By Steve Breit, V.P. Engineering
I’ve been doing a lot of interviewing as we grow our engineering team. I often say that hiring is the most important part of my job and also the hardest part. Like any sensible technology company, Coventor wants to hire the best engineers we can find. Good engineers love engineering. They love to build, to create, to innovate, to solve problems. Good engineers are methodical and persistent, but also bring engineering judgment and intuition that helps them arrive at solutions efficiently. Good engineers can’t help doing engineering – it’s who they are. Over the years, I’ve observed that good engineers are way more productive than mediocre engineers. The difference in productivity can be astounding, in excess of 2 or 3X for the best engineers. The trick, at least during the hiring process, is to discern which candidates are the good engineers. You can’t just look at academic degrees, skills claimed, or work experience to tell the difference. read more…
CARY, NC – July 5, 2016 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced it will be exhibiting at the 46th annual SEMICON West conference in San Francisco, CA from July 12 – 14, 2016. Coventor will showcase SEMulator3D® 6.0 – the latest version of its semiconductor virtual fabrication platform, which has also been named a finalist in the Best of the West awards. Along with software demonstrations highlighting the newest features of SEMulator3D 6.0 in its booth # 2622, Coventor will showcase how its virtual fabrication environment has been used to help understand and resolve issues in adopting new lithography technologies. read more…
By: Daniel Sieger, Lead Engineer, SEMulator3D Geometry and Michael Hargrove, Semiconductor Process & Integration Engineer
The SEMulator3D software platform has once again been updated and improved with significantly more features, making it the industry leader in semiconductor virtual fabrication. read more…
By Mark Lapedus
Semiconductor Engineering sat down to discuss the foundry business, memory, process technology, lithography and other topics with David Fried, chief technology officer at Coventor, a supplier of predictive modeling tools. What follows are excerpts of that conversation.
SE: Chipmakers are ramping up 16nm/14nm finFETs today, with 10nm and 7nm finFETs just around the corner. What do you see happening at these advanced nodes, particularly at 7nm?
Fried: Most people are predicting evolutionary scaling from 14nm to 10nm to 7nm. It’s doubtful that we will see anything really earth-shattering in these technologies. And so, a lot of the challenges come down to patterning. We are going to see multi-patterning schemes really take hold at more levels. For example, the fins are now based on self-aligned double patterning. People will move into self-aligned quad patterning. The gates are maybe self-aligned double. Now, they will move into self-aligned quad. So, that’s going to be a big expense, because each level is going to have multiple passes and multiple cuts.
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Tagged 10NM, 3D NAND, 5NM, ATOMIC-LEVEL VARIABILITY, BEOL, Coventor, DEPOSITION, Directed Self Assembly, DSA, ETCH, EUV, III-V MATERIALS, INTEL, lithography, LOW-K DIELECTRICS, MRAM, multi-patterning, NANOWIRE FETS, RC DELAY, RERAM, SADP, TSMC
By: Stephen Breit, VP of Engineering
I recently gave an invited talk at the IEEE Inertial Sensors symposium that discussed the future of commodity MEMS inertial sensor design and manufacturing. Inertial sensors comprise one of the fastest growing and most successful segments of the MEMS market. read more…
By Mark Lapedus
The multi-beam e-beam mask writer business is heating up, as Intel and NuFlare have separately entered the emerging market.
In one surprising move, Intel is in the process of acquiring IMS Nanofabrication, a multi-beam e-beam equipment vendor. And separately, e-beam giant NuFlare recently disclosed its new multi-beam mask writer technology.
As a result of the moves, the Intel/IMS duo and NuFlare will now race each other to bring multi-beam mask writers into the market. Still in the R&D stage, these newfangled tools promise to speed up the write times for next-generation photomasks, although there are still challenges to bring this technology into production.
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Tagged ASML, Coventor, D2S, DNP, EUV, EUV RESISTS, GLOBALFOUNDRIES, ILT, IMS, INPRIA, INTEL, INVERSE LITHOGRAPHY TECHNOLOGY, JEOL, KLA-TENCOR, LAM RESEARCH, MENTOR GRAPHICS, Moore's Law, MULTI-BEAM E-BEAM, MULTI-BEAM MASK WRITING, NANOFABRICATION, NUFLARE, OPC, OPTICAL PROXIMITY CORRECTION, PHOTOMASKS, PHOTONICS, RET, RETICLE ENHANCEMENT TECHNIQUES, SAMSUNG, SK HYNIX, SMIC, TOPPAN PHOTOMASKS, TOSHIBA, TSMC, VARIABLE-SHAPE BEAM, VSB