpfer . Coventor Inc..

ABSTRACT:
Microelectromechanical systems (MEMS) offer the handheld and consumer electronics industry great hope for enhanced functionality. MEMS based accelerometers, microphones, pressure sensors, antennas, RF switches and embedded memory chips, are being integrated with IC products and leading to new applications. Yet to reach the end-user, MEMS technology must become commercialized enough to offer cost-effective volume production. Like most industries this only occurs when some level of standardization is present. A key to MEMS industry growth is the emergence of standardized material characterizations. The presence of reliable material properties, processing effects and variables during design and manufacturing will determine how and when MEMS are volume-production ready.

Designing Manufacturable MEMS in CMOS Compatible Processes - Methodology and Case Studies, Gerold Schröpfer*1, Mark McNie2, Mark da Silva3, Rhodri Davies2, Alexandra Rickard2, François-Xavier. 1Coventor SARL, 3 Avenue du Québec, 91140 Villebon sur Yvette, France, 2QinetiQ Ltd, St Andrews Road, Malvern, Worcs WR14 3PS, UK, 3Coventor Inc, 625 Mt Auburn St., Cambridge, MA 02138, USA.

ABSTRACT:
MEMS, MOEMS, and Micromachining, Strasbourg, France,

Designing MEMS for Reliability, Mark da Silva, Coventor

ABSTRACT:
In recent years, the topic of reliability of MEMS has become an increasingly important priority for an industry focused on delivering low-cost products to the market in the shortest possible time. This paper will focus on the Design for Reliability (DfR) of MEMS by discussing CAD Methodologies and how they impact DfR, feature based design and system level architectural improvements, and functional yield modeling. As with any other manufacturing technology process development and material property characterization, and an understanding of the physics of failure (POF), impact design strategies for improving yield, design for reliability (DFR), packaging and test.

Design Automation for MEMS/MST, J. van Kuijk, G. Schropfer, Mark daSilva. Coventor BV. The Netherlands. Coventor Sarl. France. Coventor inc. Cambridge (USA). Design, Automation, and Test in Europe, 2005. Munich, Germany..

ABSTRACT:
In this paper we only summarized some of the design automation topics in the MEMS field that are still of the main concern of MEMS design groups. The MEMS designers will be confronted with large variations in process steps, unknown material property data and even the lack of design kits for existing foundries. In addition the MEMS device will have to be packaged in some way. We encourage to include package design considerations as early as possible in the MEMS device design process. We believe that this can be structured by using software tools for this as well, we have shown this by marketing the Kyocera Standard packaging library with software. Understanding different modelling levels gives a clearer picture of where design automation tools can be used, how the different results are communicated between different modelling levels and how all this is captured in existing tools.

Standard Open Tooled Packages for MEMS Enabled Products, Mark daSilva. Coventor.

ABSTRACT:
A well recognized commercialization barrier for MEMS enabled products has been and continues to be packaging. This is a significant technological problem in the MEMS industry, and has resulted in custom packaging for each application, leading to higher overall package cost, which may be as high as 80% of the product cost. Packaging of MEMS components differs significantly from the packaging of microlectronics, which is well established, primarily because unlike microelectronics, the functional specification of the MEMS chip is critical to the design of the package. Industry experts also recognize that a “lack of attention” may be a contributing factor to the overall problem both within organizations, as well as externally by industry vendors and suppliers. Today there are new options for reducing MEMS packaging costs and ultimately bring MEMS devices to market faster.

MEMS Move Toward Standardization, Siebe Bouwstra, Mark da Silva, & Gerold Schröpfer . Coventor Inc..

ABSTRACT:
Microelectromechanical systems (MEMS) offer the handheld and consumer electronics industry great hope for enhanced functionality1. MEMS based accelerometers, microphones, pressure sensors, antennas, RF switches2 and embedded memory chips, are being integrated with IC products and leading to new applications. Yet to reach the end-user, MEMS technology must become commercialized enough to offer cost-effective volume production. Like most industries this only occurs when some level of standardization is present. A key to MEMS industry growth is the emergence of standardized material characterizations. The presence of reliable material properties, processing effects and variables during design and manufacturing will determine how and when MEMS are volume-production ready.

RF/Optical MEMS Integration, Preeti Sharma. Indian Institute of Technology, Delhi India.

ABSTRACT:
My research is focussed in the field of design, fabrication and packaging of RF MEMS Devices and optical integration of conventional MEMS devices at system-level architecture. Devices include Ka-band micromachined transmission lines, antennas, filters, resonators and switches. The device-developing strategy rest on analysis such as electrostatic, mechanical, sensitivity and electromagnetic. I am already using finite element method (FEM) based ANSOFT HFSS 9.0 and ANSOFT Designer for electromagnetic analysis. This third-party tool together with CoventorWare 2004 (based on tetrahedral finite-element meshing) will be a complete workstation for me. My strategy is to apply certain perturbing methods for boundary conditions, and manual meshing techniques such that the results from a software suite can be made to match the measured results with extreme accuracy. As an example of this, I have published a paper (INCURSI 2003) on design of a CPW fed slot-antenna at 17GHz (one in which accurate response depends on accurate assignment of boundary conditions and applying meshing intelligently). I intend to explore the CoventorWare 2004 tool for carrying out detailed study of micromachined structures mentioned in the full

Using CoventorWare for BAW and FBAR Design, Mark da Silva. Coventor, Inc..

ABSTRACT:
CoventorWare delivers the necessary tools for designing and simulating Advanced Bulk Acoustic Wave (BAW) devices and Thin Film Bulk Acoustic Resonators (FBARs) used in filters.

MEMS Design for Manufacturability (DFM), M. G. da Silva, R. Giasolli, S. Cunningham, and D. DeRoo. Coventor, Inc. Sensors Expo 2002, Boston, MA. September 2002.

ABSTRACT:
The maturity of MEMS CAD tools in recent years is finally enabling improved qualification of existing manufacturing practices of MEMS based components. However, the MEMS product development process is still quite inefficient due both design and process related factors including: a lack of reliable material properties, the difficulty in qualifying new process improvements and insufficient design rules for existing processes (i.e. the general lack of "standard processes") and perhaps most significantly the adoption of design tools that meet the requirements of the concurrent engineering strategy desired. The development of a robust MEMS Design for Manufacturability (DFM) strategy must link the design and process groups [1], by (i) establishing systematic design principles and (ii) providing a common CAD framework for evaluation of product designs and process flow. A methodology for MEMS DFM is presented that focuses on rapid process and design qualification through systematic parametric modeling & testing, from initial development of specifications to volume manufacturing. The net result of such an approach is highly qualified designs with accurately predicted behavior, for scalable, repeatable, cost-effective volume production.

Rf Mems Switch Platforms Expedite MEMS Integration and Commercialization, Jeffrey Hilbert and Art Morris, Ph.D. Coventor, Inc., Irvine, CA and Cary, NC. COMMS 2002, Ypsilanti, Michigan, USA.

ABSTRACT:
Consumer demand for highly personalized, ubiquitous access to information continues to increase rapidly. Growing volumes of data traffic and demands for higher quality products and services have driven the proliferation of new portable and fixed communications. Suppliers of wireless and wire line communications are being challenged to provide more features, bandwidth, and talk time with shorter product development cycles, less power, and smaller footprints. These market trends necessitate new product architectures that are enabled by technologies beyond that of planar integrated circuits (ICs). Micro-electro-mechanical systems (MEMS) technology is one such technology.

On the Ultimate Limits of IC Inductors—An RF MEMS Perspective, H. J. De Los Santos. Coventor, Inc. Irvine, CA. Proceedings of the 52nd IEEE Electronic Components and Technology Conference. San Diego, CA. May 2002.

ABSTRACT:
Inductors are playing an ever-increasing role in RFICs, motivating extensive work on the development of structures to achieve optimized performance. In this paper we review the different approaches being explored to achieve high inductor Q and self-resonance frequency, in the context of conventional CMOS and BiCMOS processes, and examine how the application of RF MEMS techniques may effect superior monolithic inductor performance, and at what expense.

Designing Manufacturable MEMS in CMOS Compatible Processes - Methodology and Case Studies, Gerold Schröpfer*1, Mark McNie2, Mark da Silva3, Rhodri Davies2, Alexandra Rickard2, François-Xavier. 1Coventor SARL, 3 Avenue du Québec, 91140 Villebon sur Yvette, France, 2QinetiQ Ltd, St Andrews Road, Malvern, Worcs WR14 3PS, UK, 3Coventor Inc, 625 Mt Auburn St., Cambridge, MA 02138, USA.

ABSTRACT:
MEMS, MOEMS, and Micromachining, Strasbourg, France,

MEMS for RF Microwave Wireless Applications - The Next Wave: Part II, H. J. De Los Santos and R. J. Richards. Coventor, Inc., Cary, NC and Irvine, CA. Microwave Journal. July 2001.

ABSTRACT:
Microelectromechanical systems (MEMS) technology is on the verge of revolutionizing RF and microwave applications. The requirements of present day and future RF and microwave systems for lower weight, volume, power consumption and cost with increased functionality, frequency of operation and component integration are driving the development of new RF/microwave MEMS components and system architectures. Part I, published previously, presented a brief discussion of RF and microwave system requirements, and then introduced the enabling potential of MEMS to meet these requirements. Part II describes the revolutionary possibilities afforded by MEMS in system integration and novel architectures.

MEMS-A Wireless Vision, Héctor J. De Los Santos. Coventor, Inc., Irvine, CA. iMEMS 2001.

ABSTRACT:
Consumer exigency for ubiquitous wireless connectivity is widely recognized as the demand whose fulfillment will unleash the next industrial revolution beginning in the first decade of the 21st century. Indeed, market-driven demands for mobility-independent connectivity are shaping the conception of 3rd generation (3G) wireless appliances and services. These appliances and services, which include multi-mode, multi-band software-defined radio, higher speed data, improved voice, multimedia mobility, the Internet, and virtual personal networking, will ultimately be enabled by two scarce currencies, namely, power and bandwidth. Microelectromechanical systems (MEMS) technology, as applied to these wireless systems, is poised as the rich source capable of generously supplying these two key resources. In this talk we will present our concept of how MEMS will enable the fulfillment of this wireless vision.

MEMS for RF Microwave Wireless Applications - The Next Wave, R. J. Richards and H. J. De Los Santos. Coventor, Inc., Cary, NC and Irvine, CA. Microwave Journal. March 2001.

ABSTRACT:
Micro-Electro-Mechanical Systems (MEMS) technology is on the verge of revolutionizing RF and microwave applications. The requirements of present day and future RF microwave systems for lower weight, volume, power consumption, and cost with increased functionality, frequency of operation, and component integration are driving the development of new RF microwave and MEMS components and system architectures.

An Environment for Design and Modeling Of Electro-Mechanical Micro-Systems, M.H. Zaman, S.F. Bart, J.R. Gilbert, N.R. Swart*, and M. Mariappan*. Coventor, Inc., Cambridge, MA, 02142; *Analog Devices, Inc., Cambridge, MA. Journal of Modeling and Simulation of Microsystems 1.1, 1999, 65-76.

ABSTRACT:
This paper presents a comprehensive CAD environment for MEMS/MST design. The design flow includes MEMS mechanical schematic entry, parameterized cell layout generation, LVS style error checking, lumped parameter macro-model generation, and system level modeling of the micro-system. The design environment also provides error checking between different design views. The implemented macromodel extraction technique can be used for micro-systems that can be represented as multi-component massspring-dashpot structures. Examples include accelerometers, gyros, and other structures that have rigid masses and compliant springs. A mass-produced capacitive MEMS accelerometer (Analog Devices, Inc.'s ADXL76), is employed as an illustrative example of this procedure. The accuracy of the developed method is also verified by comparing macro-model results for several other MEMS structures to the results of full 3-D physics simulations. Good accuracy is demonstrated in both spatialdomain and frequency-domain dynamic behavior of the models.

3D Modeling of Contact Problems and Hysteresis in Coupled Electro-Mechanics, J.R. Gilbert, G.K. Ananthasuresh, and S.D. Senturia. Coventor, Inc., Cary, NC; University of Pittsburgh, Pittsburgh, PA; M.I.T, Department of Electrical Engineering and Computer Science, Cambridge, MA. MEMS 1996, 127-132.

ABSTRACT:
This paper discusses the modeling of electro-mechanical hysteresis in devices which exhibit contact between components. We make use of a recently developed tool, CoSolve-EM, in order to solve quasi-static 3D contact electro-mechanics for a clamped - clamped beam, calculating full displacement, capacitance and contact force vs. voltage. We then extend the simulations to two design variations of the beam which permit engineering of its hysteresis characteristics.

3D Coupled Electro-Mechanics for MEMS: Applications of CoSolve-EM, J.R. Gilbert, R. Legtenberg, and S.D. Senturia. *Coventor, Inc., Cambridge, MA, USA; MESA Research Institute, University of Twente, Enschede, The Netherlands; M.I.T, Department of Electrical Engineering and Computer Science, Cambridge, MA USA. Technical Proceedings of the International Conference on Micro Electro Mechanical Systems, Amsterdam, The Netherlands. MEMS 1995, 122-127.

ABSTRACT:
Micro-Electro-Mechanical Systems (MEMS) are often designed on scales at which electrostatic forces are capable of moving or deforming the parts of the system. In this regime accurate prediction of device bahavior may require 3D coupled simulations between the electrostatic and mechanical domains. We recently developed CoSolve-EM, a coupled solver for 3D quasi-static electro-mechanics. In this paper, we demonstrate the application of CoSolve-EM to five classes of electro-mechanical problems that are often intractable to other techniques. These classes are: devices with electrostatic pull-in instabilities, devices in which precise deformations are required, devices driven by multiple conductors, capacitive sensors that make use of surface contact, and actuators that make use of surface contact.

Designing MEMS for Reliability, Mark da Silva, Coventor

ABSTRACT:
In recent years, the topic of reliability of MEMS has become an increasingly important priority for an industry focused on delivering low-cost products to the market in the shortest possible time. This paper will focus on the Design for Reliability (DfR) of MEMS by discussing CAD Methodologies and how they impact DfR, feature based design and system level architectural improvements, and functional yield modeling. As with any other manufacturing technology process development and material property characterization, and an understanding of the physics of failure (POF), impact design strategies for improving yield, design for reliability (DFR), packaging and test.

Design Automation for MEMS/MST, J. van Kuijk, G. Schropfer, Mark daSilva. Coventor BV. The Netherlands. Coventor Sarl. France. Coventor inc. Cambridge (USA). Design, Automation, and Test in Europe, 2005. Munich, Germany..

ABSTRACT:
In this paper we only summarized some of the design automation topics in the MEMS field that are still of the main concern of MEMS design groups. The MEMS designers will be confronted with large variations in process steps, unknown material property data and even the lack of design kits for existing foundries. In addition the MEMS device will have to be packaged in some way. We encourage to include package design considerations as early as possible in the MEMS device design process. We believe that this can be structured by using software tools for this as well, we have shown this by marketing the Kyocera Standard packaging library with software. Understanding different modelling levels gives a clearer picture of where design automation tools can be used, how the different results are communicated between different modelling levels and how all this is captured in existing tools.

Photonic Band Gap/MEMS Actuation, Ariel Lipson. Imperial College, London, UK. MEMS Scholarship 2004 Winner.

ABSTRACT:
Project Summary Photonic band gap (PBG) crystals are nano-sized repetitive structures that enable us to manipulate and control light. Careful engineering of device material and dimensions will alter the reflection properties and hence control the transmitted wavelengths and direction of light propagation. Our project focuses on vertically etched PBG structures into a silicon substrate while using MEMS actuation to alter the physical dimensions of the devices. Such devices can be used as components in an optical communication network or in chemical and biological sensors

Standard Open Tooled Packages for MEMS Enabled Products, Mark daSilva. Coventor.

ABSTRACT:
A well recognized commercialization barrier for MEMS enabled products has been and continues to be packaging. This is a significant technological problem in the MEMS industry, and has resulted in custom packaging for each application, leading to higher overall package cost, which may be as high as 80% of the product cost. Packaging of MEMS components differs significantly from the packaging of microlectronics, which is well established, primarily because unlike microelectronics, the functional specification of the MEMS chip is critical to the design of the package. Industry experts also recognize that a “lack of attention” may be a contributing factor to the overall problem both within organizations, as well as externally by industry vendors and suppliers. Today there are new options for reducing MEMS packaging costs and ultimately bring MEMS devices to market faster.

MEMS Move Toward Standardization, Siebe Bouwstra, Mark da Silva, & Gerold Schröpfer . Coventor Inc..

ABSTRACT:
Microelectromechanical systems (MEMS) offer the handheld and consumer electronics industry great hope for enhanced functionality1. MEMS based accelerometers, microphones, pressure sensors, antennas, RF switches2 and embedded memory chips, are being integrated with IC products and leading to new applications. Yet to reach the end-user, MEMS technology must become commercialized enough to offer cost-effective volume production. Like most industries this only occurs when some level of standardization is present. A key to MEMS industry growth is the emergence of standardized material characterizations. The presence of reliable material properties, processing effects and variables during design and manufacturing will determine how and when MEMS are volume-production ready.

RF/Optical MEMS Integration, Preeti Sharma. Indian Institute of Technology, Delhi India.

ABSTRACT:
My research is focussed in the field of design, fabrication and packaging of RF MEMS Devices and optical integration of conventional MEMS devices at system-level architecture. Devices include Ka-band micromachined transmission lines, antennas, filters, resonators and switches. The device-developing strategy rest on analysis such as electrostatic, mechanical, sensitivity and electromagnetic. I am already using finite element method (FEM) based ANSOFT HFSS 9.0 and ANSOFT Designer for electromagnetic analysis. This third-party tool together with CoventorWare 2004 (based on tetrahedral finite-element meshing) will be a complete workstation for me. My strategy is to apply certain perturbing methods for boundary conditions, and manual meshing techniques such that the results from a software suite can be made to match the measured results with extreme accuracy. As an example of this, I have published a paper (INCURSI 2003) on design of a CPW fed slot-antenna at 17GHz (one in which accurate response depends on accurate assignment of boundary conditions and applying meshing intelligently). I intend to explore the CoventorWare 2004 tool for carrying out detailed study of micromachined structures mentioned in the full

Modeling of Multi-Phase Flows in MEMS World, Jun Zeng. Coventor, Inc..

ABSTRACT:
Simulation-based design analysis can avoid costly, iterative experimental design process where components are fabricated, tested, and then redesigned to improve performance. This paper give examples of microfluidics problems and how they are solved by CoventorWare for four applications: 1) Ink-Jet Printing Heads 2) Labs-on-a-Chip 3) Micro Arrays, and 4) Micro-Opto-Electro-Mechanical Systems.

!!!!!!!!! MEMS03_kaistmirror.pdf - MISSING
A high fill-factor micro-mirror stacked on a crossbar torsion spring for electrostatically-actuated two-axis operation in large-scale optical switch , Ji-Hyuk Kim, Hyung-Kew Lee, Byung-Il Kim, Jin-Wan Jeon, Jun-Bo Yoon, and Euisik Yoon. Korea Advanced Institute of Science and Technology (KAIST). 16th IEEE International Micro Electro Mechanical Systems Conference,2003 (Available by permission of KAIST authors).

ABSTRACT:
A high-fill factor micro-mirror for two-axis operation has been designed, analyzed, and fabricated by using electroplated copper and thick photoresist sacrificial mold. The fabricated mirror has crossbar springs under the mirror plate for two-axis operation in order to achieve a high-fill factor. The maximum actuation angle before pull-in in the fabricated device has been measured as 2.65° at 244V. This shows good agreement with analysis and simulation results. The radius of curvature and RMS surface roughness of the mirror plate have been measured as 3.8cm and 12nm, respectively.

A Vertical Electrostatic Actuator with Extended Digital Range via Tailored Topology, Zhang, Yanhang and Martin L. Dunn. University of Colorado at Boulder. SPIE 2002.

ABSTRACT:
We describe the design, fabrication, and testing of an electrostatic vertical actuator that exhibits a range of motion that covers the entire initial gap between the actuator and substrate and provides controllable digital output motion. This is obtained by spatially tailoring the electrode arrangement and the stiffness characteristics of the microstructure to control the voltage-deflection characteristics. The concept is based on the electrostatic pull down of bimaterial beams, via a series of electrodes attached to the beams by flexures with tailored stiffness characteristics. The range of travel of the actuator is defined by the post-release deformed shape of the bilayer beams, and can be controlled by a post-release heattreat process combined with a tailored actuator topology (material distribution and geometry, including spatial geometrical patterning of the individual layers of the bilayer beams). Not only does this allow an increase in the range of travel to cover the entire initial gap, but it also permits digital control of the tip of the actuator which can be designed to yield linear displacement - pull in step characteristics. We fabricated these actuators using the MUMPs surface micromachining process, and packaged them in-house. We measured, using an interferometric microscope, full field deformed shapes of the actuator at each pull in step. The measurements compare well with companion simulation results, both qualitatively and quantitatively. NOTE: The authors have performed some experiments where 4 actuators are assembled with a mirror to provide a optical switch.

Designing Manufacturable MEMS in CMOS Compatible Processes - Methodology and Case Studies, Gerold Schröpfer*1, Mark McNie2, Mark da Silva3, Rhodri Davies2, Alexandra Rickard2, François-Xavier. 1Coventor SARL, 3 Avenue du Québec, 91140 Villebon sur Yvette, France, 2QinetiQ Ltd, St Andrews Road, Malvern, Worcs WR14 3PS, UK, 3Coventor Inc, 625 Mt Auburn St., Cambridge, MA 02138, USA.

ABSTRACT:
MEMS, MOEMS, and Micromachining, Strasbourg, France,

Design and Simulation of MOEMS, G. Lorenz and I. Lakkis. Coventor, Inc. Cambridge, MA. To be published in Japanese by Gijutsu Jouhou Kyoukai.

ABSTRACT:
MOEMS are emerging from the laboratory to provide unparalleled functionality in optical telecommunications applications. While the ultimate speed of these devices is unlikely to compete with solid-state or electro-optic devices, the transparency that can be achieved with MOEMS contributes negligible degradation to optical channels and thus enables long range flexible all-optical networks. Beam steering has been shown to be the optimum approach for scaling optical cross-connect switching to large port counts and MOEMS have proven to be the method of choice for compact implementations of this concept. Other telecommunication applications include smaller switches, variable attenuators, equalizers, modulators, and polarization and dispersion compensators. Applications outside optical communications for MOEMS include scanning, projection, display, printing, sensing, and data storage.

A Study of Optomechanical Variations and Control in a MOEMS Switch Model, T. Plowman, R.. Stoll, D. Winick, and A. Morris III. Coventor, Inc., Cary, NC. Micromachining and Microfabrication 2001, San Francisco, CA.

ABSTRACT:
This work demonstrates how optomechanical alignment inaccuracies affect the operation of a small port-count, fiber coupled, MOEMS switch using six degrees of freedom, parameterized behavioral models. Simulation results show that a control system is essential to stabilize the switch when it is subjected to the variations that would otherwise degrade its performance.

Design Methodology and Development Environment of MEMS Device: Coventor's MEMS Top-down Design Methodology, Richard Cerruto. Coventor, Inc., Cary, NC. Design Wave Magazine, in Japanese.

ABSTRACT:
Demand for MEMS devices is growing within optical communications due to the ability of MEMS to provide bandwidth and flexibility. The same is true in RF wireless communications for next generation multimedia products, and in biotechnology for microfluidic applications. The goal now is to establish access to the technology through innovative software tools and industry expertise. CoventorWare uses a new design approach to reduce the number of prototype runs and increase time-to-market. The so-called top-down method begins with the system requirements, then builds a device that is functional within the end product. CoventorWare offers designers a semi-custom approach and rapid simulation and analysis that produces a successful design for commercial fabrication.

A Top-Down Design Flow for MOEMS, G. Lorenz, A. Morris, I. Lakkis. Coventor, Inc., Cary, NC. DTIP 2001.

ABSTRACT:
As MOEMS (Micro-Opto-Electro-Mechanical Systems) transition from laboratory curiosities to actual products inserted into telecommunication systems, a top down design flow is necessary to minimize time-to-market. We present a structured-custom approach for MOEMS design based on the concept of using parameterized behavioral models as a means to improve and speed up the design process. This approach enables users to quickly explore a larger design space on the interaction of the behavioral models with their surrounding system. Once the simulation is completed to the designer's satisfaction, a device layout can be output for FEM verification on critical areas or to generate the masks for fabrication.

A Design Flow for MOEMS, A. Morris, S. F. Bart, D. Kane, G. Lorenz and V. L. Rabinovitch. Coventor, Inc., Cambridge, MA and Paris, France. Photonics East 2000.

ABSTRACT:
As MOEMS transition from laboratory curiosities to tangible products inserted into telecommunication systems, a complete design flow is necessary for rapid product development to minimize time-to-market. We present a MOEMS design flow that provides efficient top-down design and accurate bottom-up verification. The detailed MOEMS device design is addressed along with an integrated capability for including other optical elements, packaging, opto-electronics, as well as drive and control electronics.

Hybrid Integration of Light Emitters and Detectors with SOI Based Micro-Opto-Electro-Mechanical Systems (MOEMS), Joel Kubby, Jim Calamita, Jets Chang, Jing Kuang Chen, Peter Gulvin, C.-C. Lin, Robert Loftus, Bill Nowak, Yi Su, Alex Tran, David Burns, Janusz Bryzek, John Gilbert, Charles Hsu, Tom Korsmeyer, Art Morris, Ted Plowman, Vladimir Rabinovich, Troy Daiber. NIST/ATP MOEMS Manufacturing Consortium. Optical SOI 2000.

ABSTRACT:
A multidisciplinary team of end users and suppliers has collaborated to develop a novel yet broadly enabling process for the design, fabrication, and assembly of Micro-Opto-Electro-Mechanical Systems (MOEMS). A key goal is to overcome the shortcomings of the polysilicon layer used for fabricating optical components in a conventional surface micromaching process. These shortcomings include the controllability and uniformity of material stress that is a major cause of curvature and deformation in released microstructures. The approach taken by the consortium to overcome this issue is to use the single-crystal-silicon (SCS) device layer of a Silicon-on-Insulator (SOI) wafer for the primary structural layer. Since optical flatness and mechanical reliability are of utmost importance in the realization of such devices, the use of the silicon device layer is seen as an excellent choice for devices which rely on the optical integrity of the materials used in their construction. A three-layer polysilicon process consisting of two structural layers is integrated on top of the silicon device layer. This add-on process allows for the formation of sliders, hinges, torsional springs, comb drives, and other actuating mechanisms for positioning and movement of the optical components. Flip-chip bonding techniques are also being developed for the hybrid integration of edge and surface emitting lasers on the front and back surfaces of the silicon wafer, adding to the functionality and broadly enabling nature of this process. In addition to process development, the MOEMS manufacturing consortium is extending Micro-Elecctro-Mechanical Systems (MEMS) modeling and simulation design tools into the optical domain, and using the newly developed infrastructure for fabrication of prototype micro-optical systems in the areas of industrial automation, optical switching for telecommunications, and laser printing.

An Environment for Design and Modeling Of Electro-Mechanical Micro-Systems, M.H. Zaman, S.F. Bart, J.R. Gilbert, N.R. Swart*, and M. Mariappan*. Coventor, Inc., Cambridge, MA, 02142; *Analog Devices, Inc., Cambridge, MA. Journal of Modeling and Simulation of Microsystems 1.1, 1999, 65-76.

ABSTRACT:
This paper presents a comprehensive CAD environment for MEMS/MST design. The design flow includes MEMS mechanical schematic entry, parameterized cell layout generation, LVS style error checking, lumped parameter macro-model generation, and system level modeling of the micro-system. The design environment also provides error checking between different design views. The implemented macromodel extraction technique can be used for micro-systems that can be represented as multi-component massspring-dashpot structures. Examples include accelerometers, gyros, and other structures that have rigid masses and compliant springs. A mass-produced capacitive MEMS accelerometer (Analog Devices, Inc.'s ADXL76), is employed as an illustrative example of this procedure. The accuracy of the developed method is also verified by comparing macro-model results for several other MEMS structures to the results of full 3-D physics simulations. Good accuracy is demonstrated in both spatialdomain and frequency-domain dynamic behavior of the models.

3D Modeling of Contact Problems and Hysteresis in Coupled Electro-Mechanics,
J.R. Gilbert, G.K. Ananthasuresh, and S.D. Senturia. Coventor, Inc., Cary, NC; University of Pittsburgh, Pittsburgh, PA; M.I.T, Department of Electrical Engineering and Computer Science, Cambridge, MA. MEMS 1996, 127-132.

ABSTRACT:
This paper discusses the modeling of electro-mechanical hysteresis in devices which exhibit contact between components. We make use of a recently developed tool, CoSolve-EM, in order to solve quasi-static 3D contact electro-mechanics for a clamped - clamped beam, calculating full displacement, capacitance and contact force vs. voltage. We then extend the simulations to two design variations of the beam which permit engineering of its hysteresis characteristics.

3D Coupled Electro-Mechanics for MEMS: Applications of CoSolve-EM, J.R. Gilbert, R. Legtenberg, and S.D. Senturia. *Coventor, Inc., Cambridge, MA, USA; MESA Research Institute, University of Twente, Enschede, The Netherlands; M.I.T, Department of Electrical Engineering and Computer Science, Cambridge, MA USA. Technical Proceedings of the International Conference on Micro Electro Mechanical Systems, Amsterdam, The Netherlands. MEMS 1995, 122-127.

ABSTRACT:
Micro-Electro-Mechanical Systems (MEMS) are often designed on scales at which electrostatic forces are capable of moving or deforming the parts of the system. In this regime accurate prediction of device bahavior may require 3D coupled simulations between the electrostatic and mechanical domains. We recently developed CoSolve-EM, a coupled solver for 3D quasi-static electro-mechanics. In this paper, we demonstrate the application of CoSolve-EM to five classes of electro-mechanical problems that are often intractable to other techniques. These classes are: devices with electrostatic pull-in instabilities, devices in which precise deformations are required, devices driven by multiple conductors, capacitive sensors that make use of surface contact, and actuators that make use of surface contact.

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Designing MEMS for Reliability, Mark da Silva, Coventor

ABSTRACT:
In recent years, the topic of reliability of MEMS has become an increasingly important priority for an industry focused on delivering low-cost products to the market in the shortest possible time. This paper will focus on the Design for Reliability (DfR) of MEMS by discussing CAD Methodologies and how they impact DfR, feature based design and system level architectural improvements, and functional yield modeling. As with any other manufacturing technology process development and material property characterization, and an understanding of the physics of failure (POF), impact design strategies for improving yield, design for reliability (DFR), packaging and test.

Design Automation for MEMS/MST, J. van Kuijk, G. Schropfer, Mark daSilva. Coventor BV. The Netherlands. Coventor Sarl. France. Coventor inc. Cambridge (USA). Design, Automation, and Test in Europe, 2005. Munich, Germany..

ABSTRACT:
In this paper we only summarized some of the design automation topics in the MEMS field that are still of the main concern of MEMS design groups. The MEMS designers will be confronted with large variations in process steps, unknown material property data and even the lack of design kits for existing foundries. In addition the MEMS device will have to be packaged in some way. We encourage to include package design considerations as early as possible in the MEMS device design process. We believe that this can be structured by using software tools for this as well, we have shown this by marketing the Kyocera Standard packaging library with software. Understanding different modelling levels gives a clearer picture of where design automation tools can be used, how the different results are communicated between different modelling levels and how all this is captured in existing tools.

Integrated Microfluidics Chip for Proteomics, Zhen Wang. University of Alberta, Edmonton, Canada. MEMS Scholarship 2004 Winner.

ABSTRACT:
The rapid expansion of proteomics demands far more rapid, sophisticated and automated analysis of proteins. Microfluidics is being evaluated as a potentially useful method. We have proved that we can integrate protein separation, fractionation, digestion and peptides concentration on the same microfluidic chip, due to the miniaturization of chips. The separated peptides are then detected by Mass Spectrometer allowing the protein to be identified.

An Actuated Microneedle for Automated Blood Sampling, Giorgio Gattiker. University of Calgary MEMS Scholarship 2004 Winner.

Standard Open Tooled Packages for MEMS Enabled Products, Mark daSilva. Coventor.

ABSTRACT:
A well recognized commercialization barrier for MEMS enabled products has been and continues to be packaging. This is a significant technological problem in the MEMS industry, and has resulted in custom packaging for each application, leading to higher overall package cost, which may be as high as 80% of the product cost. Packaging of MEMS components differs significantly from the packaging of microlectronics, which is well established, primarily because unlike microelectronics, the functional specification of the MEMS chip is critical to the design of the package. Industry experts also recognize that a “lack of attention” may be a contributing factor to the overall problem both within organizations, as well as externally by industry vendors and suppliers. Today there are new options for reducing MEMS packaging costs and ultimately bring MEMS devices to market faster.

MEMS Move Toward Standardization, Siebe Bouwstra, Mark da Silva, & Gerold Schröpfer . Coventor Inc..

ABSTRACT:
Microelectromechanical systems (MEMS) offer the handheld and consumer electronics industry great hope for enhanced functionality1. MEMS based accelerometers, microphones, pressure sensors, antennas, RF switches2 and embedded memory chips, are being integrated with IC products and leading to new applications. Yet to reach the end-user, MEMS technology must become commercialized enough to offer cost-effective volume production. Like most industries this only occurs when some level of standardization is present. A key to MEMS industry growth is the emergence of standardized material characterizations. The presence of reliable material properties, processing effects and variables during design and manufacturing will determine how and when MEMS are volume-production ready.

Numerical Modeling of Transport and Accumulation of DNA on Electronically Active Biochips , Samuel K. Kassegne, Howard Reese, Dalibor Hodko, Joon M. Yang, Kamal Sarkar, Dan Smolko and Paul Swanson (Nanogen Inc); Daniel E. Raymond (Genoptix); Michael J. Heller (Univ. California at San Diego); and Marc J. Madoud (Univ. California at Irvine). Sensors and Actuators B 94 (2003) 81–98 © 2003 Elsevier Science B.V. .

ABSTRACT:
Transport and accumulation of biomolecules, particularly DNA, in active electronic chips are investigated through numerical modeling and experimental verification. Various geometric and design configurations of electronically active DNA chips are considered. Further, we investigate the effect of electric field distribution on practical design of flow cells and chips. Particular attention is focused on the geometric effects on current and electric field distribution which are well captured by a finite element method-based model.We demonstrate that these geometric effects are observed only in buffers of very low conductivity. We also demonstrate that numerical models which do not include the charge transfer mechanism between electrodes and the buffer solution will fail to predict the reduction of these geometric effects with increased buffer conductivity.

The review of the technology is based on computer simulation using a finite element-based computational model and experimental results of electric field distribution, DNA transport and accumulation. Comparison of theoretical results for electrophoretic DNA accumulation with those obtained from experiments and a simple analytical model is presented.

Modeling of Multi-Phase Flows in MEMS World, Jun Zeng. Coventor, Inc..

ABSTRACT:
Simulation-based design analysis can avoid costly, iterative experimental design process where components are fabricated, tested, and then redesigned to improve performance. This paper give examples of microfluidics problems and how they are solved by CoventorWare for four applications: 1) Ink-Jet Printing Heads 2) Labs-on-a-Chip 3) Micro Arrays, and 4) Micro-Opto-Electro-Mechanical Systems.

On Modeling of Capillary Filling, Jun Zeng. Coventor, Inc..

ABSTRACT:
Understanding the capillary filling process is important to chip design. Different geometry of liquid flow pathway may result different capillary filling behavior such as filling time, possibility of entrapping an air bubble, etc. Knowledge on the filling process can guide designer arranging internal structure of the chip (such as chambers, binding pillars, splits, valves, etc) to avoid potential filling problem and achieve high filling speed.

In this paper, first, a reduced-order model of the filling process is derived based on momentum conservation. Further this reduced-order model is validated against detailed multiphase flows simulation package BubbleSim. The favorable match between detailed simulation and reduced-order modeling testify the correctness of our modeling. In this paper, the capillary-filling problem is limited unidirectional. It can easily be expanded to cover quasiunidirectional case (i.e., the channel width slightly varies along the channel length) via simple perturbation method.

Modeling Inkjet Print Heads Using CoventorWare, Coventor Applications Engineering Staff. Coventor, Inc..

ABSTRACT:
This presentation describes microfluidic system modeling using Coventor's ARCHITECT software. Partitioning and using ARCHITECT provides an approach to effective design and simulation, one which balances including full details with approximating answers. An example is given of how to break up the device into separate element models while capturing the dominating physics, as well as examples of 3D simulation using ANALYZER as a complement to partitioning. Questions to ask when modeling an inkjet and the CoventorWare tools that can be effectively used to answer the questions are summarized. (721 KB)

Channel flow network at low electric field with high flow resistance compensation pattern, Yongwon Jeong, Yongsuk Han, Songyi Kim, Haehyung Lee, Jun Keun Chang, Dongil Dan Cho, Doo Soo Chung, and Kukjin Chun. Seoul National University. 16th IEEE International Micro Electro Mechanical Systems Conference, 2003 (Available by permission of Seoul National University authors.).

ABSTRACT:
This paper presents the possible factors associated with the degradation that can be generated in a channel network structure and provides a solution to overcome this and assure high reliability. Cyclic capillary electrophoresis, which is the one of the channel network structures, has advantages in downsizing and a low operation voltage. However, there are some problems such as sample loss when the injected plug encounters the junctions in the middle of the channel. This paper explains the phenomenon of the cyclic CE as an example of the channel network structure. In the new design, the quartz cyclic CE chip showed < 2 % degradation per junction. This means the high resolution CE analysis has 100,000 plate numbers after a three and one quarter cycle ( 20.4 cm ) in just a 4 cm x 4 cm chip.

Designing Manufacturable MEMS in CMOS Compatible Processes - Methodology and Case Studies, Gerold Schröpfer*1, Mark McNie2, Mark da Silva3, Rhodri Davies2, Alexandra Rickard2, François-Xavier. 1Coventor SARL, 3 Avenue du Québec, 91140 Villebon sur Yvette, France, 2QinetiQ Ltd, St Andrews
Road, Malvern, Worcs WR14 3PS, UK, 3Coventor Inc, 625 Mt Auburn St., Cambridge, MA 02138, USA.

ABSTRACT:
MEMS, MOEMS, and Micromachining, Strasbourg, France,

System Design of Two Dimensional Microchip Separation Devices, J. C. Harley, R F. Day, J R. Gilbert, M. Deshpande, J. M. Ramsey* and S. C. Jacobson*. Coventor, Inc., Cary, NC; *Oak Ridge National Laboratory, Oak Ridge, TN. Technical Proceedings of Micro Total Analysis Systems, MicroTAS 2001, Monterey, CA.

ABSTRACT:
Two dimensional (2D) separation systems have been used extensively for the analysis of complex protein and peptide mixtures because of the increased peak capacity they provide relative to one-dimensional separations [1,2,3,4,5]. The effects of miniaturization of various separation schemes have been reported by Manz et al [6]. In general, miniaturization has been shown to provide high separation efficiencies and a convenient means of manipulating extremely small sample volumes. Recently, microscale 2D systems using micellar electrokinetic chromatography (MEKC) with capillary electrophoresis (CE) and open channel electrochromatography (OCEC) with CE have been reported [7,8]. In this paper, we will demonstrate the use of CAD software for predictive design of 2D microchips, using both detailed simulation for optimization of electrophoretic injections and turn designs, as well as reduced order modeling to better understand system performance trade-offs. Modeling results will be compared against experimental observations by Ramsey et al [7, 8].

A Rapid Vortex Micromixer for Studying High-Speed Chemical Reactions, Sebastian Bohm. Coventor BV, Amsterdam, The Netherlands. Technical Proceedings of Micro Total Analysis Systems, MicroTAS 2001, Monterey, CA.

ABSTRACT:
During the evolvement of the microTAS field in last decade, a large number of micromixers were presented. The majority of these micromixers where targeted towards the mixing of compounds for performing reactions in micro chemical systems. However, micromixers can also play an enabling role in the study of reactions on the microsecond time scale. Here, a micromixer is presented in which a vortex is employed to decrease mixing times by reduction of diffusion distance.

A Dynamic Spotting Method for Split-Pin Based Microarrays, J. Zeng, M. Deshpande, H-C Kan and J. R. Gilbert. Coventor, Inc., Cambridge, MA. Technical Proceedings of Micro Total Analysis Systems, MicroTAS 2001, Monterey, CA.

ABSTRACT:
The authors propose a non-contact spotting concept for split-pin based microarrays utilising dynamic control of the trajectory of the split-pin. Numerical simulation demonstrates that this novel method not only avoids the necessity of the pin tip striking the surface of the substrate , but also offers a new mechanism to realize spot-volume-on-demand, as well as enhance the uniformity of sample spots.

Fluidic Capacitance Model of Capillary-Driven Stop Valves, J. Zeng, M. Deshpande, K. Greiner, J. R. Gilbert. Coventor, Inc., Cambridge, MA. MEMS Proceedings 2000 ASME International Mechanical Engineering Congress and Exposition, Orlando, FL.

ABSTRACT:
This paper presents current research in design analysis of passive micro-fluidic stop valves driven by capillary forces. Capillary valves are used in controlling the liquid position by presenting a capillary pressure barrier due to a sudden change in cross-section. Valves of this type have multiple advantages on precise control in micro-fluidic devices over conventional ones. In the design of a device employing such valves, a model describing the behavior of these valves is highly desirable. In this paper, we describe the extraction of this model using numerical techniques validated with experiment. The numerical analyses are conducted in FlumeCAD, a design and analysis tool for micro-fluidic devices. The detailed analyses yield a fluidic capacitance model for the capillary-driven valves. Devices that are pneumatically pressurized and driven by centrifugal force are studied in this paper. The methodology presented in this article can, in principle, be applied to a wide range of devices and actuation mechanisms.

Novel Designs for Electrokinetic Injection in mTAS, M. Deshpande, K. B. Greiner, J. West, J. R. Gilbert, L. Bousse* and A. Minalla*. Coventor, Inc., Cambridge, MA, USA*; Caliper Technologies Corp., Mountain View, CA, USA. Technical Proceedings of Micro Total Analysis Systems. Enschede, The Netherlands, MicroTAS 2000. 339–342.

ABSTRACT:
Novel designs for electrokinetic injection are presented in this paper. The designs emerge using CAD analysis of the injection process. The designs are aimed at improving the separation efficiency of electrokinetic injectors by providing a narrower and more symmetric band in the separation column in comparison to the classic injector case. Two designs, the first using a three-step switching sequence and the second using a six-port injector are presented. In both cases, the injected band shape is greatly improved. The corresponding separation efficiency is also expected to improve and has been confirmed subsequently by experiment.

Design Analysis and 3D Measurement of Diffusive Broadening in a Y-Mixer, K. B. Greiner, M. Deshpande, J. R. Gilbert, R. F. Ismagilov*, A. D. Stroock* and G. M. Whitesides*. Coventor, Inc., Cambridge, MA; *Harvard University, Department of Chemistry and Chemical Biology, Cambridge, MA. Technical Proceedings of Micro Total Analysis Systems, Enschede, The Netherlands, MicroTAS 2000. 87-90.

ABSTRACT:
Diffusive broadening of a low molecular weight species in pressure driven flow is studied using both experiment and numerical analysis. Confocal microscopy allows experimental visualization of the three dimensional nature of the diffusion. Numerical results support the experimental results, and are used to provide insight into design questions about devices involving diffusive mixing.

Design Analyses of Capillary Burst Valves in Centrifugal Microfluidics, J. Zeng*, D. Banerjee*, M. Deshpande*, J. R. Gilbert*, D. C. Duffy** and G. J. Kellogg**. *Coventor, Inc, Cambridge, MA.; **Gamera Bioscience, Medford, CA. Technical Proceedings of Micro Total Analysis Systems, MicroTAS 2000, Enschede, The Netherlands, 493–496.

ABSTRACT:
This paper presents current research in analysis of passive microfluidic capillary burst valves. A capillary burst valve stops the liquid flow using a capillary pressure barrier that develops when the channel cross section expands abruptly. Valves of this type provide the capability of precise control on sample location in microfluidic device. Detailed numerical analyses of the valve behaviour is presented and compared with experimental measurements. A model for the valve is then extracted that characterizes the valve performance for various common cross sections.

A Hybrid Approach to Modeling Multi-Physics Systems Gunar Lorenz, Matt Kamon, Steve Breit 12th Annual International Mixed Signal- Testing Workshop in Edinburgh, 21/06/06

ABSTRACT:
In this paper, we present a novel approach to modeling multi-physics systems such as MEMS. The approach combines field solver analysis with system-level modeling in a circuit simulation environment and relies on a new class of parameterized behavioral models that can automatically access and use field solver solutions that are stored in relational database. This hybrid approach exploits the complementary strengths of each of these modeling methods, namely the ability of field solvers to analyze arbitrarily complex geometric shapes, and the optimized computational performance of behavioral models. Possible applications can be found in a variety of engineering domains, from designing an array of sensors attached to a complex mechanical structure such as an aircraft, to thermal design of IC packages. Two examples from the field of MEMS design are examined more closely to demonstrate the benefits of the hybrid approach. First we demonstrate a new methodology for designing PZR pressure sensors. Second, we demonstrate a new methodology for analyzing packaging effects on inertial sensors.

How to model and simulate microgyroscope systems
Published in IEEE Spectrum “Art & Technology” July 1998 Vol. 35 No. 7 (page 66 to 75)

Network-Type Modeling of Micromachined Sensor Systems. Lorenz, G.; Neul, R.:
Proc. Int. Conf. on Modeling and Simulation of Microsystems, Semiconductors, Sensors and Actuators, MSM98, Santa Clara, April 1998, pp. 233-238.

Modeling of Electrostatic MEMS Components. Lorenz, G.; Neul, R.; Dickmann, S.: Proc. 2. Int. Conf. on Modeling and Simulation of Microsystems, MSM99, San Juan, April 1999, pp. 128-131.

Principles of droplet electrohydrodynamics for lab-on-a-chip, Jun Zeng & Tom Korsmeyer
Lab Chip, 2004, 4, 265-277