Latest release focuses on solving the bigger, more complex challenges of verifying the next-generation of integrated MEMS devices with more accuracy and greater efficiency.
EVENTS & CONFERENCES
- IEDM 2017 – December 4-6, 2017, San Francisco, CA
- SEMICON Japan 2017 – December 13 – 15, 2017, Tokyo, Japan
- IEEE International Conference on Micro Electro Mechanical Systems (MEMS 2018) – 21-25 January, 2018, Belfast, North Ireland
- SPIE Advanced Lithography Symposium 2018 – 25 February – 1 March, San Jose, CA
TAGS5NM 7 nm ASML BEOL Coventor Directed Self Assembly DSA ETCH EUV GLOBALFOUNDRIES imec INTEL LAM RESEARCH lithography MEMS MEMS+ mems accelerometer mems design MEMS Design Software mems microphone mems simulation MEMS technology Moore's Law multi-patterning Online Articles Press release Process Development Process Integration Process Modeling Process Simulation Process Variability Process variation SADP SAQP Self-Aligned Quadruple Patterning semiconductor process modeling semiconductor process variation SEMulator3D Silicon Designs silicon photonics ST Microelectronics TCAD TSMC virtual fabrication X-Fab