Press Coverage

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

GLOBAL MEMS DESIGN CONTEST WINNERS ANNOUNCED

May 9, 2018 8:13am by Mathew Dirjish | Sensors Magazine Online

 

Global MEMS Design Contest winners announced

May 9, 2018 by Fabio Boiocchi | Elettronica News

 

MEMS bent on many design kits

May 9, 2018 by Veijo Ojanpera

 

New ideas for MEMS

May 9, 2018 by Irish Stroh  | Markt & Technik

 

Cadence: Winner of Global MEMS Design Contest

May 9, 2018 by Hartmut Rogge | Channel-e

 

Winner of the global MEMS design contest

May 9, 2018 | Electronic Specifier Germany

 

Motion harvester wins MEMS design contest

May 9, 2018 by Chris EdwardsTech Design Forum

 

Winner of MEMS competition

May 10, 2018 by Göte Fagerfjäll | Elektronik i Norden

 

Global MEMS design contest winners announced

May 11, 2018  | Engineer News Network

 

Global MEMS contest design winners announced

May 14, 2018 by Amy Wallington | Components in Electronics

 

Cadence Announces the Winner of the MEMS Circuits-Based Design Contest

May 16, 2018 | Electronique Composants & Instrumentation

 

 

 

Global MEMS design contest winners announced

Cadence Design SystemsCoventorX-FAB and Reutlingen University have announced the grand prize winner of the Global MEMS Design Contest 2018 at CDNLive EMEA 2018, the Cadence annual user conference.

A team from ESIEE Paris and Sorbonne University received the grand prize award for designing a MEMS-based energy harvesting product using electrostatic transduction.

read the full article here.

Five Major Adds by Coventor

By Bryon Moyer

Coventor released its most recent version of their SEMulator3D tool not long ago. Just as a refresher, this is the tool that lets process engineers model, analyze, and visualize the impact of a semiconductor process. If you’ve seen nothing else about them, you might have seen animated movies of a process building itself up layer by layer in a conference presentation here or there.

They’ve enumerated five big changes in this last release, along with lots of little fixes or adds. I learned about them in conversation with Coventor CTO Dr. David Fried at the SPIE Advanced Litho conference. We’re going to focus on the big deals and let you discover the little ones as fits your needs.

read the full article here.

FD-SOI Adoption Expands

By Ed Sperling

Fully depleted silicon-on-insulator (FD-SOI) is gaining ground across a number of new markets, ranging from IoT to automotive to machine learning, and diverging sharply from its original position as a less costly alternative to finFET-based designs.

For years, FD-SOI has been viewed as an either/or solution targeted at the same markets as bulk CMOS.

read the full article here.

LAM RESEARCH ACQUIRES MEMS SOFTWARE COMPANY COVENTOR

By Mike Pinelis

In August of 2017, Lam Research completed the acquisition of Coventor, a MEMS modeling and simulation software company, for a total purchase consideration of $137.6 million. When asked about how Coventor fits into Lam’s portfolio, the company’s Executive VP and CFO Douglas Bettinger said that, potentially, there are benefits and synergies with Coventor’s software capability to model and simulate the actual output of Lam’s equipment. We recently spoke with Stephen Breit, Coventor’s Sr. Director of MEMS, and discussed the trends that he is seeing in the MEMS marketplace. Since Coventor works with many MEMS companies, we also asked Stephen about the notable startups and technologies.

read the full article here.

Unlikely Pairings – Recent Atypical Mergers

By Bryon Moyer

Companies come; companies go. I don’t focus a lot on who buys whom – there are plenty of folks breathlessly watching that stuff, so I mostly leave the drama to them. After all, it’s an age of consolidation and accumulation of immense corporate power. So your typical low- to mid-level merger may not be particularly noteworthy.

But lately, there have been a couple of mergers/acquisitions that have had some unusual features to them. Add to that the fact that they’re companies we’ve looked at before, and it seems worth spending some time on them.

read the full article here.

Overlay Challenges On The Rise

By MARK LAPEDUS

The overlay metrology equipment market is heating up at advanced nodes as the number of masking layers grows and the size of the features that need to be aligned continue to shrink.

Both ASML and KLA-Tencor recently introduced new overlay metrology systems, seeking to address the increasing precision required for lines, cuts and other features on each layer. At 10/7nm, there may be 80 or more masking layers, versus 40 at 28nm. And if those layers are not precisely measured, the features being patterned, deposited and etched may not line up from one layer to the next.

read the full article here.

Technical Tidbits from IWLPC and MSEC 2017

By Francoise von Trapp

It’s been a busy few weeks for me as I attended both the International Wafer Level Packaging Conference (IWLPC), October 24-26, 2017 at the DoubleTree in San Jose and SEMI-MSIG’s MEMS and Sensors Executive Congress, October 31-Nov. 2, at the Hayes Mansion in San Jose. In addition to taking in some great keynotes and technical sessions, I had the opportunity to meet with several companies to find out what’s new.

read the full article here.