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Solving process modeling, design automation, and integration challenges for the semiconductor and MEMS industries.

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Develop and optimize manufacturing process flows, reducing time consuming and costly experimental learning cycles.

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August 1st 2019

Advanced Patterning Techniques for 3D NAND Devices

By: Yu De Chen, Jacky Huang Introduction Driven by Moore’s law, memory and logic semiconductor manufacturers pursue higher transistor density to improve product cost and performance [1]. In NAND Flash technologies, this has led to the market dominance of 3D...

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