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We are very pleased to announce the release of our latest MEMS design software, CoventorMP 1.2. This release has been enriched to improve the accuracy of device models and extend the types of devices that can be modeled. It contains enhanced model construction capabilities, a number of great new analysis functions, some significant performance improvements, advances in 3rd-party support and other exciting new features.
Enhanced Model Construction and Materials Capabilities
The new version of CoventorMP has been enhanced to better support perforations, such as those used in MEMS microphones. The Construct 3D Model function now recognizes perforations and perforation patterns and automatically incorporates them into the correct model component. Very high-density perforation spacing is supported for staggered circular and polygonal perforations. In addition, the Construct 3D Model function provides new support for arc and pie shapes, as well as beams. Hexahedral meshing is also now available for all beam types and profiles.
Relative Permittivity (at constant stress) can now be added, assisting in the design of capacitive sensors and other devices dependent on permittivity measures.
New Analysis Functions
We’ve also added some great new analysis functions to CoventorMP. A new Periodic AC analysis can simulate the contribution of a small sinusoidal excitation signal on the behavior of an oscillatory system that vibrates with steady state amplitude. This new feature can be used, for example, to analyze the sensitivity of a gyroscope as a function of rotation rate frequency.
Nonlinear AC and Frequency Hysteresis analyses have also been enhanced to accept multi-harmonic inputs. In addition to sinusoidal input, users can now input pulse, sawtooth, or periodic function curves on any exposed connector, to simulate the non-linear harmonic response. For example, a user can model the non-linear frequency response of a MEMS micromirror or accelerometer when actuated with a harmonic representation of a pulse source.
Gap component contact models and electrostatic models can now be selected independently, providing more flexibility when the user defines their contact model. In addition, the contact model has a “bumper height” parameter that can be used to model large arrays of contact bumpers by reducing the contact gap.
Improved Speed and Performance
For both current and future users, this release includes substantial improvements in simulation performance. Improvements in performance of DC sweep, nonlinear AC sweep, pull-in and frequency hysteresis analyses have been incorporated in the latest release. For models that include hexahedral meshing, simulation speed has also been improved. The Simulator Reduced Order Model (ROM) export function has been improved in the release, so that simulations in MATLAB® system modeling and Cadence® circuit simulation are even faster. Stack models are also simpler, faster and more accurate than in previous versions.
Advances in 3rd Party Support
We’ve also improved 3rd party support in this release, to make it easier than ever to include your MEMS model in your favorite system and circuit simulators. MATLAB Simulink can now create an encrypted MEX model from the CoventorMP Simulator ROM model. A user can create a MEX model, in Simulink, that includes a MEMS+ ROM and other Simulink components for convenient use in a larger circuit design. In addition, the built-in MEMS+ for Cadence archive export capability now includes model files for cells from other libraries referenced in the master schematic. Finally, Red Hat Enterprise Linux Version 7 is now fully supported.
Other New Features
HTML context-sensitive help has been added to CoventorMP, including new help on MEMS+ components and analyses. Help can be accessed directly from the software menu, or via context sensitive help for a specific CoventorMP feature. The CoventorWare Scripting Interface now has enhanced analysis capabilities, including expanded query options from the CoventorWare results query menu.
![Fig. 2. Silicon spin qubit centered in the dotted circle, control and readout signals (M, P, R, T, and Q) are shown in the inset. Simplified schematics of the quantum point contact and corollary circuits are shown. The voltage source is implemented as a digital-to-analog converter at room temperature. (Taken from [6])](https://www.coventor.com/wp-content/uploads/2022/05/Fig.-2.-Silicon-spin-qubit-centered-in-the-dotted-circle-control-and-readout.png)
![Figure 2: Schematic view of standard CMOS including an electro-mechanical switch monolithically integrated into BEOL [2]. Courtesy: University of California, Berkeley](https://www.coventor.com/wp-content/uploads/2022/04/Figure-2-April-2022-MEMS-Blog-for-Coventor-website.png)
