SISPAD – September 9 – 11, 2014 – Yokohama, Japan

SISPAD
2014 International Conference on Simulation of Semiconductor Processes and Devices
September 9 – 11, 2014

SISPAD
Co-sponsored by The Japan Society of Applied Physics
Technical co-sponsored by The IEEE Electron Devices Society

This conference provides an opportunity for the presentation and discussion of the latest advances in modeling and simulation of semiconductor devices, processes, and equipment for integrated circuits.

visit SISPAD for more info

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