By Dr. Stephen Breit | Vice President of Engineering, Coventor
ChipScale Review September – October 2015
The trend of integrating heterogeneous technologies at the package level is now well underway, and includes MEMS sensors. Heterogeneous package-level integration arguably reached a new level with the release of the Apple Watch. A Chipworks teardown shows more than 30 die in Apple’s S1 package. Curiously, among the few components that are not included in the S1 package are a MEMS inertial measurement unit (IMU) by ST Microelectronics and MEMS microphones by Knowles. Surely Apple and other IoT device makers will strive to achieve higher-density, package-level integration of MEMS sensors in the future, but will need to overcome specific packaging challenges associated with MEMS.