By Mark Lapedus
For years, extreme ultraviolet (EUV) lithography has been a promising technology that was supposed to help enable advanced chip scaling. But after years of R&D, EUV is still not in production despite major backing from the industry, vast resources and billions of dollars in funding.
More recently, though, EUV lithography appears to be inching closer to possible insertion for high-volume manufacturing, at least for one or a few critical layers. Two chipmakers, Intel and Samsung, have put EUV on their roadmaps at 7nm in the 2018 or 2019 timeframe. In addition, Samsung hopes to use EUV for 1xnm DRAMs.