December 19, 2022

The Other Side of the Wafer: The Latest Developments in Backside Power Delivery

At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew […]
August 24, 2020

Understanding Advanced Packaging Technologies and Their Impact on the Next Generation of Electronics

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip, to encompassing a growing number of schemes for interconnecting multiple types of chips. […]