By Mark Lapedus

The leading edge of the chip market increasingly is divided over whether to move to finFETs or whether to stay at 28nm using different materials and potentially even advanced packaging.

Decisions about which approach to take frequently boil down to performance, power, form factor, cost, and the maturity of the individual technologies. All of those can vary by market, by vendor and by process node. But those decisions also can change quickly because all of these technologies and methodologies are subject to perpetual change and modification.

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