CARY, NC– February 8, 2016 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced it will be exhibiting at the SPIE Advanced Lithography Conference in San Jose, CA from February 21 – 25, 2016. Coventor will highlight how its SEMulator3D virtual fabrication environment has been used to help understand and resolve issues in adopting new lithography technologies in its booth (#227) and in a series of technical papers.
Moving to EUV or alternate lithography technology is important for the industry, because it will enable chips to become smaller, faster and more functional. Coventor’s contribution to this effort is in simulating new lithography processes to predict problems and provide insight into the potential implementation of these lithography technologies in high volume semiconductor manufacturing, without the time and expense of actual wafer fabrication. As it continues to get more difficult and more costly to move to smaller nodes, virtual fabrication is becoming a more critical tool for chipmakers.
Coventor and its customers have been using virtual fabrication to deepen the understanding of what’s required to incorporate new lithography technologies. Coventor will present two papers related to this topic at SPIE 2016:
Predicting LER and LWR in SAQP with 3D virtual fabrication (Interactive Poster Session)
- Tuesday, 23 February 2016, 6:00 PM – 8:00 PM
- Author(s): Jiangjiang Gu, Dalong Zhao, Vasanth Allampalli, Daniel Faken, Ken Greiner, David M. Fried, Coventor, Inc. (United States)
- This paper demonstrates how to improve fabrication yield by reducing LER and LWR using process flows and integration techniques discovered via virtual fabrication.
Virtual fabrication using directed self-assembly for process optimization in a 14nm DRAM node (Session 8: DSA Modeling and Design)
- Wednesday, 24 February 2016, 1:40 PM – 3:30 PM
- Author(s): Mattan Kamon, Mustafa Akbulut, Yiguang Yan, Daniel Faken, Andras Pap, Vasanth Allampalli, Ken Greiner, David M. Fried, Coventor, Inc. (United States)
- This paper describes using virtual fabrication to analyze the incorporation of advanced DSA (directed self-assembly) lithography processes in DRAM development. This may be the first paper using virtual fabrication to look at the benefits of DSA processes vs. SAQP (self-aligned quadruple patterning).
The latest version of Coventor’s SEMulator3D Virtual Fabrication Platform enables process modeling for FinFETs, 3D NAND Flash, BEOL, Nanowires, 3D-IC, FDSOI, DRAM, and other next generation processes. In addition it includes modeling performance enhancements, a new GUI for the process editor and adaptive incremental rebuild capabilities.
Coventor, Inc. is the market leader in automated design solutions for developing semiconductor process technology, as well as micro-electromechanical systems (MEMS). Coventor serves a worldwide customer base of integrated device manufacturers, memory suppliers, fabless design houses, independent foundries, and R&D organizations. Its SEMulator3D modeling and analysis platform is used for fast and accurate ‘virtual fabrication’ of advanced manufacturing processes, allowing engineers to understand manufacturing effects early in the development process and reduce time-consuming and costly silicon learning cycles. Its MEMS design solutions are used to develop MEMS-based products for automotive, aerospace, industrial, defense, and consumer electronics applications, including smart phones, tablets, and gaming systems. The company is headquartered in Cary, North Carolina and has offices in California’s Silicon Valley, Waltham, Massachusetts, and Paris, France. More information is available at https://www.coventor.com.
Coventor and SEMulator3D are registered trademarks of Coventor, Inc. All other trademarks are the property of their respective owners.
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