Author Archives: Karin Conti
ES Design West Opens July 9 with Exhibit Floor Showcasing Companies that Span Entire Electronic System Design Ecosystem
MILPITAS, CALIF. – July 1, 2019 – The exhibit floor at ES Design West will be a showplace of companies that span the entire electronic system design ecosystem including IP, EDA, embedded software, design services, design infrastructure and the cloud presenting system-centric commercial solutions for complex chip design.
Amid the ongoing memory downturn, 3D NAND suppliers continue to race each other to the next technology generations with several challenges and a possible shakeout ahead.
Equipment and tools vendors are starting to focus on data as a means of improving yield, adding more sensors and analysis capabilities into the manufacturing flow to circumvent problems in real time. How much this will impact the cost of developing complex chips at leading-edge nodes, and in 2.5D and 3D-IC packages, remains to be seen. But the race to both generate data during manufacturing and analyze it quickly enough to be able to impact yield and time to market has begun. That includes more customized sensors, machine learning and AI systems that can separate out critical data quickly enough to impact ongoing processes, as well as longer-term data collection to identify patterns. It also involves being able to quickly eliminate data that is unnecessary.
New MEMS-based products are constantly emerging, fueled by the Internet of Things (IoT), autonomous driving, smart manufacturing and healthcare applications. The MEMS pressure sensor market is no exception to this trend1. Its growth has been driven mainly by automotive applications such as tire pressure management system (TPMS) regulations in China, fuel and ignition systems, thermal systems, oil-pressure monitoring, and indoor and outdoor navigation systems. Easy to customize and integrate, miniature, sensitive, accurate and low-power MEMS devices are especially well-suited to the accuracy, power consumption, sensitivity and miniaturization that pressure sensors require.
By Ed Sperling and Mark LaPedus
Packaging is emerging as one of the most critical elements in semiconductor design, but it’s also proving difficult to master both technically and economically.
The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing processes, packaging is taking on a much broader and more strategic role. Many of the new packages are application-specific, and they are an integral part of the system architecture. They can help channel heat, improve performance, help to reduce power, and even safeguard signal integrity.
Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine learning to help solve the problem