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Solving process modeling, design automation, and integration challenges for the semiconductor and MEMS industries.

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Develop and optimize manufacturing process flows, reducing time consuming and costly experimental learning cycles.

Design and integrate MEMS and IoT devices significantly faster, without developing and maintaining custom models.


August 1st 2019

Advanced Patterning Techniques for 3D NAND Devices

By: Yu De Chen, Jacky Huang Introduction Driven by Moore’s law, memory and logic semiconductor manufacturers pursue higher transistor density to improve product cost and performance [1]. In NAND Flash technologies, this has led to the market dominance of 3D...

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