October 12, 2018
3D NAND Memory Array and Key Process Challenges (Source: Lam Research)
Published by Steve Shih-Wei Wang at October 12, 2018
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3D NAND: Challenges beyond 96-Layer Memory Arrays

Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the […]
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