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Solving process modeling, design automation, and integration challenges for the semiconductor and MEMS industries.

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March 21st 2019

Improving SAQP Patterning Yield using Virtual Fabrication and Advanced Process Control

By:  Benjamin Vincent, Ph.D., Staff Engineer, Semiconductor Process & Integration Advanced logic scaling has created some difficult technical challenges,  including a requirement for highly dense patterning. Imec recently confronted this challenge, by working toward the use of Metal 2 (M2) line patterning with...

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