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October 12, 2018
Published by
Steve Shih-Wei Wang
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October 12, 2018
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Coventor Blog
3D NAND: Challenges beyond 96-Layer Memory Arrays
Unlike scaling practices in 2D NAND technology, the direct way to reduce bit costs and increase chip density in 3D NAND is by adding layers. In 2013, Samsung shipped the
[…]
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