By Ed Sperling and Mark LaPedus
Packaging is emerging as one of the most critical elements in semiconductor design, but it’s also proving difficult to master both technically and economically.
The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing processes, packaging is taking on a much broader and more strategic role. Many of the new packages are application-specific, and they are an integral part of the system architecture. They can help channel heat, improve performance, help to reduce power, and even safeguard signal integrity.