SEMulator3D

The Value of Integrating Process Models with TCAD Simulation (and some tips on how to do it)

By: Shi Hao (Jacky) Huang, PhD, Semiconductor Process & Integration Engineer

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Nowadays, novel semiconductor technologies have brought complex process flows to the fab.   These process flows are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, and their effect on a novel device, prior to physical fabrication.

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Coventor in the News – Silicon Photonics

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Coventor in the News

Photonics in Silicon R&D Toward Tb/s

By Ed Korczynski, Sr. Technical Editor, Semiconductor Manufacturing & Design

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The client:server computing paradigm colloquially referred to as the “Cloud” results in a need for extremely efficient Cloud server hardware, and from first principles the world can save a lot of energy resources if servers run on photonics instead of electronics. Though the potential for cost-savings is well known, the challenge of developing cost-effective integrated photonics solutions remains. Today, discrete compound-semiconductor chips function as transmitters, multiplexers (MUX), and receivers of photons, while many global organizations pursue the vision of lower-cost integrated silicon (Si) photonics circuits. read more…

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Bringing Advanced Semiconductor Manufacturing Technologies to Higher Education

By: Jimmy Gu, Ph.D., Semiconductor Process & Integration Engineer, Coventor

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Universities and other institutions of higher learning play a key role in developing our next generation of semiconductor technologies. Along with the theory of semiconductor technology, our next generation of scientists and engineers must learn about the practical methods used to design and manufacture the latest generation of semiconductor products. read more…

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Design Process Technology Co-Optimization for Manufacturability

By:   Dalong Zhao – Semiconductor Process & Integration Engineering

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products.   Meeting yield and product cost targets is a continuous challenge, due to new device structures and increasingly complex process innovations introduced to achieve improved product performance at each new technology node.  Design for manufacturability (DFM) and design process technology co-optimization (DTCO) are widely used techniques that can ensure the successful delivery of both new processes and products in semiconductor manufacturing.   In this article, we will discuss how 3D (3 dimensional) DTCO can be used to improve product yield and accelerate product delivery dates in semiconductor manufacturing. read more…

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Coventor to Highlight 3D Virtual Fabrication Breakthroughs at 2016 SEMICON West Conference

BOW Finalist

CARY, NC – July 5, 2016 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced it will be exhibiting at the 46th annual SEMICON West conference in San Francisco, CA from July 12 – 14, 2016.   Coventor will showcase SEMulator3D® 6.0 – the latest version of its semiconductor virtual fabrication platform, which has also been named a finalist in the Best of the West awards.   Along with software demonstrations highlighting the newest features of SEMulator3D 6.0 in its booth # 2622, Coventor will showcase how its virtual fabrication environment has been used to help understand and resolve issues in adopting new lithography technologies. read more…

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Coventor Announces SEMulator3D 6.0 and New Electrical Analysis Capabilities

Coventor’s Virtual Fabrication Platform Addresses Increasingly Complex Semiconductor Process Design Challenges

CARY, NC– June 6, 2016 – Coventor®, Inc., the leading supplier of automated software solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced the availability of SEMulator3D® 6.0 – the latest version of its semiconductor virtual fabrication platform. This new version further increases the accuracy of the process simulation, geometry and modeling of advanced semiconductor processes with new features, usability enhancements and a new add-on capability for electrical analysis. Along with SEMulator3D 6.0, Coventor is releasing an all-new SEMulator3D Electrical Analysis add-on component that allows seamless resistance and capacitance extraction directly from SEMulator3D process-predictive 3D models. read more…

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Introducing SEMulator3D Version 5.2

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By: Daniel Sieger, Lead Engineer, SEMulator3D Geometry and Michael Hargrove, Semiconductor Process & Integration Engineer

The SEMulator3D software platform has once again been updated and improved with significantly more features, making it the industry leader in semiconductor virtual fabrication.  read more…

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Imec, Coventor expand collaboration to optimize 7 nm semiconductor manufacturing processes

• Joint development team leverages SEMulator3D to explore semiconductor process  variation issues at unprecedented levels
• Collaboration team has conducted a massive computer modeling simulation of a million
wafers to explore process variability in 7nm BEOL semiconductor fabrication
• The extending collaboration aims to further advance the availability, yield and cost of
manufacturing processes for the next generation of 7 nm semiconductor products

Leuven, Belgium & Cary, North Carolina, United States – December 7, 2015 – Imec, a
world-leading nanoelectronics research center and Coventor, a leading supplier of semiconductor process development tools, today announced the expansion of a joint development project to explore process variation issues in 7nm semiconductor technology. read more…

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