Develop and optimize manufacturing process flows, reducing time consuming and costly experimental learning cycles.
Design and integrate MEMS and IoT devices significantly faster, without developing and maintaining custom models.
By: Steve Shih-Wei Wang, PhD, SP&I Engineer Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the first V-NAND product using...