Coventor Blog

Advanced Lithography and Process Variation Modeling Using SEMulator3D


Click on image to view animation of modeling

By:   Jimmy Gu, Coventor Technical Staff

One of the top and probably toughest challenges that process integrators are facing today in a silicon fab is process variability. As a former process integrator working hard to ramp up the yield of 22nm FinFET technology, I saw it first-hand. Looking back, I wish I was equipped with the SEMulator3D virtual fabrication platform, which is designed to address this type of process variability challenge. With the recent release of SEMulator3D 5.1, its process variability toolbox has just received a powerful new addition: the ability to model line edge roughness (LER) and line width roughness (LWR) in lithography. read more…

MEMS+ 6.0 takes on MEMS/IoT integration challenges

 Visualization of 3-axis MEMS gyro, courtesy of Murata Oy, simulated with MEMS+ model in MATLAB

Visualization of 3-axis MEMS gyro, courtesy of Murata Oy, simulated with MEMS+ model in MATLAB

We announced the release of the latest version of our MEMS+ design platform this week, MEMS+ 6.0. This release contains many new features and performance improvements that existing customers will appreciate as well as new capabilities that address key challenges of integrating MEMS with IoT devices. There’s far too much to talk about in one blog, so we will focus this one on why MEMS are critical to IoT and the key MEMS/IoT integration challenges MEMS+ 6.0 addresses. Subsequent blogs will expand on each of these challenges and our solutions. read more…

VP of Business Development Blog

By Dinesh Bettadapur
July 2015

I was recently promoted to the Coventor executive management team as VP of Business Development assuming primary responsibility for driving business strategy and growth across the global semiconductor equipment market while also continuing to focus on driving market share growth across the Western US for the memory & logic IDMs as well as validation of the business potential for the fabless IC market.
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SEMulator3D 5.0 – It’s ALMOST HERE!!!!

By David M. Fried

I said I’d follow up with another blog about new features and capabilities SEMulator3D 5.0… and I’m running out of time. The Gold release is less than a week away!!
In the last blog, I gave a general overview of the new release and I talked about the all new dopant-handling capabilities, so let’s just jump right into another topic…Visibility!
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Collaboration Brings Fast Analysis to Acoustic Resonator Design

By Mattan Kamon

After some lively conversations with the top researchers in MEMS acoustic resonators during the 2014 Sensors and Actuators Workshop (familiarly known to the MEMS community as “Hilton Head”) we were motivated to develop a simulation solution that would better serve these researchers as well as commercial designers. With the recent release of CoventorWare 10, we introduced a new fast analysis capability for acoustic resonators that is unique in the industry and I’m excited to blog about it here.
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Don’t miss new Cloud-Based 3D Design-Technology Checking (3D-DTC) demo at DAC!

DAC 2015 is in full swing in San Francisco this week, and Coventor is there again. But this year, we’re also doing a special joint demonstration with Silicon Cloud International. This demonstration combines the power of Coventor’s SEMulator3D Virtual Fabrication platform with broad parallel computing offered by Silicon Cloud to produce a whole new capability that we call “3D Design-Technology Checking” or 3D-DTC for short (not DRC!).
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SEMulator3D 5.0 – It’s COMING!!!

David M. Fried

This is my favorite part of the year at Coventor: We’re about to do another MAJOR release of SEMulator3D. Developers are sprinting to the finish line, customers are clamoring for the newest features. I’d like to start talking about the new features of SEMulator3D 5.0, but one blog certainly won’t cover it all. Let’s get started, and we’ll do this as many times as we need to get it all written down.
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MEMS System Co-Design at DTIP

By Gerold Schröpfer

The 17th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP 2015) took place this year in Montpellier, Southern France, on April 28-30. This conference brings together participants interested in MEMS fabrication with those interested in design tools and methods. While this annual event is always located in Southern Europe, it attracts attendees from both industry and academia from around the world. read more…