By Francoise von Trapp
3D In-Depth, EDA Tools
I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s a good way to learn about the synergies and to cross-pollinate information. Today was one of those days. I interviewed Steve Breit, PhD, VP of Engineering, Coventor, supplier of design automation software for MEMS and semiconductor applications. Breit reminded me that through silicon via technology (TSV), which is critical for 3D IC, owes a debt to MEMS. He’s right about that. So I figure a nod to MEMS now and again on 3D InCites isn’t out of place.
Breit briefed me on the company’s latest version of its MEMS+ modeling environment for accelerated development of advanced MEMS devices and systems, and what the improvements mean for ASIC designers who need to integrate MEMS devices into their system design.