MEMS Resonator

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Application example demonstrating construction of an integrated MEMS resonator based on U.S. patent 20070072327A1, inventor Jason W. Weigold, Analog Devices, Inc

Figure 1: SEM image of MEMS resonator from patent US20070072327A1

Typically, MEMS devices today are wire-bonded to the control circuits. This approach is appropriate for a large number of MEMS applications such as automotive. For some applications, however, factors such as chip real estate, packaging cost or device sensitivity may drive the design toward an integrated MEMS approach. Because SEMulator3D does not distinguish between a two-die or integrated MEMS device, 3D models for either device are easily constructed.

As stated in the patent, the integrated MEMS resonator is created first by partially forming the resonator at high temperature and then by forming the circuitry on wafer or die. The remaining steps for forming the MEMS resonator are then performed at lower temperature.

Figure 2: SEMulator3D model of a similar resonator showing the structure and nearby metal layers on the die. This view shows each electrical net highlighted in a different color.

The SEMulator3D model of the device was created based on the interpretation of the processing steps described on pages 4-7 of the patent document. Calibration using the standard process steps and specific equipment settings provides an in-depth understanding of the device at every step of the process. The compression mechanism in the SEMulator3D model can be used to create large cross sections and device layers. The resulting model can be probed for metrology data such as net connectivity and topography. Also, the layer geometry can be meshed and exported in a variety of standard formats to simulation tools and field solvers.

Figure 3: View of meshed resonator in SEMulator3D

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