Unlikely Pairings – Recent Atypical Mergers

By Bryon Moyer

Companies come; companies go. I don’t focus a lot on who buys whom – there are plenty of folks breathlessly watching that stuff, so I mostly leave the drama to them. After all, it’s an age of consolidation and accumulation of immense corporate power. So your typical low- to mid-level merger may not be particularly noteworthy.

But lately, there have been a couple of mergers/acquisitions that have had some unusual features to them. Add to that the fact that they’re companies we’ve looked at before, and it seems worth spending some time on them.

read the full article here.

Delivering the Next 5 Years of Semiconductor Technology

New, advanced semiconductor processing and architectural technologies take years to perfect and put into production. In the meantime, semiconductor customers continue to demand faster, smaller and higher functioning devices. Semiconductor manufacturers need to decide whether (and when) to jump to the next generation of devices and production technologies, weighing the risk and benefit of bringing the next processing and architecture technologies to market. read more…

SEMulator3D Honored as UBM ACE Award Finalist

For Immediate Release
For more information, contact:
Toni Sottak
(408) 876-4418

SEMulator3D Honored as UBM ACE Award Finalist

Coventor’s Virtual Fabrication Platform Recognized for Significantly Improving Electronics Manufacturing

CARY, NC– November 17, 2017 – Coventor®, Inc. a Lam Research Company and leading supplier of virtual fabrication solutions for semiconductor and micro-electromechanical systems (MEMS) devices, today announced its 3D virtual fabrication platform, SEMulator3D®, has been named a finalist in UBM’s annual ACE Awards competition.

The ACE (Annual Creativity in Electronics) Awards, in partnership with EE Times and EDN, showcase the best of the best in today’s electronics industry, including the hottest new products, start-up companies, design teams, executives, and more. ACE finalists and winners are hand selected by a panel of EE Times and EDN editors as well as independent judges from the across the industry. read more…

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Overlay Challenges On The Rise


The overlay metrology equipment market is heating up at advanced nodes as the number of masking layers grows and the size of the features that need to be aligned continue to shrink.

Both ASML and KLA-Tencor recently introduced new overlay metrology systems, seeking to address the increasing precision required for lines, cuts and other features on each layer. At 10/7nm, there may be 80 or more masking layers, versus 40 at 28nm. And if those layers are not precisely measured, the features being patterned, deposited and etched may not line up from one layer to the next.

read the full article here.

Technical Tidbits from IWLPC and MSEC 2017

By Francoise von Trapp

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to find out what’s new.

read the full article here.

Lam’s Coventor Buy Boosts MEMS Manufacturing

By R. Colin Johnson

SAN JOSE, Calif.—Why did Lam Research, a semiconductor fab equipment supplier, acquire Coventor, a software house hawking software to design microelectromechanical system (MEMS) chips and sub-10 nanometer semiconductors such as 3D finFETs?

Analysts fully expected for Coventor to be absorbed by Lam Research, only to surface as a Lam software offering. But at SEMI’s MEMS & Sensor Executive Congress 2017 (MSEC) here the companies reported that they are staying in separate headquarters, depending more the synergy of co-designing hardware for software and visa versa to give them a competitive edge over the competition.

read the full article here.

半導体プロセス・インテグレーションエンジニア – 日本

半導体プロセス・インテグレーションエンジニア – 日本

半導体プロセスインテグレーションと製造に経験と専門知識を持つBS / MS / PhDレベルのエンジニアを探しています。 大手の半導体企業と協力し、ロジック、DRAM、そして、NANDフラッシュ技術を含む開発プログラムのバーチャル製造ソリューションを実現、提供します。 高度に熟練したソフトウェア研究開発チームと共に、セミコンダクタープロセス・インテグレーションチームと協力して、工程及び製造上の重要な課題を解決するインテグレーションモデリングソリューションを顧客に提供します。


勤務地:日本(神奈川県新横浜、又は、三重県四日市)。 日本の顧客拠点に一定期間の滞在が必要な場合もあります。




スキル:半導体プロセスインテグレーション、半導体デバイスとプロセスのモデリングやシミュレーション(TCAD)、TCLやPython等スクリプト言語、Linux OS環境、テクニカルライティング、実用レベルの英語、コミュニケーションとプレゼンテーション。



Semiconductor Process and Integration Engineer – Japan

Semiconductor Process and Integration Engineer – Japan

We are seeking a BS/MS/PhD-level engineer who has experience and expertise in semiconductor process integration and fabrication. You will work with leading semiconductor companies to implement our virtual fabrication solution for their most advanced development programs, including advanced CMOS, DRAM and 3D NAND Flash technologies. You will collaborate with the Semiconductor Process & Integration team along with our highly skilled software development team, to create integration and modeling solutions for industry-critical manufacturing challenges.

This is a hands-on engineering position, requiring proficiency in full flow semiconductor process integration and script programming (python) as well as strong communication and presentation skills. Your title, level of responsibility, creative freedom and salary will be commensurate with your education and experience.

Location: Japan(Shin-Yokohama or Yokkaichi city). This position requires residency in Japan with a substantial amount of time at customer sites in Japan. Work is expected to be partly based at customer/partner sites. Travel is expected.

Required Qualifications:

Education: Bachelor’s degree required, Master’s degree or Ph-D preferred, in related fields of Electrical Engineering, Chemical Engineering, Materials Science or Applied Physics.

Experience: Semiconductor Technology and Processing education and experience is required. Relevant employment experience in the semiconductor industry is required.

Skills: Semiconductor Processing and Integration, Semiconductor Device Physics (preferred), Computer-Aided Design (CAD) and Modeling, Python scripting language, Technical Writing , Fluency in English and Japanese, Communication and Presentation (spoken and written).

If you are interested in this opportunity and you are authorized to work in Japan, e-mail your cover letter and CV in English to .