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Multi-Beam Market Heats Up

se_logoBy Mark Lapedus

The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market.

In one surprising move, Intel is in the process of acquiring IMS Nanofabrication, a multi-beam e-beam equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer technology.

As a result of the moves, the Intel/IMS duo and NuFlare will now race each other to bring multi-beam mask writers into the market. Still in the R&D stage, these newfangled tools promise to speed up the write times for next-generation photomasks, although there are still challenges to bring this technology into production.

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7nm Lithography Choices

se_logoBy Mark Lapedus

Chipmakers are ramping up their 16nm/14nm logic processes, with 10nm expected to move into early production later this year. Barring a major breakthrough in lithography, chipmakers are using today’s 193nm immersion and multiple patterning for both 16/14nm and 10nm.

Now, chipmakers are focusing on the lithography options for 7nm. For this, they hope to use a combination of two technologies at 7nm—extreme ultraviolet (EUV) lithography, and 193nm immersion with multi-patterning.

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