IBM, Coventor present 22nm virtual fabrication success at SISPAD

GLASGOW, Scotland – September 4, 2013 – IBM and Coventor jointly presented a paper at the 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). The paper presents a technology development methodology that relies on 3D virtual fabrication using Coventor’s SEMulator 3D platform to rapidly improve yield by increasing tolerance to multilevel process variation. This methodology has been successfully implemented in the development and yield ramp of high–performance 22nm SOI CMOS technology. Based on virtual metrology, dedicated test site structures were designed and implemented, with electrical results corroborating virtual findings, validating the methodology. This 3D virtual fabrication technique was used to implement a delicate process change, and the same test site structures validated the improved process window yield.

DOWNLOAD the white paper: IBM, Coventor use virtual fabrication at 22nm

This entry was posted in Coventor Blog. Bookmark the permalink.

Comments are closed.