Author Archives: Sandra Liu

Future Directions in MEMS Technology: Results from the 2018 MEMS Design Contest

By:  Coventor Marketing

At CDNLive in 2015, we joined with representatives from Cadence and X-FAB to discuss the possibility of sponsoring a MEMS design contest. At the time, the sponsoring companies were developing an integrated MEMS & mixed signal design flow using MEMS PDKs.  PDKs (process design kits) are in common use in CMOS design, but not so much in MEMS design. The idea behind the contest was to motivate design teams to start developing chips with MEMS and mixed-signal blocks, using our newly-integrated design tools and PDKs. read more…

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

May 9, 2018 8:13am by Mathew Dirjish | Sensors Magazine Online

 

Global MEMS Design Contest winners announced

May 9, 2018 by Fabio Boiocchi | Elettronica News

 

MEMS bent on many design kits

May 9, 2018 by Veijo Ojanpera

 

New ideas for MEMS

May 9, 2018 by Irish Stroh  | Markt & Technik

 

Cadence: Winner of Global MEMS Design Contest

May 9, 2018 by Hartmut Rogge | Channel-e

 

Winner of the global MEMS design contest

May 9, 2018 | Electronic Specifier Germany

 

Motion harvester wins MEMS design contest

May 9, 2018 by Chris EdwardsTech Design Forum

 

Winner of MEMS competition

May 10, 2018 by Göte Fagerfjäll | Elektronik i Norden

 

Global MEMS design contest winners announced

May 11, 2018  | Engineer News Network

 

Global MEMS contest design winners announced

May 14, 2018 by Amy Wallington | Components in Electronics

 

Cadence Announces the Winner of the MEMS Circuits-Based Design Contest

May 16, 2018 | Electronique Composants & Instrumentation

 

 

 

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

Team from ESIEE Paris and Sorbonne University Awarded Grand Prize for Innovative use of MEMS and Mixed-Signal Design in 3D Vibration Energy Harvester Project

Munich, Germany, May 9, 2018— Cadence Design Systems, Coventor, X-FAB and Reutlingen University announced the grand prize winner of the Global MEMS Design Contest 2018 at CDNLive EMEA 2018, the Cadence® annual user conference. A team from ESIEE Paris and Sorbonne University received the grand prize award for designing an innovative MEMS-based energy harvesting product using electrostatic transduction. Energy harvesting products can be used in implantable medical devices and other portable electronics that need to operate without an external power source.

The winning team received a $5,000 cash prize along with a complimentary one-year license of CoventorMP™ MEMS design software. In addition, X-FAB will fabricate the team’s winning design using the X-FAB XMB10 MEMS manufacturing process.

The design contest was launched two years ago at the 2016 Design, Automation and Test in Europe (DATE) conference, with the goal of encouraging the development of imaginative concepts in MEMS and mixed-signal design. Contest submissions were received from around the world, and three semifinalist teams were selected in February 2018 to compete for the grand prize. A panel of industry professionals and respected academics selected the grand prize winner based upon the degree of innovation demonstrated in the hardware and methodology, the novelty of the application, adherence to the design flow and the educational value of the submission.

“We are extremely excited to be working with the team from ESIEE and Sorbonne to manufacture their energy harvesting product,” said Volker Herbig, vice president, BU MEMS at X-FAB. “The design rules and process specifications provided in X-FAB and Coventor’s MEMS PDK, along with Cadence technology, should help ensure “first-time-right” manufacturing of the winning team’s design.  We look forward to bringing the winning contestant’s innovative thinking to life, using our well-tested open-platform MEMS and CMOS manufacturing technologies.”

“We are very pleased that the contestants used the CoventorMP design environment and XMB10 MEMS PDK to create and model their designs,” said Dr. Stephen Breit, Vice President of Engineering at Coventor, a Lam Research Company. “We’re looking forward to X-FAB’s successful manufacturing of the winning team’s design, which will demonstrate how this new approach can reduce the cost and time of developing new MEMS products.

“We were impressed with the high-calibre and creativity of the designs submitted,” said Sanjay Lall, Regional Vice President EMEA of Cadence. “The contestants were able to successfully simulate their combined MEMS and mixed-signal designs in the Cadence Virtuoso® Analog Design environment and use the Cadence Spectre® Circuit Simulator for their transient simulations. Choosing one winner was very difficult, as all the finalists put forward excellent projects.”

A team from King Abdullah University of Science and Technology (KAUST) in Thuwal, Saudi Arabia, took home the second-place prize, which included a cash award of $2,000. The team from KAUST created a MEMS resonator for oscillator, tunable filter and re-programmable logic device applications.

Third place went to a team from the University of Liege, Microsys, KU Leuven and Zhejiang University. This team created a genetic algorithm for the design of non-linear MEMS sensors with compliant mechanisms and showcased it using a capacitive MEMS accelerometer. They received a cash prize of $1,000.

In addition to the cash prizes, all three semifinalists had the opportunity to present their winning entries to an audience of design professionals at the CDNLive EMEA 2018 conference.

For more details regarding the winning teams and their contest entries, please visit the MEMS Design Contest website.

About the Contest Organizers

Reutlingen University (www.reutlingen-university.de) is one of Germany’s leading universities, offering international academic programs with close ties to industry and commerce.  It helped formulate and organize the call for participation of the contest.

X-FAB (www.xfab.com) is the leading analog/mixed-signal and MEMS foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.13 µm, and its special BCD, SOI and MEMS long-lifetime processes. X-FAB’s analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at six production facilities in Germany, France, Malaysia and the U.S. X-FAB employs about 4,000 people worldwide.

Coventor, a Lam Research Company (www.coventor.com), is the market leader in automated solutions for developing semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Its SEMulator3D® modeling and analysis platform is used for fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Its CoventorMP MEMS design solution is used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. Our software and expertise help customers predict the structures and behavior of their designs before they commit to time-consuming and costly actual fabrication.

Cadence (www.cadence.com) enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For.

For more information, please contact:

Andrea Huse
Cadence Design Systems, GmbH
ahuse@cadence.com

Toni Sottak
Wired Island International
toni@wiredislandpr.com

Anja Noack
X-FAB Semiconductor Foundries AG
Anja.noack@xfab.com

Five Major Adds by Coventor

By Bryon Moyer

Coventor released its most recent version of their SEMulator3D tool not long ago. Just as a refresher, this is the tool that lets process engineers model, analyze, and visualize the impact of a semiconductor process. If you’ve seen nothing else about them, you might have seen animated movies of a process building itself up layer by layer in a conference presentation here or there.

They’ve enumerated five big changes in this last release, along with lots of little fixes or adds. I learned about them in conversation with Coventor CTO Dr. David Fried at the SPIE Advanced Litho conference. We’re going to focus on the big deals and let you discover the little ones as fits your needs.

read the full article here.

When Will Self-Driving Cars Become a Reality?

By Stephen Breit, Sr. Director MEMS Business

Self-driving cars have been all the rage in both the trade press and popular press in recent years. I prefer the term “autonomous vehicles” which more broadly captures the possibilities, encompassing not only small passenger vehicles, but mass transit and industrial vehicles as well. Depending on who’s talking, we’ll all be riding in fully autonomous vehicles in 5 to 25 years. The 5-year estimates come from startups eager to raise venture capital while the 25-year estimates come from Tier 1 automotive suppliers who tend to be more cautious for various reasons. Regardless of the time frame, much capital and effort is being invested toward making autonomous vehicles a reality. read more…

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Transistor-Level Performance Evaluation Based on Wafer-Level Process Modeling

By: Michael Hargrove, SP&I Engineer

Three years ago, I wrote a blog entitled “Linking Virtual Wafer Fabrication Modeling with Device-level TCAD Simulation” in which I described the seamless connection between the SEMulator3D® virtual wafer fabrication software platform and external 3rd party TCAD software. I’m now happy to report that device-level I-V performance analysis is now a built-in module within the SEMulator3D software platform.  Users are no longer required to export a mesh and import it into a TCAD platform, when performing transistor I-V simulation.  Now, once the 3D device structure is built in SEMulator3D, transistor I-V simulation can be performed directly within SEMulator3D without need for 3rd party solvers.  Contacts and bias can be applied using the SEMulator3D device design, and I-V transistor characteristics can be determined for specific steps in the process flow.  You can perform direct transistor-level performance evaluation inside the SEMulator3D software platform, without needing to export or import meshes. read more…

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Advanced 3D Design Technology Co-Optimization for Manufacturability

By: Yu De Chen, Jacky Huang, Dalong Zhao, Jiangjiang (Jimmy) Gu, Joseph Ervin

Yield and cost have always been critical factors for both manufacturers and designers of semiconductor products. It is a continuous challenge to meet targets of both yield and cost, due to new device structures and the increasing complexity of process innovations introduced to achieve improved product performance at each technology node. Design for manufacturability (DFM) and design technology co-optimization (DTCO) are widely used to ensure successful delivery of both new processes and products in semiconductor manufacturing. In this paper, we develop a new 3D DTCO model which combines 3D structure optimization and electrical analysis. We discuss how this 3D DTCO model can be used to improve product yield and accelerate product delivery timelines in semiconductor manufacturing. read more…

The Challenge of Modeling the Interaction between MEMS Inertial Sensors and their Packaging

By: Arnaud Parent

Simulation of Thermal Effects on MEMS Performances

MEMS inertial sensors, such as Accelerometers and Gyroscopes, have been commercially successful in the consumer marketplace, where reduced size and cost are more important than accuracy. These sensors are classified as commercial grade products, even though they are typically used in consumer applications. Today, MEMS inertial sensors are knocking on the door of tactical grade applications, where the requirements for accuracy are much more demanding. MEMS products may one day enter the navigation grade application space, where accuracy demands are even more stringent. To meet the enhanced accuracy and performance requirements of tactical and navigation grade inertial sensors, MEMS designers must not only consider the transducer itself but the interaction of the product with its surrounding environment (starting with the packaging). At Coventor, we have a new simulation platform that can be used to create a compact model of MEMS transducers along with their packaging, providing a method to efficiently study the overall behavior of MEMS inertial sensors. read more…