For Immediate Release: March 16, 2017
Laura Magee (ESD) | email@example.com | (716) 846-8239 | (800) 260-7313
ESD Press Office | PressOffice@esd.ny.gov | (800) 260-7313
Steve Ference (AIM) | firstname.lastname@example.org | 518-956-7319
CUS-Backed Initiative Taps Process Modeling Specialist to Enable Manufacturing of High-Yield, High-Performance Integrated Photonic Designs
Today’s Announcement Builds On Progress Of Finger Lakes Forward, The Region’s Award-Winning Strategic Plan To Generate Robust Economic Growth And Community Development
ROCHESTER, NY and CARY, NC — The American Institute for Manufacturing Integrated Photonics (AIM Photonics), a public-private partnership advancing the nation’s photonics manufacturing capabilities, and Coventor®, Inc., a semiconductor process modeling software company, today announced Coventor as the newest member of AIM Photonics. Coventor will provide access to its unique, physics-driven 3D modeling technology to improve the performance and manufacturability of complex, integrated photonic designs. read more…
Tagged AIM Photonics, Coventor, integrated photonics, photonic design, photonic designs, photonic integrated components, PHOTONICS, Process Development, Process Integration, Process Modeling, Process Simulation, semiconductor process modeling, semiconductor process variation, SEMulator3D, Si photonics, silicon photonics
By: Jun Yan, Ph.D., MEMS Technical Director
Source: InfineonTechnologies, AG, “The Infineon Silicon MEMS Microphone”, DOI:10.5162/sensor2013/A4.3
MEMS microphones have emerged as a bright spot among consumer sensors, which in general are going through a rapid commoditization and profit-squeezing trend.
Tagged Apple Computer, Coventor, CoventorWare, FEA, Finite Element Analysis, Goertek, Knowles, MEMS Design Software, mems microphone, MEMS Microphone design, MEMS Microphone Design Software, MEMS Multiphysics, MEMS+, Multiphysics design software, SNR prediction, ST Microelectronics, STMicroelectronics, TSMC
Cadence, X-FAB, Coventor and Reutlingen University Select 10 Design Teams as Semi-Finalists
Cary, NC, March 15, 2017 — Cadence Design Systems, Coventor, X-FAB and Reutlingen University – joint sponsors of the worldwide MEMS Design Contest – today announced the commencement of the design phase of the contest with the selection of ten semi-finalist teams who will compete for the top prize. The contest was created to highlight and encourage the development of innovative MEMS and mixed-signal designs projects. Contest organizers carefully evaluated submissions from all over the world and selected the ten most innovative ideas to be further explored and developed during the design stage of the contest. Submissions ranged from teams of two to nine, addressing areas such as surgical robots, energy harvesting and automotive Heads Up Display (HUD) applications. read more…
By: Katherine Gambino, Strategic Accounts Manager
Building a chip fabrication facility requires billions of dollars in investment for land, buildings, processing equipment, chemical and hazardous material safety, not to mention the deployment of hundreds of highly experienced process engineering and manufacturing personnel. Bringing up an advanced semiconductor process in any fab, new or established, is a several-hundred-million dollar effort, typically requiring two or more years of experimentation with process equipment and process recipes, led by engineers with years of process integration and chip manufacturing expertise.
At SPIE Advanced Lithography 2017, Coventor Will Present Results of Studies to Increase Density and Yield of Next-Generation Semiconductor Devices
CARY, NC– February 13, 2017 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), will present findings from its research on advanced semiconductor fabrication processes at SPIE Advanced Lithography 2017. The results of these studies provide insight into techniques for advancing the state-of-the-art in semiconductor technology through use of new and emerging photomask, lithography and process technologies. read more…
Tagged 7 nm, BEOL, Coventor, ETCH, EUV, imec, lithography, multi-patterning, Process Development, Process Modeling, Process Simulation, Process Variability, SAQP, Self-Aligned Quadruple Patterning, semiconductor process modeling, semiconductor process variation, SEMulator3D, virtual fabrication
By: Shi Hao (Jacky) Huang, PhD, Semiconductor Process & Integration Engineer
Nowadays, novel semiconductor technologies have brought complex process flows to the fab. These process flows are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, and their effect on a novel device, prior to physical fabrication.
Tagged Coventor, Finite Element Mesh, Finite Element Modeling, Process Development, Process Modeling, Process Simulation, Process Variability, semiconductor process modeling, semiconductor process variation, SEMulator3D, TCAD, TCAD Interface, TCAD Modeling, TCAD Simulation, Voxel mesh, Voxel-based mesh
MEMS & Sensors Executive Congress 2017