Survivor: Variation in the 3D Era – December 16, 2014 – San Francisco, CA

Location: “Carmel Room” at Hotel Nikko, San Francisco
Date: Tuesday, December 16, 2014
Time: 5:30pm -8:30pm (Cocktails and hors d’oeuvres)
6:00pm (Panel Begins)
RSVP by 12/10/14

Survivor: Variation in the 3D Era

It’s a jungle out there. The era of 3D semiconductors, 3D NAND Flash, FinFETS and unprecedented process complexity introduces new pitfalls for the cunning engineer to overcome. Find out how the best and the brightest are outwitting the competition with creative ways to navigate the treacherous landscape of advanced IC design and manufacturing. They know the key to survival in dealing with process variation is to …

Reduce It. Contain It. Understand it.

Join a group of rugged survivors at an interactive panel discussion, moderated by one of the original castaways from the IC island, Dan Nenni of SemiWiki, and featuring:

Rich Wise Lam Research
Jeffery Smith TEL America
Tomasz Brozek PDF Solutions
Tom Dillinger Oracle Corporation
Jan Hoentschel GlobalFoundries
David Fried Coventor

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