Figure 2 displays an image that describes the fin height, sputter angle and sputter ratio of a Saddle Fin.   There is also a table displayed in this image that describe the fin height and fin curvature ranges for the process parameters used in our experiment.   The Silicon/Oxide etch ratio ranges for our study are shown, with values between 0.8 to 1.5.    The Silicon Fin Sputter Etch Ratio is also displayed, with values between 0.5 and 3.   Finally, the Silicon Etch Sputter Angle is displayed, with values between 40 – 60 degrees.