The European edition of MEMS Executive Congress strives to strengthen the global connection of the MEMS supply chain. This one day executive event features panels, keynote speakers, and a special dinner at ETH Zurich.
- 3D NAND: Challenges beyond 96-Layer Memory Arrays
- A Review of Silicon Photonics: Using Process Simulation to Design Silicon Photonics Devices
- Everything You Need to Know about FDSOI Technology – Advantages, Disadvantages, and Applications of FDSOI
- Practical Methods to Overcome the Challenges of 3D Logic Design