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Big Trouble At 3nm

By MARK LAPEDUS

As chipmakers begin to ramp up 10nm/7nm technologies in the market, vendors are also gearing up for the development of a next-generation transistor type at 3nm.

Some have announced specific plans at 3nm, but the transition to this node is expected to be a long and bumpy one, filled with a slew of technical and cost challenges. For example, the design cost for a 3nm chip could exceed an eye-popping $1 billion. In addition, there are also several uncertainties at 3nm that could change everything overnight.

That hasn’t sidelined anyone yet, however. Samsung and GlobalFoundries separately announced plans to develop a new transistor technology called a nanosheet FET, with so-called variable widths at 3nm. Samsung, for one, hopes to deliver a PDK (version .01) by 2019, with plans to move into production by 2021. Meanwhile, TSMC is exploring nanosheet FETs and a related technology, nanowire FETs, at 3nm, but it has not announced its final plans. Intel, meanwhile, isn’t talking about its plans.

read the full article here

LiDAR: How MEMS is enabling the new trend in spatial sensing

By: Coventor Marketing

You’ve probably heard a lot about LiDAR. It stands for Light Detection and Ranging, and it’s playing a central role in many emerging technologies like autonomous vehicles, robotics and home automation. What sets LiDAR apart from other spatial sensing technologies is the precision and density of the distance data than can be attained from such sensors. read more…

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SEMICON West Preview: Smart Microelectronics Manufacturing Builds the Infrastructure to Enable AI Applications

By Paula Doe

The fast-maturing hardware and software that are enabling practical applications of equipment intelligence and machine learning mean disruptive change for microelectronics manufacturing. But first comes the basic work of building the basic infrastructure, figuring out IP separation, and learning to solve physical problems in the digital world.

Just how much can the semiconductor industry leverage industrial IoT practices from other industries? Common wisdom may be that industrial software solutions aren’t well suited to the IC sector’s complex needs. But GE Digital enterprise account executive Luke Smaul, currently working with Intel, argues that semiconductor fabs and toolmakers are dealing with similar issues as GE did when it first started working with Delta Airlines to monitor the GE engines on Delta planes. Smaul will speak at SEMICON West about GE’s work with Intel over the past few years and, in particular, how its solution for cloud security and IP separation can work for ICs.

read the full article here

MEMS Spring Eternal – MEMS Innovation and the Global MEMS Design Contest

By Amelia Dalton

What do electrostatic transduction, non-linear MEMS sensors, caffeine dosing strategies, and a glowing Death Star have in common? This here podcast! First up, we explore the Global MEMS Design Contest with Christine Dufour (Coventor – A LAM Research Company). Christine and I discuss the details of the winning designs and how design contests foster innovation in the electronic engineering ecosystem. Also this week, we check out an algorithm developed by the United States Army that aims to “optimize an ideal caffeine dosage strategy” and take a closer look at the “The World’s Most Accurate Death Star Replica Firepit”.

Listen to this episode of fish fry here

Future Directions in MEMS Technology: Results from the 2018 MEMS Design Contest

By:  Coventor Marketing

At CDNLive in 2015, we joined with representatives from Cadence and X-FAB to discuss the possibility of sponsoring a MEMS design contest. At the time, the sponsoring companies were developing an integrated MEMS & mixed signal design flow using MEMS PDKs.  PDKs (process design kits) are in common use in CMOS design, but not so much in MEMS design. The idea behind the contest was to motivate design teams to start developing chips with MEMS and mixed-signal blocks, using our newly-integrated design tools and PDKs. read more…

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

May 9, 2018 8:13am by Mathew Dirjish | Sensors Magazine Online

 

Global MEMS Design Contest winners announced

May 9, 2018 by Fabio Boiocchi | Elettronica News

 

MEMS bent on many design kits

May 9, 2018 by Veijo Ojanpera

 

New ideas for MEMS

May 9, 2018 by Irish Stroh  | Markt & Technik

 

Cadence: Winner of Global MEMS Design Contest

May 9, 2018 by Hartmut Rogge | Channel-e

 

Winner of the global MEMS design contest

May 9, 2018 | Electronic Specifier Germany

 

Motion harvester wins MEMS design contest

May 9, 2018 by Chris EdwardsTech Design Forum

 

Winner of MEMS competition

May 10, 2018 by Göte Fagerfjäll | Elektronik i Norden

 

Global MEMS design contest winners announced

May 11, 2018  | Engineer News Network

 

Global MEMS contest design winners announced

May 14, 2018 by Amy Wallington | Components in Electronics

 

Cadence Announces the Winner of the MEMS Circuits-Based Design Contest

May 16, 2018 | Electronique Composants & Instrumentation

 

 

 

Global MEMS design contest winners announced

Cadence Design SystemsCoventorX-FAB and Reutlingen University have announced the grand prize winner of the Global MEMS Design Contest 2018 at CDNLive EMEA 2018, the Cadence annual user conference.

A team from ESIEE Paris and Sorbonne University received the grand prize award for designing a MEMS-based energy harvesting product using electrostatic transduction.

read the full article here.

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

Team from ESIEE Paris and Sorbonne University Awarded Grand Prize for Innovative use of MEMS and Mixed-Signal Design in 3D Vibration Energy Harvester Project

Munich, Germany, May 9, 2018— Cadence Design Systems, Coventor, X-FAB and Reutlingen University announced the grand prize winner of the Global MEMS Design Contest 2018 at CDNLive EMEA 2018, the Cadence® annual user conference. A team from ESIEE Paris and Sorbonne University received the grand prize award for designing an innovative MEMS-based energy harvesting product using electrostatic transduction. Energy harvesting products can be used in implantable medical devices and other portable electronics that need to operate without an external power source.

The winning team received a $5,000 cash prize along with a complimentary one-year license of CoventorMP™ MEMS design software. In addition, X-FAB will fabricate the team’s winning design using the X-FAB XMB10 MEMS manufacturing process.

read more…