What Our Customers Say About Us
We have obtained critical, counter-intuitive insights that we wouldn’t have easily discovered if we were using experimental wafer-based testing...SEMulator3D allows us to understand critical flow marginalities and enables us to devise alternative solutions. SEMulator3D is the most “silicon-accurate” process modeling software for these complex process variation studies. It provides high value to imec and our partners, by accelerating and reducing development cycles and limiting the time and cost of wafer-based cycles of learning.
Virtual fabrication with SEMulator3D allows engineers to readily develop and test a large number of process step combinations and novel process flows using multiple physical design patterns, which wouldn’t be possible in a real manufacturing environment or would be costly to perform. The model for each process step can be calibrated through experimental measurements, resulting in very reliable result-models that can be reused in multiple combinations.
SEMulator3D is our tool of choice for experimenting with new technologies and ideas. We also use SEMulator3D to create 3D cross sections for documentation and training of new colleagues. The ability to generate 3D pictures and animations makes it much easier to explain a process.
3D Model in Action…
Using a semiconductor process simulation developed by Coventor, this 3D model illustrates a small section of a FinFET device at high resolution. The graphic displays a portion of the structure that is approximately 600 nm on each edge (roughly the wavelength of orange light). Each of the 17 colors represents a different material in the manufacturing process.
The model is fully integrated, highly predictive and extremely accurate, displaying all processes from starting wafer through FEOL to the back end metal layers. It highlights the advanced virtual wafer fabrication capabilities of SEMulator3D, including MultiEtch, Visibility-Limited Deposition, Selective Epitaxy and other semiconductor fabrication processes.
(Credit: Peter Fried, ARC-3D and the NYU Department of Applied Physics)
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